The field of structural design optimization is one with great breadth and depth in many engineering applications. From the perspective of a designer, three distinct numerical methodologies may be employed. These include size, shape, and topology optimization, in which the ordering typically (but not always) corresponds to the order of increasing complexity and computational expense. This, of course, depends on the particular problem of interest and the selected numerical methods. The primary focus of this research employs density-based topology optimization with the goal of improving structural resistance to failure. Beginning with brittle fracture, two topology optimization based formulations are proposed in which low weight designs are achieved with substantially increased fracture resistance. In contrast to the majority of the current relevant literature which favors stress constraints with linear elastic physics, we explicitly simulate brittle fracture using the phase field method during the topology optimization procedure. In the second formulation, a direct comparison is made against results obtained using conventional stress-constrained topology optimization and the improved performance is numerically demonstrated. Multiple enhancements are proposed including a numerical efficiency gain based on the Schur-complement during the analytical sensitivity analysis and a new function which provides additional path information to the optimizer, making the gradient-based optimization problem more tractable in the presence of brittle fracture physics. Subsequently, design for ductile failure and buckling resistance is addressed and a numerically efficient topology optimization formulation is proposed which may provide significant design improvements when ductile materials are used and extreme loading situations are anticipated. The proposed scheme is examined regarding its impact on both the peak load carrying capacity of the structure and the amount of external work required to achieve this peak load, past which the structure may no longer be able to support any increase in the external force. The optimized structures are also subjected to a post-optimization verification step in which a large deformation phase field fracture model is used to numerically compare the performance of each design. Significant gains in structural strength and toughness are demonstrated using the proposed framework. Additionally, the failure behavior of 3D-printed polymer composites is investigated, both numerically and experimentally. A large deformation phase field fracture model is derived under the assumption of plane-stress for numerical efficiency. Experimental results are compared to numerical simulations for a composite system consisting of three stiff circular inclusions embedded into a soft matrix. In particular, we examine how geometric parameters, such as the distances between inclusions and the length of initial notches affect the failure pattern in the soft composites. It is shown that the mechanical performance of the system (e.g. strength and toughness) can be tuned through selection of the inclusion positions which offers useful insight for material design. Finally, a size optimization technique for a cardiovascular stent is proposed with application to a balloon expandable prosthetic heart valve intended for the pediatric population born with Congenital Heart Disease (CHD). Multiple open heart surgical procedures are typically required in order to replace the original diseased valve and subsequent prosthetic valves with those of larger diameter as the patient grows. Most expandable prosthetic heart valves currently in development to resolve this issue do not incorporate a corresponding expandable conduit that is typically required in a neonate without a sufficiently long Right Ventricular Outflow Tract (RVOT). Within the context of a particular design, a numerical methodology is proposed for designing a metallic stent incorporated into the conduit between layers of polymeric glue. A multiobjective optimization problem is solved, not only to resist the retractive forces of the glue layers, but also to ensure the durability of the stent both during expansion and while subject to the anticipated high cycle fatigue loading. It is demonstrated that the surrogate-based optimization strategy is effective for understanding the trade-offs between each performance metric and ultimately efficiently arriving at a single optimized design candidate. Finally, it is shown that the desired expandability of the device from 12mm to 16mm inner diameter is achievable, effectively eliminating at least one open heart surgical procedure for certain children born with CHD.

The present thesis deals with power transformers, oil and dry, their properties and structures, and subsequently faults that occur in oil transformers. First, the disorders discussed in general and then a comparison of individual samples transformer failures that have occurred in recent years in the Moravian-Silesian and Olomouc regions. Finally, I analyze the failures and the most common encountered, I suggested solutions to reduce their incidence.

L’amélioration des systèmes de conversion d’énergie rend les dispositifs à base de SiC très attractifs pour leur efficacité, compacité et robustesse. Cependant, leur comportement en réponse à un défaut de court-circuit doit être soigneusement étudié pour assurer la fiabilité des systèmes. Ce travail de recherche porte sur les problèmes de robustesse et de fiabilité du MOSFET SiC sous contraintes de court-circuit. Cette étude repose sur des caractérisations électriques et microstructurales. La somme de toutes les caractérisations avant, pendant et après les tests de robustesse ainsi que l’analyse microstructurale permet de définir des hypothèses sur l’origine physique de la défaillance pour ce type de composants. De plus, la mesure de la capacité est introduite au cours des tests de vieillissement en tant qu’indicateur de santé et outil clé pour remonter à l’origine physique du défaut. / The improvement of power conversion systems makes SiC devices very attractive for efficiency, compacity and robustness. However, their behavior in response to short circuit mode must be carefulli studied to ensure the reliability of systems. This research work deals with the SiC MOSFET robustness and reliability issues under short-circuit constraints. It is based upon electrical and microstructural characterizations. The sum of all the characterizations before, during and after the robustness tests as well as microstructural analysis allow to define hypotheses regarding the physical origin of failure of such components. Also, caoacitance measurement is introduced during aging tests as a health indicator and a key tool to go back to the physical origin of the defect.

Indiana University-Purdue University Indianapolis (IUPUI) / Multi-Protocol Label Switching (MPLS) is an emerging technology which is the initial step for the forthcoming generation of communication. It uses Labels in order to identify the packets unlike the conventional IP Routing Mechanism which uses the routing table at each router to route the packet. MPLS uses the techniques of FRR with the help of RSVP/CR-LDP to overcome the link and/or node failures in the network. On the other hand there are certain limitations/drawbacks of using the above mechanisms for Failure Detection and Recovery which are multiple protocols such as RSVP/CR-LDP over OSPF/IS-IS and complex algorithms to generate backup paths since each router works individually in order to create a backup tunnel. So to overcome the listed limitations, this paper discusses a new technique for MPLS Networks which is Source Routing \cite{48}. Source Routing is the technique in which the source plays the role of directing the packet to the destination and no other router plays the role of routing the packet in the network. Using the OPNET Modeler 17.5 tool for implementing source routing when there is a network failure is performed and the results are compared by implementing RSVP/CR-LDP over the same failed network. The comparative results show that the network performance is best in the case of Source Routing implementation as compared to the RSVP and CR-LDP signaling over the MPLS Networks.

Indiana University-Purdue University Indianapolis (IUPUI) / Lately numerous studies have been performed to design composite monocoques with high strength and low weight for various student level racing contests. The objective of this paper is to develop an insightful methodology to design and de veloped a light-weight composite monocoque. The monocoque is designed to pass the mandatory static load tests laid down by the International Automobile Feder ation (FIA)Formula 3. These Formula 3 tests are considered the baseline of the desired structural integrity of the composite monocoque. The presented design tech nique emphasises on a monocoque developed for Sports Car Club of America (SCCA) races. The three standard load tests performed on the monocoque are Survival Cell Side test, Fuel Tank test and Side Intrusion test. A sandwich layup of bi-directional woven carbon/epoxy prepreg and aluminium honeycomb is optimized for minimum weight while predicting the unknown properties of layup and ensuring the mono coque doesnt experience failure. The approach intends to achieve minimum weight with high torsional rigidity and is capable of being used for the design and analysis of any kind of formula type composite monocoque.

Focused Ion Beam (FIB) is an important analytical and sample modification technique in the field of electron and ion microscopy. It has been widely used in different kinds of applications including semiconductor device failure analysis, material science research, nanoscale 3D tomography, as well as microstructure prototyping and surface modification. Recent developments from the rapid growing industry and our frontier research have posted new challenges on the FIB technology itself. Higher resolution has been realized by state-of-the-art hardware infrastructures and less sample destruction has been achieved by efficient operation recipes. In this doctoral thesis, a study of advanced Focused Ion Beam sample preparation is presented, with the goal to prepare samples with low or no damage. The study is divided into two aspects according to various aspects in the FIB applications: sample damage and in-situ preparation. In the first aspect, sample damage, namely amorphization, ion implantation and FIB milling rate are investigated on crystalline silicon specimens with a gallium FIB tool. To study the ion-beam induced amorphous layer thickness under certain conditions, silicon specimens were prepared by FIB into specific geometry, so that the induced amorphous layer can be imaged and the thickness can be determined quantitatively using Transmission Electron Microscopy (TEM). Atom Probe Tomography (APT) was carried out to study the implanted ion concentration of gallium FIB prepared silicon specimens. In addition, the gallium FIB milling rate was also studied for a silicon substrate using Scanning Electron Microscopy (SEM). These experimental results provide detailed information of beam-sample interactions from the FIB sample preparation. In order to gain a systematic understanding of the processes, as well as to be able to predict the outcome of a specific FIB recipe, a physics model and an adapted algorithm (TRIDYN) based on Binary Collision Approximation (BCA) were used for the simulation of FIB processes. The predicted results based on simulations were compared with experiments. The proposed model was successfully validated by the experimental results, i.e., the TRIDYN algorithm has the capability to provide predictions for the multi- step FIB sample preparation process and the respective recipes. The other aspect involves a novel design of a hardware configuration of a SEM/FIB system add-on to perform in-situ surface modification tasks such as argon ion polishing of specimens. This Beam Induced Polishing System (BIPS) overcomes the disadvantages that some of the ex-situ methods have, and it completes some of the advanced FIB recipes for extremely thin and pristine specimens. In the thesis, the functionality of a BIPS system is explained in detail, and first experimental results are shown to demonstrate the proof of concept of the system. To summarize, this doctoral thesis presents an adapted algorithm, which is validated by experiments, to simulate the multi-step Focused Ion Beam process for recipes of low- damage sample preparation; A novel in-situ experiment system BIPS is also introduced, providing an option to complement SEM/FIB systems for advanced FIB sample preparation recipes.

Ce travail s'intègre dans les domaines de l'analyse et de la prédiction de la fiabilité des assemblages Multi-Chip Module. Il présente l'étude de fiabilité de microcâblages filaires (wire bonding) en très haute température à partir d'essais de vieillissement et d'analyses expérimentales. Les résultats permettent d'identifier les mécanismes de dégradation et d'évaluer les températures limites d'utilisation de ces interconnexions. Il développe une étude du comportement thermomécanique des joints collés à partir d'essais de caractérisation mécanique, d'essais de vieillissement accéléré et de simulations numériques par éléments finis. Ces méthodes permettent d'évaluer la criticité des assemblages dès la phase de conception. / This work is performed in analysis and prediction areas of Multi-Chip Module package reliability. It presents a reliability study on wire bonding in high temperature environment from aging tests and experimental analyzes. Results permit to identify degradation mechanisms and evaluate temperature limits of these interconnections. It develops a study of the thermomechanical behavior of adhesive joints from mechanical characterization tests, accelerated aging tests and finite element simulations. These methods are used to assess the criticality of packages from the design phase.

Este trabalho visa determinar a razão de carga cíclica R através da medida, na superficie de fratura, da relação entre a largura inter-estrias (s) e a altura da estria (H). É de conhecimento que o espaçamento (s) se correlaciona com a taxa de crescimento da trinca da/dN, enquanto que a curva da/dN x &#916K depende da razão de carga R. Para esta avaliação, corpos de prova do tipo compacto C(T) foram extraídos na orientação LT do centro de uma placa laminada da liga de alumínio SAE-AMS 7475 T7351 para realização dos ensaios de propagação de trinca por fadiga. Estes ensaios foram realizados de duas formas diferentes. A primeira, para obtenção de dados relativos à região II da curva da/dN x &#916K, sendo, neste caso, utilizadas quatro diferentes razões de carga (R=O,1; R=0,3; R=0,5; R=0,7). No outro caso, os ensaios de fadiga foram realizados sob &#916K constante e utilizados os mesmos quatro níveis de razão de carregamento R para determinação da curva da/dN x &#916K constante. Os níveis de &#916K aplicados foram tomados na região de Paris da curva da/dN x &#916K. A análise fratográfica por microscopia eletrônica foi conduzida nas superfícies dos corpos de prova do ensaio de fadiga com &#916K constante. Isto foi feito para determinar os espaçamentos inter-estria (s) e a altura H das estrias para cada nível de &#916K aplicado. Observou-se que a taxa de crescimento da trinca (da/dN) e o espaçamento inter-estrias (s) sofrem influência direta com a variação do fator de intensidade de tensão (&#916K), entretanto, observou-se, também, que a relação de proporcionalidade de 1:1 entre eles somente é válida para níveis de da/dN variando entre 0,1 a 1 &#956/ciclo. Os valores da morfologia da estrias (H/s) sofrem influência significativa com o aumento da razão de carga R, entretanto, ficou evidenciado que o fator de intensidade de tensão máxima Kmáx. não tem influência nesta relação. Evidenciou-se que a largura da estria corresponde à taxa de crescimento da trinca (da/dN), e que a relação entre a altura e o espaçamento da estria (H/s) possui uma correspondência direta com a razão de carga R, que tem influência significativa sobre a propagação de trinca por fadiga. / This work aims at to method to determine the load ratio R through of measure, on the fractured of surfaces the relation between the width striation spacing (s) and the height of the striation (H). It is of knowledge that the spacing (s), if correlates with the fatigue crack growth rates da/dN, whereas the curve da/dN x &#916K depends on the load ratio R. For this evaluation compact tension C(T) specimens had been extracted in the L- T orientation of a laminate plate of the aluminum alloy SAE-AMS 7475 T7351.These test had been carried out of two different forms. The first one, for attainment of relative data to region II of the curve da/dN x &#916K, being, in this in case that used four different load ratios (R=O,1; R=0,3; R=0,5; R=0,7). In the other in case that, the fatigue crack growth rates had been carried out under &#916K constant and used same the four levels of load ratios R for determination of the curve of constant da/dN x &#916K. The applied levels of &#916K had been taken in the region II of the curve da/dN x &#916K. The fractographic analysis for electronic microscopy was lead on the surfaces of the specimens tested in fatigue with constant &#916K. This was made to determine the striation spacing (s) and height (H) of the striations for each constant level of &#916K. It was observed that the fatigue crack growth rates (da/dN) and the striation spacing (s) suffers direct influence with the variation of &#916K. Also, was observed that the relation of proportionality of 1:1 between them is only valid for levels of da/dN in the range of 0,1 to 1,0 mm/cycle. The values of the relationship of the striation dimensions (H/s) suffer significant influence with the increasing of load ratios R. However, were evidenced that the value of Kmax. does not have influence in this relationship. It was found that the width of the striation corresponds to the value of (da/dN) and that the relation between the height and the striation of spacing (H/s) had a direct correspondence with the load ratios R that has signifficant effect on the fatigue crack growth rates.

The mevalonate pathway is an important biosynthetic pathway, found in all cells of virtually all known pro- as well as eukaryotic organisms. This thesis is an investigation into the use of two drugs, originally developed for different applications, but both affecting the mevalonate pathway, in to models of fracture repair. Using two different rodent models of fracture repair, a commonly used cholesterol lowering drug (statin) and two drugs used to treat osteoporosis (bisphosphonate) were applied both systemically as well as locally in order to enhance fracture repair. Papers I and II investigate the potential of simvastatin to improve the healing of femoral fractures in mice. Papers III and IV explore the use of two bisphosphonates to improve early fixation of stainless steel screws into rat bone. The statin simvastatin lead to an increased strength of the healing cellus. The application of bisphosphonates increased early screw fixation. It seems clear that both drugs have uses in orthopaedic applications. One interesting avenue of further research would be to combine the two classes of drugs and see if we can get the benefits while at the same time diminishing the drawbacks.

In dieser Arbeit wurde eine neue fehleranalytische Methode zur industriellen Anwendung an neuen Technologien der Aufbau- und Verbindungstechnik entwickelt. Das Verfahren basiert auf der Wechselwirkung von thermischen Wellen und Defekten. Die Besonderheit ist dabei die Zerstörungsfreiheit, die Geschwindigkeit, das Auflösungsvermögen und die durch neueste IR-Detektoren erreichte Temperaturempfindlichkeit. Es wurden grundlegende Studien bezüglich Auflösung und parasitären Effekten bei der Anwendung unter industriellen Randbedingungen durchgeführt. Dabei wurde eine systematische Vorgehensweise bezüglich der Komplexität gewählt. Dies ermöglicht nun u.a. eine Vorhersage der zu erwartenden Prüfdauer zur Auflösung vergrabener Defekte, der Begrenzung der maximalen Anregungsimpulsbreite (bei gegebener Defekttiefe) und die quantitative Ermittlung des Einflusses einer Lackschicht. Methodisch kamen grundsätzlich Simulationen und vergleichende Experimente zum Einsatz. Es wurden spezielle Proben zur Isolierung und Klärung parasitärer Effekte verwendet. Letztlich konnte das Messsystem erfolgreich an industriellen Problemstellung demonstriert werden. Das entwickelte Messsystem zeichnet sich durch hohe Flexibilität aus. Verschiedene problemangepasste Anregungsquellen (interne und externe Anregung durch zahlreiche physikalische Effekte) kommen zum Einsatz. Das Messsystem besteht aus vier Hauptmodulen, der Differenzbild-Methode, der Impulsthermografie, und zwei Varianten der LockIn-Thermografie. Zusammen ist das System in der Lage, Voids, Delaminationen und Risse in verschiedenen Bereichen auch der modernen AVT sicher zu erkennen. Es werden dabei Temperaturauflösugnen bis zu 5 mK und laterale Auflösungen bis 17 µm erreicht. Diese Arbeit legt einen Grundstein für die Anwendung der thermischen Fehleranalytik in der Industrie, indem hier die Grenzen der IR-Messtechnik aufgezeigt und charakterisiert werden. / In this work a new failure analytical method for the industrial application of new technologies in electronic packaging has been developed. The developed method is based on the interaction of the thermal waves and defects. The special fature is non-destructive, speed, resolution and high temperature sensitivity due to latest IR-detectors. It fundamental studies regarding resolution and parasitic effects in the application were carried out cinsidering industrial conditions. Here, a systematic approach regarding the complexity has been selected. This now enables a prediction of the expected test period for detecting buried defects, limits for excitation pulse width (for a given defect depth) and the quantitative determination of the influence of parasitic paints. Methodically always simulations and comparative experiments were used. Simple samples for the isolation and purification of parasitic effects has been used. Finally, the measurement system has been successfully demonstrated on an industrial applications. The developed measurement system is characterized by high flexibility. Different problem-adapted excitation sources (internal and external excitation by numerous physical effects) are used. The measurement system currently consists of four main modules, the difference image method, the pulse thermography, and two variants of LockIn-thermography. Together, the system is capable of detecting voids, delaminations and cracks in various fields of electronic packageing. It will reach temperature resolutions up to 5 mK and lateral resolutions down to 17 µm. This work stes a foundation for the application of thermal failure analysis for industry by showing and charcterization the limits of IR imaging.