Diss.--Berlin--Freie Univ., 1983. / Bibliogr. p. 429-436.

<p>Detta examensarbete gick ut på att försöka hitta ett sätt att mäta kompo nentkänslighet hos parameteriserbara aktiva vågfilter. Två olika ansatser har gjorts, men bara ett försök har avslutats. </p><p>Det första försöket behandlar möjligheten att realisera ett vågfilter med hjälp av standardkomponenter i en kretskortslösning. Detta fungerade inte beroende på att nödvändiga komponenter inte finns på marknaden idag. Komponenterna som finns har för stora parasitkapacitanser. Dessa oönskade parasiter var så stora att de skulle kunna förstöra funktionen och det var således inte värt att fortsätta försöket. De komponenter som undersöktes var resistansstegar och digitala potentiometrar. Den största delen av studierna till det första försöket har bestått i att studera datablad från olika kretstillverkare för att hitta lämpliga komponenter. </p><p>Istället startades ett nytt försök som syftade till att undersöka möjligheten att implementera ett aktivt vågfilter i en integrerad krets. I denna rapport presenteras en förstudie till hur en sådan lösning skulle kunna se ut. För att möjliggöra en fortsättning där mitt examensarbete tar slut har arbetet förklarats ingående. Jag har också inkluderat min programkod som bilagor i slutet av rapporten.</p> / <p>The purpose of this thesis was to find a way of measuring the sensitivity of component values for parameterized wave active filters. Two different approaches were made, but only one was finished. </p><p>The first approach is about the possibility of making a wave active filter with standard components on a printed circuit board. This did not work though, because of a scarce market of possible components. The compo-nents existing today have too high parasite capacitances. These unwanted parasites are so large in value that they could destroy the functionality and it was therefore not worth continuing the attempt. The components that were investigated as possible on the board were ladder networks and digitally controlled potentiometers. The main part of the studies for the first attempt was to read data sheets from different electronic companies trying to find possible components. </p><p>Instead a new approach was made with the purpose of investigating the possibility of making a wave active filter as an integrated circuit. In this report a pilot study for such an attempt is presented. To make it possible to continue work where these studies end, the work has been carefully explained. I have also included the computer programs I have made in the appendix of the report.</p>

Detta examensarbete gick ut på att försöka hitta ett sätt att mäta kompo nentkänslighet hos parameteriserbara aktiva vågfilter. Två olika ansatser har gjorts, men bara ett försök har avslutats. Det första försöket behandlar möjligheten att realisera ett vågfilter med hjälp av standardkomponenter i en kretskortslösning. Detta fungerade inte beroende på att nödvändiga komponenter inte finns på marknaden idag. Komponenterna som finns har för stora parasitkapacitanser. Dessa oönskade parasiter var så stora att de skulle kunna förstöra funktionen och det var således inte värt att fortsätta försöket. De komponenter som undersöktes var resistansstegar och digitala potentiometrar. Den största delen av studierna till det första försöket har bestått i att studera datablad från olika kretstillverkare för att hitta lämpliga komponenter. Istället startades ett nytt försök som syftade till att undersöka möjligheten att implementera ett aktivt vågfilter i en integrerad krets. I denna rapport presenteras en förstudie till hur en sådan lösning skulle kunna se ut. För att möjliggöra en fortsättning där mitt examensarbete tar slut har arbetet förklarats ingående. Jag har också inkluderat min programkod som bilagor i slutet av rapporten. / The purpose of this thesis was to find a way of measuring the sensitivity of component values for parameterized wave active filters. Two different approaches were made, but only one was finished. The first approach is about the possibility of making a wave active filter with standard components on a printed circuit board. This did not work though, because of a scarce market of possible components. The compo-nents existing today have too high parasite capacitances. These unwanted parasites are so large in value that they could destroy the functionality and it was therefore not worth continuing the attempt. The components that were investigated as possible on the board were ladder networks and digitally controlled potentiometers. The main part of the studies for the first attempt was to read data sheets from different electronic companies trying to find possible components. Instead a new approach was made with the purpose of investigating the possibility of making a wave active filter as an integrated circuit. In this report a pilot study for such an attempt is presented. To make it possible to continue work where these studies end, the work has been carefully explained. I have also included the computer programs I have made in the appendix of the report.

This diploma thesis deals with the application of three methods to limit resonances of critical frequencies and with a description of their influence on speed control loop of linear drive. The first damping method involved the use of an electro-magnetic tilger attached to the structure of stand on critical locations. The second method involved the use of a jerk decoupling in linear direct drives. A Cauer-filter that was activated in the controller of linear motor was added to both methods. The appropriate measuring technique for these frequencies was systematically analysed and selected. Further in this document models of mechanical structure and controlling are described. Matlab®/Simulink® software was used for the data processing and the modification of models according to the real structure.

Les travaux présentés dans cette thèse se focalisent sur l'étude de l’effet de dégradations des composants de puissance, plus particulièrement au niveau de l’environnement proche des puces (métallisations, connexions, brasures puces/DCB), sur le comportement électrique et thermique des puces ainsi que de leur assemblage. Pour ce faire nous avons cherché à étudier la répartition des courants et des températures à la surface de la puce à l’aide d’un modèle électrothermique 2D distribué. Nous avons aussi évalué l’effet de la dégradation des brasures dans le volume de l’assemblage, à l’aide cette fois d’un modèle thermique relié à la constitution de l’assemblage. La première partie de cette thèse consiste à mettre en place un modèle électrothermique distribué de puce MOSFET, qui tient compte à la fois du caractère distribué de la dissipation de la puissance et du couplage électrothermique en régime transitoire. Ce modèle électrothermique s’appuie sur un modèle électrique aux variables d’états et un modèle thermique par éléments finis couplé au modèle électrique. Les modèles électriques et thermiques ont été développés respectivement sous Matlab et sous CAST3M, et le couplage des deux modèles a été fait sous Simulink. Dans une deuxième partie, pour la validation des résultats des températures et pour l’analyse de l’effet du vieillissement et des dégradations (sur la distribution et la dynamique de température de la surface supérieure de la puce), une méthodologie de mesure rapide de température et un banc expérimental pour thermographie infrarouge ont été mis en place. Les difficultés rencontrées lors des mesures thermiques IR sous variation rapide de la température nous ont poussé à envisager d’autres méthodes d’analyse thermique. Enfin, nous avons cherché à évaluer la réponse impulsionnelle du composant testé en estimant, par des simulations thermiques, la fonction de transfert dans le domaine fréquentiel à l’aide du logiciel COMSOL Multiphysics. Nous avons également étudié la pertinence de modèles RC équivalents (réseau RC de Cauer). Ces modèles ont ensuite été utilisés pour rendre compte de différents modes de dégradation notamment cette fois au niveau des couches de brasures entre puce et DCB et entre DCB et semelle. Mots clef : Modules de puissance à semi-conducteur, Vieillissement, Métallisation, Modélisation électrothermique, Court-circuit, Distribution de courant et de température, Problème inverse, Caméra IR, Réseaux de Cauer. / The work presented in this thesis focus on the study of the effect of degradation of power components, especially at the near environment of chips (metallization, connections, solder chips / DCB), on the electrical and thermal behavior of the chips and their assembly. As a consequence, we studied the distribution of currents and temperatures on the chip surface with a 2D electrothermal distributed model. We also evaluated the effect of solder degradation in the volume of the assembly. Firstly, we developed an electrothermal distributed model of the MOSFET chip, which takes into account both the distributed power dissipation and the electrothermal coupling transient. This electrothermal model is based on an electrical model of state variables and thermal finite element model coupled to the electric model. Electrical and thermal models were developed respectively in Matlab and CAST3M whereas the two models coupling was done in Simulink . In the second part, to validate the results of temperatures and to analyze the effect of ageing and degradation on the distribution and dynamics of temperature of the upper surface of the chip, methodology rapid temperature measurement and an experimental bench for infrared thermography were established. The difficulties encountered in IR thermal measurements with rapid temperature change led us to consider other thermal analysis methods. Eventually, we assessed the impulse response of the tested component by estimating with thermal simulations, the transfer function in the frequency domain using the COMSOL Multiphysics software. Moreover we evaluated the relevance of RC equivalent models (RC Cauer network). These models were then used to account for different modes of degradation this time especially on the solder layer between the chip and DCB and between the DCB and sole. Keywords: Power Modules semiconductor, Ageing, Metallization, electrothermal modeling, Short Circuit, Power and temperature distribution, inverse problem, IR Camera, Cauer networks.

京都大学 / 新制・課程博士 / 博士(工学) / 甲第23511号 / 工博第4923号 / 新制||工||1769(附属図書館) / 京都大学大学院工学研究科電気工学専攻 / (主査)教授 松尾 哲司, 教授 雨宮 尚之, 准教授 久門 尚史 / 学位規則第4条第1項該当 / Doctor of Philosophy (Engineering) / Kyoto University / DFAM

Les travaux présentés dans cette thèse se focalisent sur l'étude de l'effet de dégradations des composants de puissance, plus particulièrement au niveau de l'environnement proche des puces (métallisations, connexions, brasures puces/DCB), sur le comportement électrique et thermique des puces ainsi que de leur assemblage. Pour ce faire nous avons cherché à étudier la répartition des courants et des températures à la surface de la puce à l'aide d'un modèle électrothermique 2D distribué. Nous avons aussi évalué l'effet de la dégradation des brasures dans le volume de l'assemblage, à l'aide cette fois d'un modèle thermique relié à la constitution de l'assemblage. La première partie de cette thèse consiste à mettre en place un modèle électrothermique distribué de puce MOSFET, qui tient compte à la fois du caractère distribué de la dissipation de la puissance et du couplage électrothermique en régime transitoire. Ce modèle électrothermique s'appuie sur un modèle électrique aux variables d'états et un modèle thermique par éléments finis couplé au modèle électrique. Les modèles électriques et thermiques ont été développés respectivement sous Matlab et sous CAST3M, et le couplage des deux modèles a été fait sous Simulink. Dans une deuxième partie, pour la validation des résultats des températures et pour l'analyse de l'effet du vieillissement et des dégradations (sur la distribution et la dynamique de température de la surface supérieure de la puce), une méthodologie de mesure rapide de température et un banc expérimental pour thermographie infrarouge ont été mis en place. Les difficultés rencontrées lors des mesures thermiques IR sous variation rapide de la température nous ont poussé à envisager d'autres méthodes d'analyse thermique. Enfin, nous avons cherché à évaluer la réponse impulsionnelle du composant testé en estimant, par des simulations thermiques, la fonction de transfert dans le domaine fréquentiel à l'aide du logiciel COMSOL Multiphysics. Nous avons également étudié la pertinence de modèles RC équivalents (réseau RC de Cauer). Ces modèles ont ensuite été utilisés pour rendre compte de différents modes de dégradation notamment cette fois au niveau des couches de brasures entre puce et DCB et entre DCB et semelle. Mots clef : Modules de puissance à semi-conducteur, Vieillissement, Métallisation, Modélisation électrothermique, Court-circuit, Distribution de courant et de température, Problème inverse, Caméra IR, Réseaux de Cauer.

Harmonics are created by non-linear devices connected to the power system. Power system harmonics are multiples of the fundamental power system frequency and these harmonic frequencies can create distorted voltages and currents. Distortion of voltages and currents can affect the power system adversely causing power quality problems. Therefore, estimation of harmonics is of high importance for efficiency of the power system network. The problem of harmonic loss evaluation is of growing importance for renewable power system industry by impacting the operating costs and the useful life of the system components. Non-linear devices such as power electronics converters can inject harmonics alternating currents (AC) in the electrical power system. The number of sensitive loads that require ideal sinusoidal supply voltage for their proper operation has been increasing. To maintain the quality limits proposed by standards to protect the sensitive loads, it is necessary to include some form of filtering device to the power system. Harmonics also increases overall reactive power demanded by equivalent load. Filters have been devised to achieve an optimal control strategy for harmonic alleviation problems. To achieve an acceptable distortion, increase the power quality and to reduce the harmonics hence several three phase filter banks are used and connected in parallel. In this thesis, high order harmonics cases have been suppressed by employing variants of Butterworth, Chebyshev and Cauer filters. MATLAB/SIMULINK wind farm model was used to generate and analyze the different harmonics magnitude and frequency. High voltage direct current (HVDC) lines for an electrical grid that is more than50km far away wind farm generation plant was investigated for harmonics. These HVDC lines are also used in offshore wind farm plant. Investigated three-phase harmonics filters are shunt elements that are used in power systems for decreasing voltage distortion and for correcting the power factor. Renewable energy sources are not the stable source of energy generation like wind, solar and tidal e.t.c. Though they are secondary sources of generation and hard to connect with electrical grid. In near future the technique is to use the wave digital filter (WDF) or circulator-tree wave digital filter (CTWDF) for the renewable energy application can be employed to mitigate the harmonics. These WDF and CTWDF can b eused in HVDC lines and smart grid applications. A preliminary analysis is conducted for such a study.

Diploma thesis deals with circuits contain fractional-order elements. The first part of this paper deals with this problem, there were also described methods of design fractionalorder elements and types of circuits containing the fractiona-order elements which can be applied in practice. Used active elements for practical part can be found in the second chapter. Design of GIC circuits and implementation of fractional-order element inside the circuit are shown in the last chapture. Parasitic analysis and stability of frequency filter containing fractional-order element had been also described.

This Master`s thesis is focused on through acquaintance of principles of the function circuits with switched capaticors and posibility of their application mainly in frequency filters or signal generators. The origin of the switched capacitor circuits is mentioned at the beginning of the work. There are references to the first scientific work and scientists who have dealt with this issue. Maxwell`s idea: lossy element (resistor) replace with lossless element (switched capacitor) in electric circuit, is further described. In the next chapter of this work are listed types of switching capacitors and their use in simple RC filters and in structures of inverted or noninverted integrators and their application in more complex higher order filters. The advantages and disadvantages of SC circuits versus circuit composed of discrete components are shown. It is also listed a simple low-pass switched RC filter implemented with analogue multiplexer 4053. Using the LTC1043 integrated circuit, which structure and properties are described and analyzed in detail in the work, the 1st order aktive or pasive low and high pass filters were designed and subsequently simulated in the computer simulator OrCAD PSpice v.10. Another chapter deals with the integrated circuits higher order filters, structure and properties of the integrated filter LTC1060 are further analyzed here. Except this IC there are mentioned integrated filters commercially less available from the corporations Linear Technology and Maxim. The main objective of thesis was to propose and establish laboratory device and laboratory measurment focused on the switched capacitor circuits. The laboratory device has been designed with integrated circuits LTC1043 and LTC1060, which is demonstrated by using passive and active integrator, 2nd order band-pass and 4th order band-pass with Chebyshevovou approximation.