Neste trabalho é apresentada a análise de técnicas para a integração de ISFETs (Ion Selective Field Effect Transitors), através do método de montagem por viragem (Flip-chip) usando pasta de solda livre de chumbo e epóxi condutivo de prata, com o objetivo de permitir sua aplicação em Microssistemas de Análise Total (µTAS). Para os testes de integração foram construídas estruturas em dois substratos, o FR-4, pelo método de ligação por fios (wire bonding), e o LTCC, que pode ser aplicado na construção de µTAS. Como os terminais de contato do ISFET tem seu acabamento superficial em alumínio não é possível realizar a montagem por viragem utilizando equipamentos SMT, sendo necessários processos intermediários. Dois processos que permitem o uso de equipamentos SMT foram aplicados: a remetalização, onde camadas de níquel e ouro são depositadas sobre o alumínio do terminal de contato, através do banho químico eletrolítico sem eletrodo (Electroless), e protuberâncias de solda (stud ou ball bumps), que são ligadas ao alumínio do terminal de contato pelo processo conhecido como Stud Ball Bumping (SBB). Na integração do ISFET foi feita a selagem dos terminais de contato e a abertura de uma janela que permite o contato da área ativa (região de porta) do ISFET com as soluções a serem analisadas. A selagem dos terminais de contato foi feita com o fotoresiste SU-8, e a abertura da área ativa foi feita diretamente sobre os substratos de FR-4 e LTCC. Ambos processos apresentaram soldabilidade com a pasta de solda apresentando ponto de refusão em torno de 250°C, indicando que equipamentos SMT podem ser aplicados na montagem por viragem. Verificou-se que o epóxi condutivo de prata foi curado a 100°C por uma hora e também pode ser aplicado na integração do ISFET. Por fim o SU-8 usado na selagem apresentou uma boa adesão aos substratos de FR-4 e LTCC, sendo curado na mesma etapa térmica da pasta de solda e/ou epóxi condutivo de prata ou após estes processos a 150°C por trinta minutos. / In this work is shown the analysis of integration techniques of ISFET (Ion Selective Field Effect Transitor) through the Flip-chip method using lead-free solder paste and silver conductive epoxy, in order to allow its application in Micro Total Analysis System (µTAS). For integration tests two substrates have been made, the FR-4, as already used in the integration of the ISFET, but assembled through wire bonding method, and the LTCC that can be applied in the construction of µTAS. As the ISFET bonding pads has its surface finish in aluminum is not possible assembly through flip-chip method using SMT equipments, requiring intermediate processes. Two process that allow the use of SMT equipment were applied: the remetallization, where nickel and gold layers are deposited on the aluminum bonding pads, through the Electroless chemical baths, and stud or ball bumps, which are connected to bonding pads of aluminum by the process known as Stud Ball Bumping (SBB). In the ISFET integration should be made a seal in the bonding pads and a window that allows the contact of the active area (gate region) of ISFET with the solutions to be analyzed. The sealing of the bonding pads has been made with the photoresist SU-8 and the window of active area were made directly on the FR-4 and LTCC substrates. Both processes presented the solderability with the solder paste reflowed at 250°C, indicating that SMT equipments may be applied to the assembly through flip-chip method, the silver conductive epoxy was cured at 100°C for one hour and can also be applied in ISFET integration. Finally the SU-8 used to sealing have showed a good adherence to the FR-4 and LTCC substrates, being cured in the same thermal step of solder paste and/or silver conductive epoxy or after these processes at 150°C for thirty minutes.

Neste trabalho é apresentada a análise de técnicas para a integração de ISFETs (Ion Selective Field Effect Transitors), através do método de montagem por viragem (Flip-chip) usando pasta de solda livre de chumbo e epóxi condutivo de prata, com o objetivo de permitir sua aplicação em Microssistemas de Análise Total (µTAS). Para os testes de integração foram construídas estruturas em dois substratos, o FR-4, pelo método de ligação por fios (wire bonding), e o LTCC, que pode ser aplicado na construção de µTAS. Como os terminais de contato do ISFET tem seu acabamento superficial em alumínio não é possível realizar a montagem por viragem utilizando equipamentos SMT, sendo necessários processos intermediários. Dois processos que permitem o uso de equipamentos SMT foram aplicados: a remetalização, onde camadas de níquel e ouro são depositadas sobre o alumínio do terminal de contato, através do banho químico eletrolítico sem eletrodo (Electroless), e protuberâncias de solda (stud ou ball bumps), que são ligadas ao alumínio do terminal de contato pelo processo conhecido como Stud Ball Bumping (SBB). Na integração do ISFET foi feita a selagem dos terminais de contato e a abertura de uma janela que permite o contato da área ativa (região de porta) do ISFET com as soluções a serem analisadas. A selagem dos terminais de contato foi feita com o fotoresiste SU-8, e a abertura da área ativa foi feita diretamente sobre os substratos de FR-4 e LTCC. Ambos processos apresentaram soldabilidade com a pasta de solda apresentando ponto de refusão em torno de 250°C, indicando que equipamentos SMT podem ser aplicados na montagem por viragem. Verificou-se que o epóxi condutivo de prata foi curado a 100°C por uma hora e também pode ser aplicado na integração do ISFET. Por fim o SU-8 usado na selagem apresentou uma boa adesão aos substratos de FR-4 e LTCC, sendo curado na mesma etapa térmica da pasta de solda e/ou epóxi condutivo de prata ou após estes processos a 150°C por trinta minutos. / In this work is shown the analysis of integration techniques of ISFET (Ion Selective Field Effect Transitor) through the Flip-chip method using lead-free solder paste and silver conductive epoxy, in order to allow its application in Micro Total Analysis System (µTAS). For integration tests two substrates have been made, the FR-4, as already used in the integration of the ISFET, but assembled through wire bonding method, and the LTCC that can be applied in the construction of µTAS. As the ISFET bonding pads has its surface finish in aluminum is not possible assembly through flip-chip method using SMT equipments, requiring intermediate processes. Two process that allow the use of SMT equipment were applied: the remetallization, where nickel and gold layers are deposited on the aluminum bonding pads, through the Electroless chemical baths, and stud or ball bumps, which are connected to bonding pads of aluminum by the process known as Stud Ball Bumping (SBB). In the ISFET integration should be made a seal in the bonding pads and a window that allows the contact of the active area (gate region) of ISFET with the solutions to be analyzed. The sealing of the bonding pads has been made with the photoresist SU-8 and the window of active area were made directly on the FR-4 and LTCC substrates. Both processes presented the solderability with the solder paste reflowed at 250°C, indicating that SMT equipments may be applied to the assembly through flip-chip method, the silver conductive epoxy was cured at 100°C for one hour and can also be applied in ISFET integration. Finally the SU-8 used to sealing have showed a good adherence to the FR-4 and LTCC substrates, being cured in the same thermal step of solder paste and/or silver conductive epoxy or after these processes at 150°C for thirty minutes.

When paraffin wax melts it exhibits a large, relatively incompressible volume expansion. This can be used in microactuators for strong and large displacements, a rare combination among actuators. Furthermore, paraffin is inexpensive, inert and environmentally friendly, as well as easily processed and actuated. Together, these properties give paraffin actuators great potential for use in both low-cost and high-performance applications. In microfluidics, the miniaturization of various analysis systems decreases the volumes of samples and reagents needed, as well as the analysis throughput time. Using on-chip micropumps increases the efficiency of the microfluidic system, but a challenge for such pumps is the high back-pressure associated with separation, filtration or narrower channels. The objective of this thesis is to increase the understanding of paraffin in microactuators, as well as to further explore its possibilities and limitations. The main application area has been on-chip micropumps. For low-cost applications, actuators, pumps and dispensers have been fabricated in plastics and then evaluated. The dispenser is intended for on-chip storage and dispensing of liquids in a lab-on-a-chip that could be used in, e.g., point-of-care testing (POCT). For high-performance applications, metallic actuators, pumps and dispensers have been accomplished. The micropump is the world’s strongest mechanical micropump in sub-cubic centimetre size, capable of pressures of above 5 MPa. Possible applications are strong microhydraulics, on-chip chromatography, or medical microdosage systems. A limitation of paraffin is the relatively slow thermal actuation. In this thesis the thermal properties have also been turned into an advantage: Directional solidification is used to accomplish multiple stable states of the actuator displacement, withheld without any power consumption. For the future, the high-pressure capability may be improved by new designs. Optimization of speed and power consumption can be made by further work on modelling as well as on drive and control of the heating.

<p>There is a strong trend in fabricating <i>miniaturized total analytical systems</i>, µTAS, for various biochemical and cell biology applications. These miniaturized systems could e.g. gain better separation performances, be faster, consume less expensive reagents and be used for studies that are difficult to access in the macro world. Disposable µTAS eliminate the risk of carry-over and can be fabricated to a low cost.</p><p>This work focused on the development of µTAS modules with the intentional use for miniaturized diagnostics. Modules for blood separation, desalting, enrichment, separation and ESI-MS detection were successfully fabricated. Surface coatings were additionally developed and evaluated for applications in µTAS with complex biological samples. The first heparin coating could be easily immobilized in a one-step-process, whereas the second heparin coating was aimed to form a hydrophilic surface that was able to draw blood or plasma samples into a microfluidic system by capillary forces. </p><p>The last mentioned heparin surface was further utilized when developing a chip-based sensor for performing CD4-count in human blood, an important marker to determine the stage of an HIV-infection.</p><p>All devices in this work were fabricated in PDMS, an elastomeric polymer with the advantage of rapid and less expensive prototyping of the microfabricated master. It was shown that PDMS could be considered as the material of choice for future commercial µTAS. The devices were intentionally produced using a low grade of fabrication complexity. It was however demonstrated that even with low complexity, it is possible to integrate several functional chip modules into a single microfluidic device.</p>

There is a strong trend in fabricating miniaturized total analytical systems, µTAS, for various biochemical and cell biology applications. These miniaturized systems could e.g. gain better separation performances, be faster, consume less expensive reagents and be used for studies that are difficult to access in the macro world. Disposable µTAS eliminate the risk of carry-over and can be fabricated to a low cost. This work focused on the development of µTAS modules with the intentional use for miniaturized diagnostics. Modules for blood separation, desalting, enrichment, separation and ESI-MS detection were successfully fabricated. Surface coatings were additionally developed and evaluated for applications in µTAS with complex biological samples. The first heparin coating could be easily immobilized in a one-step-process, whereas the second heparin coating was aimed to form a hydrophilic surface that was able to draw blood or plasma samples into a microfluidic system by capillary forces. The last mentioned heparin surface was further utilized when developing a chip-based sensor for performing CD4-count in human blood, an important marker to determine the stage of an HIV-infection. All devices in this work were fabricated in PDMS, an elastomeric polymer with the advantage of rapid and less expensive prototyping of the microfabricated master. It was shown that PDMS could be considered as the material of choice for future commercial µTAS. The devices were intentionally produced using a low grade of fabrication complexity. It was however demonstrated that even with low complexity, it is possible to integrate several functional chip modules into a single microfluidic device.

This thesis summarises work towards a Lab-on-Chip (LOC). The request for faster and more efficient chemical and biological analysis is the motivation behind the development of the LOC-concept. Microfluidic devices tend to become increasingly complex in order to include, e.g. sample delivery, manipulation, and detection, in one chip. The urge for smart and simple design of robust and low-cost microdevices is addressed and discussed. Design, fabrication and characterization of such microdevices have been demonstrated using low-cost polymer and glass microfabrication methods. The manufacturing is feasible, to a large extent, to perform outside the clean-room, and has subsequently been the chosen technique for most of the work. Issues of bonding reliability are solved by using polymer adhesive tapes. A planar electrocapture device with LOC-compatibility is demonstrated where beads are immobilised and released in a flowing stream. Retention of nanoparticles by means of electric field-flow fractionation using transparent indium tin oxide electrodes is presented. Moreover, a cast PDMS 4-way crossing is enabling a combination of liquid chromatography and capillary electrophoresis to enhance separation efficiency. Sample transport issues and a new flow-cell design in a quartz crystal microbalance bioanalyzer are also investigated. Fast bacteria counting by impedance measurements, much requested by the pharmaceutical industry for biomass monitoring, is carried out successfully. In conclusion, knowledge in micro system technology to build microdevices have been utilised to manipulate and characterise beads and cells, taking one step further towards viable Lab-on-Chip instruments.