Submitted by Jean Medeiros (jeanletras@uepb.edu.br) on 2018-05-24T12:57:22Z No. of bitstreams: 1 PDF - Renata Italiano da Nóbrega Figueiredo.pdf: 23326888 bytes, checksum: 8f0f75d92f77a45b57d5db9a220d98be (MD5) / Approved for entry into archive by Secta BC (secta.csu.bc@uepb.edu.br) on 2018-06-05T11:34:10Z (GMT) No. of bitstreams: 1 PDF - Renata Italiano da Nóbrega Figueiredo.pdf: 23326888 bytes, checksum: 8f0f75d92f77a45b57d5db9a220d98be (MD5) / Made available in DSpace on 2018-06-05T11:34:10Z (GMT). No. of bitstreams: 1 PDF - Renata Italiano da Nóbrega Figueiredo.pdf: 23326888 bytes, checksum: 8f0f75d92f77a45b57d5db9a220d98be (MD5) Previous issue date: 2016-10-14 / Os ventiladores mecânicos pulmonares (VMP), são dispositivos utilizados frequentemente em unidades de terapia intensiva (UTI), para pacientes clinicamente críticos. Qualquer falha neste dispositivo pode representar risco para segurança do paciente, podendo proporcionar danos temporários ou permanentes. Desse modo, objetivou-se avaliar os dados sobre as causas de falhas dos ventiladores mecânicos pulmonares em hospitais regionais da Paraíba. Tratou-se de uma pesquisa retrospectiva, transversal, documental e descritiva, com abordagem quantitativa. A pesquisa foi realizada em hospitais regionais no estado da Paraíba. A amostra foi do tipo não probabilística por acessibilidade, constituído por 422 fichas e o universo foi constituído por fichas de reparo e manutenção preventiva de ventiladores mecânicos pulmonares (VMP) preenchidas entre os anos de 2012 a 2016 dos hospitais em questão. Foram utilizados os seguintes instrumentos para avaliação: ficha de categorização dos dispositivos e argumentação estruturada. Os dados obtidos foram expressos, descritivamente, em média, desvio padrão da média e porcentagem. A análise estatística foi feita através do programa IBM-SPSS versão 20.0. Este trabalho foi submetido ao Comitê de Ética em Pesquisa da Universidade Estadual da Paraíba sob o número 54007116.9.0000.5187. Nos resultados desta pesquisa, foi identificado falhas nos VMP, onde problemas de bateria, software, célula de oxigênio, calibração, teclado, display e válvulas foram as mais frequentes. Após a análise de falhas, constatou-se que intercorrências mecânicas que interferem na Fração Inspirada de Oxigênio (FiO2) estão diretamente relacionadas ao não fornecimento de gás (n= 18), vazamentos (n= 18), falha na ciclagem (n= 30), pane eletrônica (n= 25), entre outros. Problemas administrativos como subnotificação e um mal armazenamento de dados também foram encontrados. O resultado desta pesquisa pode oferecer subsídios para um melhor gerenciamento de risco, no desenvolvimento de protocolos assistenciais, em uma articulação sistêmica entre possíveis sinais de alertas e respectivas necessidades de intervenções administrativas juntamente com a engenharia clínica. / Pulmonary mechanical ventilators (VMP) are devices often used in intensive care units (ICU) for clinically critical patients. Any failure in this device may present a risk to patient safety and can provide temporary or permanent damage. Thus, it aimed to evaluate the data on the causes of failure of pulmonary mechanical ventilators in regional hospitals of Paraiba. This was a retrospective study, cross, documentary and descriptive, with quantitative approach. The survey was conducted in regional hospitals in the state of Paraiba. The sample was non probabilistic accessibility, consisting of 422 records and the universe consisted of repair records and preventive maintenance of pulmonary mechanical ventilators (VMP) filled between the years 2012-2016 of the hospitals in question. Categorization form of devices and structured argument: the following instruments for evaluation were used. Data were expressed descriptively as mean, standard deviation from the mean and percentage. Statistical analysis was performed using the IBM-SPSS version 20.0 program. This study was submitted to the Ethics Committee of the Paraíba State University under number 54007116.9.0000.5187. The results of this research, was identified flaws in the VMP where battery problems, software, oxygen cell calibration, keyboard, display and valves were the most frequent. After the failure analysis, it was found that mechanical complications that interfere with the inspired oxygen fraction (FiO2) are directly related to non-supply of gas (n = 18), leaks (n = 18), failure to cycling (n = 30), electronic part (n = 25), among others. Administrative problems such as underreporting and a data storage poorly were also found. The result of this research may provide insight for better risk management, development of care protocols, in a systemic link between possible signs of alerts and their needs administrative interventions with clinical engineering.

Recent improvements in manufacturing processes and materials properties associated with excellent mechanical characteristics and low weight have became composite materials very attractive for application on civil aircraft structures. However, even new designs are still very conservative, because the composite structure failure phenomena are very complex. Several failure criteria and theories have been developed to describe the damage process and how it evolves, but the solution of the problem is still open. Moreover, modern manufacturing processes, e.g. filament winding, have been used to produce a wide variety of structural shapes. Therefore, this work presents the development of a damage model and its application to simulate the progressive failure of flat composite laminates as well as for composite cylinders made by filament winding process. The proposed damage model has been implemented as a UMAT (User Material Subroutine) and VUMAT (User Material Subroutine for explicit simulations), which were linked to ABAQUSTM Finite Element (FE) commercial package. Progressive failure analyses have been carried out using FE Method in order to simulate the failure of filament wound composite structures under different quasi-static and impact loading conditions. In addition, experiments have been performed not only to identify parameters related to the material model but also to evaluate both the potentialities and the limitations of the proposed model. / As recentes melhorias nos processos de fabricação e nas propriedades dos materiais associadas a excelentes características mecânicas e baixo peso tornam os materiais compósitos muito atrativos para aplicação em estruturas aeronáuticas. No entanto, mesmo novos projetos, ainda são muito conservadores, pois os fenômenos de falha dos compósitos são muito complexos. Vários critérios e teorias de falha têm sido desenvolvidos para descrever o processo de dano e sua evolução, mas a solução do problema ainda está em aberto. Além disso, técnicas modernas de fabricação, como o enrolamento filamentar (filament winding) vêm sendo utilizadas para produzir uma ampla variedade de formas estruturais. Assim, este trabalho apresenta o desenvolvimento de um modelo de dano e a sua aplicação para simular a falha progressiva de estruturas planas e cilíndricas fabricadas em material compósito através do processo de filament winding. O modelo de dano proposto foi implementado como sub-rotinas em linguagem FORTRAN (UMAT-User Material Subroutine e, VUMAT-User Material Subroutine para simulações explícitas), que foram compiladas junto ao programa comercial de Elementos Finitos ABAQUSTM. Várias análises numéricas foram realizadas via elementos finitos, a fim de prever a falha dessas estruturas de material compósito sob diferentes condições de carregamentos quase-estáticos e de impacto. Além disso, vários ensaios experimentais foram realizados, a fim de identificar os parâmetros relacionados com o modelo de material, bem como avaliar as potencialidades e as limitações do modelo proposto.

Este trabalho apresenta uma abordagem da ferramenta FMEA, Failure modes and effect analysis, em uma integração com os custos relativos à qualidade, aplicada ao processo de soldagem GMAW, gas metal arc welding. O objetivo principal é evidenciar a importância da utilização desta ferramenta para se prever e prevenir falhas de processo antes que as mesmas ocorram, e minorar os custos da qualidade envolvidos. A proatividade da ferramenta FMEA proporciona, através das ações recomendadas de melhoria, a possibilidade de se mensurar com antecipação os custos relativos à prevenção, avaliação e falhas de qualidade. O método empregado para esta abordagem foi de uma pesquisa-ação, sendo estabelecida uma equipe multidisciplinar para implantação e execução da FMEA e avaliação dos custos da qualidade. Os resultados obtidos na fase anterior à aplicação da FMEA informavam que os custos das falhas apresentavam uma participação de 89,84% dos custos da qualidade; com a utilização da ferramenta, estes foram reduzidos para 3,82% devido ao investimento de melhoria. Objetivando-se equilibrar os custos associados, foi projetada uma estimativa futura de 50% de custo de falhas. Na análise comparativa dos custos da qualidade, foi verificado que os custos de falhas relativos à fase anterior ao FMEA reduziram 86% em relação à projeção futura, e os custos da qualidade reduziram de 74%, evidenciando-se deste modo o benefício da utilização da ferramenta FMEA para a redução de custos operacionais. / This paper presents an approach of the FMEA tool, Failure modes and effect analysis, in integration with the costs of quality, applied to the GMAW welding process, gas metal arc welding. The main objective is to highlight the importance of using this tool to predict and prevent process failures before they occur, and reduce the costs of quality involved. The proactivity of FMEA tool, provides through the recommended actions for improvement, the possibility to measure in advance the costs of prevention, assessment and quality failures. The method employed for this approach was an action research, which established a multidisciplinary team for deployment and implementation of FMEA and evaluation of quality costs. The results obtained in the previous phase to the implementation of FMEA reported that the cost of failure had a 89.84% share of the costs of quality; using the tool, these were reduced to 3.82% due to improved investment. In order to balance the costs, was projected a 50% estimated future cost of failures. In comparative cost analysis we founded that the quality failure costs related to the phase prior to FMEA reduced 86% compared to the projected future, and quality costs were reduced of 74%, demonstrating thereby the benefit of using the FMEA tool to reduce operating costs.

Este trabalho objetivou a caracterização mecânica e a análise de falha de dois tipos de juntas compósitas através de ensaios mecânicos, em que uma das juntas era composta por dois laminados de fibras de carbono recoberto em ambas as faces por tecido de fibra de vidro reforçando uma matriz termoplástica (PPS-C) unidos via soldagem por resistência elétrica, e a outra confeccionada com dois laminados de fibras de carbono reforçando uma matriz de resina epóxi (EPX-C) unidos via colagem por filme de resina epoxídica. Os dois tipos de juntas foram submetidos a impacto único transversal de 10 J, condicionamento higrotérmico, além de carregamento em fadiga compressiva no plano nas mais diversas combinações destes processos degradativos de suas propriedades mecânicas. Observou-se, que a junta termorrígida colada de EPX-C apresentou a maior resistência mecânica em flexão em quatro pontos (F4P) na condição original (como-manufaturada), assim como os maiores valores de resistência residual para as várias condições de degradação mecânica e higrotérmica a que foi submetida. Por sua vez, a junta termoplástica soldada de PPS-C exibiu, em termos percentuais, menores reduções dos valores de resistência à flexão sob as condições avaliadas, relativamente às perdas apresentadas pela junta EPX-C em idênticas circunstâncias. A análise macroscópica da superfície de fratura de ambas as juntas indicou que o modo de falha predominante da junta termorrígida foi interfacial enquanto que, para a junta PPS-C, o modo de falha predominante foi o intralaminar. Análises fratográficas através da microscopia eletrônica de varredura (MEV) evidenciaram para a junta termorrígida EPX-C, uma alta adesão entre fibra/matriz, porém uma relativamente fraca interação entre os aderentes (laminado) e o filme adesivo de colagem, enquanto que, para a junta termoplástica PPS-C, reduzidas interações fibra/matriz forem inferidas na camada externa de PPS-V do aderente assim como entre a malha metálica resistiva e os filmes puros de PPS que a revestiam. Em ensaios de resistência ao cisalhamento interlaminar (ILSS), os espécimes retirados da junta EPX-C na condição virgem evidenciaram uma colagem uniforme/homogênea, enquanto que, para a junta PPS-C, os espécimes de ensaio usinados a partir da junta virgem indicaram a ocorrência de efeitos de degradação térmica altamente localizada nas bordas soldadas. / This study aimed to mechanical characterization and failure analysis of two kinds of composite single-lap joints by mechanical tests, in which a single-lap joint was made of two adherents of carbon fibers coated on both sides with glass fiber fabric reinforcing a thermoplastic matrix (PPS-C) welded via resistance welding, and the another type made of two adherents of carbon fibers reinforcing an epoxy matrix (EPX-C) bonded by epoxy adhesive film. The two types of single-lap joints were subjected to single transverse impact of 10 J, hygrothermal conditioning, and compressive fatigue loading in the plane in various combinations of these degradative processes of mechanical properties. It was observed that the thermosetting bonded joint EPX-C showed the highest strength in four point-flexure test in the original condition (as-manufactured), as well as greater residual strength values for the various conditions of mechanical and hygrothermal degradation which was subjected. In turn, the welded thermoplastic joint PPS-C exhibited, in percentage terms, smaller reductions in flexural strength values under the tested conditions, in respect of losses showed by EPX-C in similar circumstances. Macroscopic analysis of the fracture surfaces from both joints indicated that the predominant failure mode was interfacial to thermosetting while for PPS-C joint, the predominant failure mode was intralaminar. Analysis of fracture surfaces by scanning electron microscopy (SEM) showed, for thermosetting joints EPX-C, a high adhesion between fiber/matrix, but a relatively weak interaction between adherents and the bonding adhesive film, whereas for thermoplastic joint PPS-C, reduced interactions fiber/matrix are inferred in the outer layers of PPS-V and between metal mesh and the pure PPS films that coated it. In the interlaminar shear strength tests (ILSS), the specimens removed from the EPX-C joint in the pristine condition showed a uniform/homogeneous bonding along the joint area, while for PPS-C joint, coupons extracted from pristine condition joint indicated the occurrence of degradation caused by thermal effects localized in the welded edges.

Orientadores: Marcelo Marotta Araújo, Roger William Fernandes Moreira / Dissertação (mestrado) - Universidade Estadual de Campinas, Faculdade de Odontologia de Piracicaba / Made available in DSpace on 2018-08-23T00:56:38Z (GMT). No. of bitstreams: 1 Moura_AndrezzaLauriade_M.pdf: 4155630 bytes, checksum: 44572134d9e31084a7892cb0866a1d79 (MD5) Previous issue date: 2013 / Resumo: O propósito no estudo foi avaliar comparativamente, através de teste de carregamento linear e análise fractográfica, duas marcas de material de fixação interna estável com dois métodos de fixação em fraturas simuladas em corpo de hemimandíbulas de alumínio. O trabalho foi dividido em dois grupos: Grupo I com duas estruturas de alumínio semelhantes à hemimandíbulas e fixação com duas placas de titânio de quatro furos do sistema 2,0mm, sendo uma placa na zona de compressão e outra zona de tensão, totalizando 20 placas de titânio; e grupo II, com duas estruturas de alumínio semelhantes à hemimandíbulas e fixação de uma placa de titânio de quatro furos do sistema 2,0mm na zona neutra de corpo de mandíbula, totalizando 10 placas de titânio. Testes de carregamento linear foram realizados por meio da máquina para ensaio universal mecânica Instron®, até a fratura do material. Após os testes, foram realizadas as análises fractográficas das superfícies de fratura dos materiais de fixação (grupos I e II) através de microscópio eletrônico de varredura FEI®, com o objetivo de analisar orientações, texturas e falhas dos materiais. Médias e desvio padrão das cargas e deslocamentos foram avaliados aplicando-se a Análise de Variância (ANOVA) two-way e teste de Tukey em nível de significância de 5%. Os resultados mostraram que o método de fixação com duas placas retas de quatro furos apresentou maior resistência à carga (p<0,01), quando comparado ao grupo de apenas uma placa de titânio na zona neutra mandibular. Ainda, a marca Traumec® apresentou maior resistência mecânica (p<0,01) quando utilizada no método com duas placas de fixação e a marca Tóride® (p<0,01) apresentou maior resistência as carga quando utilizada no método com apenas uma placa de fixação. A fractografia informou que todas as fraturas ocorreram por sobrecarga dúctil e micromecanismo alveolar / Abstract: The purpose of the study was to comparatively evaluate, through linear load test and fractographic analysis, two brands of stabel internal fixation in two methods of fixation in simulated body fractures in aluminium hemimandibules. The study was divided into two groups: Group I with two aluminum structures similar to hemimandibles for fixation of one 2,0mm miniplate in the compression zone and another one in tension zone, totaling 20 miniplates; and group II, with two aluminum structures similar to hemimandibles for fixation of one 2,0mm miniplate in the neutral zone of the mandible, totaling 10 miniplates. Mechanical tests were performed via mechanical universal testing machine Instron¿ until complete failure of the material. After the tests, fractography analysis of fractured surfaces were done in all materials (groups I and II) by a FEI¿ scanning electron microscopy, with the objective of analyzing orientation and textures of materials failures. Means and standard deviations of load and displacement were evaluated by applying the analysis of variance (ANOVA) two-way and the Tukey test at a significance level of 5%. The results showed that the method of fixation with two titanium plates with four holes showed higher resistance loads (p<0,01), when compared to only one titanium plate in the neutral zone of the mandible. Furthermore, the brand Traumec¿ showed higher mechanical strength (p<0,01) when used in the method with two fixing plates and the brand Toride¿ (p<0,01) showed a higher resistance to loads when used in the method with only one miniplate. The fractography reported that all fractures occurred in ductile overload and alveolar micromechanisms / Mestrado / Cirurgia e Traumatologia Buco-Maxilo-Faciais / Mestra em Clínica Odontológica

L'analyse de défaillances joue un rôle important dans l'amélioration des performances et de la fabrication des circuits intégrés. Des défaillances peuvent intervenir à tout moment dans la chaîne d'un produit, que ce soit au niveau conception, durant la qualification du produit, lors de la production, ou encore lors de son utilisation. Il est donc important d'étudier ces défauts dans le but d'améliorer la fiabilité des produits. De plus, avec l'augmentation de la densité et de la complexité des puces, il est de plus en plus difficile de localiser les défauts, et ce malgré l'amélioration des techniques d'analyses. Ce travail de thèse s'inscrit dans ce contexte et vise à étudier et développer une nouvelle technique d'analyse de défaillance basée sur l'étude de l'onde laser réfléchie le "Laser Voltage Imaging" (LVI) pour l'analyse de défaillance des technologies ultimes (inférieur à 45nm). / The Failure analysis plays an important role in the improvement of the performances and themanufacturing of integrated circuits. Defects can be present at any time in the product chain,during the conception (design), during the qualification, during the production, or still duringits use. It is important to study these defects in order to improve the reliability of the products.Furthermore, with the density increasing and the complexity of the chips, it is harder andharder to localize the defects. This thesis work consists to develop a new failure analysis technique based on the study of thereflected laser beam the "Laser Voltage Imaging" LVI, for the ultimate technologies (below45nm).

Les technologies VLSI (« Very large Scale Integration ») font partie de notre quotidien et nos besoins en miniaturisation sont croissants. La densification des transistors occasionne non seulement des difficultés à localiser les défauts dits « hard » apparaissant durant les phases de développement (débug) ou de vieillissement, mais aussi l’apparition de comportements non fonctionnels purs du composant liées à des défauts de conception. Les techniques abordées dans ce document sont destinées à sonder les circuits microélectroniques à l’aide d’un outil appelé émission de lumière dynamique (Time Resolved Imaging - TRI) à la recherche de comportements anormaux au niveau des timings et des patterns en jeu dans les structures. Afin d’aller plus loin, cet instrument permet également la visualisation thermographique en temps résolue de phénomènes thermiques transitoires au sein d’un composant. / VLSI ("Very Large Scale Integration") technologies are part of our daily lives and our miniaturization needs are increasing. The densification of transistors not only means trouble locating the so-called "hard defects" occurring during the development phases (debug) or aging, but also the appearance of pure non-functional behaviors related to component design flaws. Techniques discussed in this document are intended to probe the microelectronic circuits using a tool called dynamic light emission (Time Resolved Imaging - TRI) in search of abnormal behavior in terms of timings and patterns involved in structures. To go further, this instrument also allows viewing thermographic time resolved thermal transients within a component.

Dans ce travail, de nouveaux développements sur les techniques de localisation des composants électroniques en trois dimensions sont montrés. Ces développements sont réalisés grâce à l'introduction de simulations pour une technique déjà existante: la Microscopie Magnétique (MM). Dans la première partie, l'état de l'art de l'assemblage des nouveaux composants tridimensionnels est décrit. Il est ensuite suivi par une description du processus FA actuel, tout en le gardant aussi général que possible. Une description de la fiabilité des dispositifs, en fonction de leur temps d'utilisation est décrite, permettant au lecteur de comprendre pourquoi initialement l'Analyse de défaillance est apparue nécessaire. L'ensemble du processus d'analyse de défaillance est alors décrit de manière générale, à partir de la caractérisation électrique du défaut, jusqu'aux résultats finaux. Dans la deuxième partie est ensuite expliquée dans le détail la technique de microscopie magnétique, qui utilise les propriétés des champs magnétiques générés par les courants, et permet de localiser précisément les défauts des composants électroniques standards. La troisième partie de ce travail est consacrée à l'approche de simulation (SA): une nouvelle méthodologie développée pour étendre les capacités des techniques de microscopie magnétique. Le principe de base est de comparer la simulation magnétique générée par des hypothèses de distributions de courant aux acquisitions magnétiques de la distribution réelle. L'évaluation de la corrélation entre les deux donnera ensuite une mesure de la distance entre eux. Par ailleurs, cette approche est capable de surmonter les limitations de la technique: le défaut peut désormais être localisé en trois dimensions. Enfin, dans la quatrième partie, la nouvelle technique est appliquée et validé sur un ensemble de cas d'études. / In this work, new developments on localization techniques for three-dimensional electronic components are shown and demonstrated. These are performed through the introduction of simulations for an already existing technique: Magnetic Microscopy (MM). In the first part, a state of the art of new three-dimensional components assembly is described. It is then followed by an up to date FA process description, while keeping it as general as possible. A description of component reliability, in function of the time of usage of such devices is shown, allowing the reader to understand why the need for Failure Analysis arose in the first place. The whole process of Failure Analysis is then described in a general way, starting from the electrical characterization of the defect, to the final results. The second part then explains the Magnetic Microscopy technique in more detail. This technique uses the properties of the magnetic fields, which are generated by the currents, to precisely localize the defects in standard electronic components. The third part of this work is dedicated to the Simulation Approach (SA): a new methodology developed to extend the capabilities of Magnetic Microscopy techniques. The basic principle is that of comparing magnetic simulations generated by hypothetical current distributions to the magnetic acquisitions of the real current distribution. The evaluation of the correlation between the two then gives a measurement of the distance between them. This approach is able to overcome the previous limitations of the technique: the defect can now be localized in three dimensions. Finally, in the fourth part the new technique is applied and validated on a set of case studies.

Les approches basées sur la stimulation thermique laser restent largement privilégiées par rapport à la stimulation photoélectrique laser. Ceci est en partie du au fait que la stimulation thermique laser permet dans la plupart des cas de pointer directement le défaut cherché (bien souvent l’élément le plus sensible). Ce n’est pas forcément le cas en mode photoélectrique où de nombreuses structures sont sensibles bien qu’elles ne présentent aucune anomalie. Les techniques à base de stimulation photoélectrique laser statique sont donc peu employées. Un travail a ainsi été mené pour mieux appréhender les résultats obtenus dans le cadre de la stimulation photoélectrique laser statique, mais aussi et surtout pour évaluer le potentiel de cette technique pour des applications en laboratoire d’analyse de défaillance. Pour cela, dans un premier temps des explications ont été apportées sur l’interaction du laser photoélectrique avec les dispositifs élémentaires. La mise en application de techniques a ensuite été possible grâce au développement de méthodologies flexibles et adaptables à chaque cas d’étude, qui sont maintenant intégrées dans le flot d’analyse de défaillance. Enfin, les perspectives de la stimulation photoélectrique laser statique sont présentées, notamment les techniques qui ont été développées suite à l’évolution des technologies, ainsi qu’une étude originale révélant que le laser photoélectrique pourrait être utilisé comme outils de caractérisation électrique (fiabilité des oxydes) en plus de son utilisation traditionnelle dédiée à la localisation de défauts. / Thermal laser stimulation based approaches remain widely privileged compared to photoelectric laser stimulation ones. This is partly due to the fact that thermal laser stimulation allows in most of cases to directly highlight the looked default (often the most sensitive element). This is not necessarily the case in photoelectric mode where a lot of structures are sensitive although they do not present any anomaly. Consequently static photoelectric laser stimulation based techniques are not often used. A work has thus been led to better understand results obtained in the field of photoelectric laser stimulation, but also and overall to estimate the potential of this technique for failure analysis laboratory applications. For that, some explanations have first been brought about photoelectric laser interaction with elementary devices. The implementation of techniques has then been possible thanks to the development of flexible methodologies, adaptable to each study case, that are now integrated in the failure analysis flow. Finally, static photoelectric laser stimulation perspectives are presented, notably techniques that have been developed following technologies evolution, as well as an original study revealing that the photoelectric laser could be used as an electrical characterization tool (oxide reliability) in addition to its traditional use dedicated to default localization.

Face à la densité importante d’intégration des transistors et du nombre de niveau de métallisation, la localisation de défaut en analyse se fait principalement par la face arrière du composant. Cette analyse par la face arrière impose l’utilisation systématique de lentille à immersion solide et de la microscopie à balayage laser afin de limiter la contrainte de la résolution spatiale et de la sensibilité. Les objectifs sont de déterminer les dégradations induites par un laser 1340 nm continu sur la technologie 28FDSOI et de fournir un outil de simulation permettant de prédire la dose admissible par les transistors. L’étude commence par la reproduction et la caractérisation du défaut induit par le laser. Les résultats montrent principalement une diffusion des interconnexions grille-contacts en NiPtSi. Basé sur ces observations, un modèle de stimulation laser thermique est construit, puis testé sur une structure élémentaire. Les résultats montrent que la température peut atteindre des valeurs suffisamment élevées pour provoquer la diffusion du siliciure et expliquer les observations. Dans la dernière partie, le modèle est mis à l’épreuve sur des structures réelles. Le défaut est caractérisé paramétriquement en utilisant la cartographie de fréquence. Parallèlement, la simulation est appliquée sur ces mêmes structures. Les résultats montrent une bonne capacité du modèle à prédire le seuil de dégradation des transistors sous stimulation thermique laser. / Faced with the high density of integration of the transistors and the number of metallization level, fault localization in analysis is mainly done by the rear face of the component. This backside analysis requires the systematic use of solid immersion lenses and laser scanning microscopy to limit the stress of spatial resolution and sensitivity. The objectives are to determine the degradation induced by a continuous 1340 nm laser on the 28FDSOI technology and to provide a simulation tool for predicting the allowable dose by the transistors. The study begins with the reproduction and characterization of the laser-induced defect. The results mainly show a diffusion of grid-contact interconnections in NiPtSi. Based on these observations, a model of thermal laser stimulation is built and then tested on an elemental structure. The results show that the temperature can reach sufficiently high values to cause the diffusion of the silicide and to explain the observations. In the last part, the model is put to the test on real structures. The defect is characterized parametrically using frequency mapping. Simultaneously, the simulation is applied to these same structures faithfully. The results show a good ability of the model to predict the degradation threshold of the transistors under laser thermal stimulation.