Due to the interplay between increasing chip capacity and complex applications, System-on-Chip (SoC) development is confronted by severe challenges, such as managing deep submicron effects, scaling communication architectures and bridging the productivity gap. Network-on-Chip (NoC) has been a rapidly developed concept in recent years to tackle the crisis with focus on network-based communication. NoC problems spread in the whole SoC spectrum ranging from specification, design, implementation to validation, from design methodology to tool support. In the thesis, we formulate and address problems in three key NoC areas, namely, on-chip network architectures, NoC network performance analysis, and NoC communication refinement. Quality and cost are major constraints for micro-electronic products, particularly, in high-volume application domains. We have developed a number of techniques to facilitate the design of systems with low area, high and predictable performance. From flit admission and ejection perspective, we investigate the area optimization for a classical wormhole architecture. The proposals are simple but effective. Not only offering unicast services, on-chip networks should also provide effective support for multicast. We suggest a connection-oriented multicasting protocol which can dynamically establish multicast groups with quality-of-service awareness. Based on the concept of a logical network, we develop theorems to guide the construction of contention-free virtual circuits, and employ a back-tracking algorithm to systematically search for feasible solutions. Network performance analysis plays a central role in the design of NoC communication architectures. Within a layered NoC simulation framework, we develop and integrate traffic generation methods in order to simulate network performance and evaluate network architectures. Using these methods, traffic patterns may be adjusted with locality parameters and be configured per pair of tasks. We propose also an algorithm-based analysis method to estimate whether a wormhole-switched network can satisfy the timing constraints of real-time messages. This method is built on traffic assumptions and based on a contention tree model that captures direct and indirect network contentions and concurrent link usage. In addition to NoC platform design, application design targeting such a platform is an open issue. Following the trends in SoC design, we use an abstract and formal specification as a starting point in our design flow. Based on the synchronous model of computation, we propose a top-down communication refinement approach. This approach decouples the tight global synchronization into process local synchronization, and utilizes synchronizers to achieve process synchronization consistency during refinement. Meanwhile, protocol refinement can be incorporated to satisfy design constraints such as reliability and throughput. The thesis summarizes the major research results on the three topics. / QC 20100525

This thesis consists of designing and implementing a bus system for a specific computersystem for MediaTek Sweden AB . The focus of the report is to show the considerations andchoices made in the design of a suitable bus system. Implementation details describe howthe system is constructed. The results show that it is possible to maintain a high bandwidthin many parts of the system if an appropriate topology is chosen. If all units in a bus systemare synchronous it is difficult to reach low latency in the communication.

No description available.

In order to carry out the complicated computation inside the high performance computing (HPC) systems, tens to hundreds of parallel processor chips and physical wires are required to be integrated inside the multi-chip package module (MCM). The physical wires considered as the electrical interconnects between the processor chips, however, have the challenges on placements and routings because of the unequal progress between the semiconductor and I/O size reductions. The primary goal of the research is to overcome package design challenges - providing a hybrid computing architecture with implemented 60 GHz antennas as the high efficient wireless interconnect which could generate over 10 Gbps bandwidth on the data transmissions. The dissertation is divided into three major parts. In the first part, two different performance metrics, power loss required to be recovered (PRE) and wireless link budget, on evaluating the antenna's system performance within the chip to chip wireless interconnect are introduced to address the design challenges and define the design goals. The second part contains the design concept, fabrication procedure and measurements of implemented 60 GHz broadband antenna in the application of multi-chip data transmissions. The developed antenna utilizes the periodically-patched artificial magnetic conductor (AMC) structure associated with the ground-shielded conductor in order to enhance the antenna's impedance matching bandwidth. The validation presents that over 10 GHz -10 dB S11 bandwidth which indicates the antenna's operating bandwidth and the horizontal data transmission capability which is required by planar type chip to chip interconnect can be achieved with the design concept. In order to reduce both PRE and wireless link budget numbers, a 60 GHz two-element array in the multi-chip communication is developed in the third part. The third section includes the combined-field analysis, the design concepts on two-element array and feeding circuitry. The simulation results agree with the predicted field analysis and demonstrate the 5dBi gain enhancement in the horizontal direction over a single 60 GHz AMC antenna to further reduce both PRE and wireless link budget numbers.

<p>The continuous miniaturization of integrated circuits has opened the path towards System-on-Chip realizations. Process shrinking into the nanometer regime improves transistor performancewhile the delay of global interconnects, connecting circuit blocks separated by a long distance, significantly increases. In fact, global interconnects extending across a full chip can have a delay corresponding to multiple clock cycles. At the same time, global clock skew constraints, not only between blocks but also along the pipelined interconnects, become even tighter. On-chip interconnects have always been considered <em>RC</em>-like, that is exhibiting long <em>RC</em>-delays. This has motivated large efforts on alternatives such as on-chip optical interconnects, which have not yet been demonstrated, or complex schemes utilizing on-chip F-transmission or pulsed current-mode signaling.</p><p>In this thesis, we show that well-designed electrical global interconnects, behaving as transmission lines, have the capacity of very high data rates (higher than can be delivered by the actual process) and support near velocity-of-light delay for single-ended voltage-mode signaling, thus mitigating the <em>RC</em>-problem. We critically explore key interconnect performance measures such as data delay, maximum data rate, crosstalk, edge rates and power dissipation. To experimentally demonstrate the feasibility and superior properties of on-chip transmission line interconnects, we have designed and fabricated a test chip carrying a 5 mm long global communication link. Measurements show that we can achieve 3 Gb/s/wire over the 5 mm long, repeaterless on-chip bus implemented in a standard 0.18 μm CMOS process, achieving a signal velocity of 1/3 of the velocity of light in vacuum.</p><p>To manage the problems due to global wire delays, we describe and implement a Synchronous Latency Insensitive Design (SLID) scheme, based on source-synchronous data transfer between blocks and data re-timing at the receiving block. The SLIDtechnique not onlymitigates unknown globalwire delays, but also removes the need for controlling global clock skew. The high-performance and high robustness capability of the SLID-method is practically demonstrated through a successful implementation of a SLID-based, 5.4 mm long, on-chip global bus, supporting 3 Gb/s/wire and dynamically accepting ± 2 clock cycles of data-clock skew, in a standard 0.18 μm CMOS porcess.</p><p>In the context of technology scaling, there is a tendency for interconnects to dominate chip power dissipation due to their large total capacitance. In this thesis we address the problem of interconnect power dissipation by proposing and analyzing a transition-energy cost model aimed for efficient power estimation of performancecritical buses. The model, which includes properties that closely capture effects present in high-performance VLSI buses, can be used to more accurately determine the energy benefits of e.g. transition coding of bus topologies. We further show a power optimization scheme based on appropriate choice of reduced voltage swing of the interconnect and scaling of receiver amplifier. Finally, the power saving impact of swing reduction in combination with a sense-amplifying flip-flop receiver is shown on a microprocessor cache bus architecture used in industry.</p>

The continuous miniaturization of integrated circuits has opened the path towards System-on-Chip realizations. Process shrinking into the nanometer regime improves transistor performancewhile the delay of global interconnects, connecting circuit blocks separated by a long distance, significantly increases. In fact, global interconnects extending across a full chip can have a delay corresponding to multiple clock cycles. At the same time, global clock skew constraints, not only between blocks but also along the pipelined interconnects, become even tighter. On-chip interconnects have always been considered RC-like, that is exhibiting long RC-delays. This has motivated large efforts on alternatives such as on-chip optical interconnects, which have not yet been demonstrated, or complex schemes utilizing on-chip F-transmission or pulsed current-mode signaling. In this thesis, we show that well-designed electrical global interconnects, behaving as transmission lines, have the capacity of very high data rates (higher than can be delivered by the actual process) and support near velocity-of-light delay for single-ended voltage-mode signaling, thus mitigating the RC-problem. We critically explore key interconnect performance measures such as data delay, maximum data rate, crosstalk, edge rates and power dissipation. To experimentally demonstrate the feasibility and superior properties of on-chip transmission line interconnects, we have designed and fabricated a test chip carrying a 5 mm long global communication link. Measurements show that we can achieve 3 Gb/s/wire over the 5 mm long, repeaterless on-chip bus implemented in a standard 0.18 μm CMOS process, achieving a signal velocity of 1/3 of the velocity of light in vacuum. To manage the problems due to global wire delays, we describe and implement a Synchronous Latency Insensitive Design (SLID) scheme, based on source-synchronous data transfer between blocks and data re-timing at the receiving block. The SLIDtechnique not onlymitigates unknown globalwire delays, but also removes the need for controlling global clock skew. The high-performance and high robustness capability of the SLID-method is practically demonstrated through a successful implementation of a SLID-based, 5.4 mm long, on-chip global bus, supporting 3 Gb/s/wire and dynamically accepting ± 2 clock cycles of data-clock skew, in a standard 0.18 μm CMOS porcess. In the context of technology scaling, there is a tendency for interconnects to dominate chip power dissipation due to their large total capacitance. In this thesis we address the problem of interconnect power dissipation by proposing and analyzing a transition-energy cost model aimed for efficient power estimation of performancecritical buses. The model, which includes properties that closely capture effects present in high-performance VLSI buses, can be used to more accurately determine the energy benefits of e.g. transition coding of bus topologies. We further show a power optimization scheme based on appropriate choice of reduced voltage swing of the interconnect and scaling of receiver amplifier. Finally, the power saving impact of swing reduction in combination with a sense-amplifying flip-flop receiver is shown on a microprocessor cache bus architecture used in industry.

The notion of platform based design is considered as a viable solution to boost the design productivity by favouring reuse design methodology. With the scaling down of device feature size and scaling up of design complexity, throughput limitations, signal integrity and signal latency are becoming a bottleneck in future communication centric System-on-Chip (SoC) design. This has given birth to communication centric platform based designs. Development of heterogeneous multi-core architectures has caused the on-chip communication medium tailored for a specific application domain to deal with multidomain traffic patterns. This makes the current application specific communication centric platforms unsuitable for future SoC architectures. The work presented in this thesis, endeavours to explore the current communication media to establish the expectations from future on-chip interconnects. A novel communication centric platform based design flow is proposed, which consists of four communication centric platforms that are based on shared global bus, hierarchical bus, crossbars and a novel hybrid communication medium. Developed with a smart platform controller, the platforms support Open Core Protocol (OCP) socket standard, allowing cores to integrate in a plug and play fashion without the need to reprogram the pre-verified platforms. This drastically reduces the design time of SoC architectures. Each communication centric platform has different throughput, area and power characteristics, thus, depending on the design constraints, processing cores can be integrated to the most appropriate communication platform to realise the desired SoC architecture. A novel hybrid communication medium is also developed in this thesis, which combines the advantages of two different types of communication media in a single SoC architecture. The hybrid communication medium consists of crossbar matrix and shared bus medium . Simulation results and implementation of WiMAX receiver as a real-life example shows a 65% increase in data throughput than shared bus based communication medium, 13% decrease in area and 11% decrease in power than crossbar based communication medium. In order to automate the generation of SoC architectures with optimised communication architectures, a tool called SOCCAD (SoC Communication architecture development) is developed. Components needed for the realisation of the given application can be selected from the tool’s in-built library. Offering an optimised communication centric placement, the tool generates the complete SystemC code for the system with different interconnect architectures, along with its power and area characteristics. The generated SystemC code can be used for quick simulation and coupled with efficient test benches can be used for quick verification. Network-on-Chip (NoC) is considered as a solution to the communication bottleneck in future SoC architectures with data throughput requirements of over 10GB/s. It aims to provide low power, efficient link utilisation, reduced data contention and reduced area on silicon. Current on-chip networks, developed with fixed architectural parameters, do not utilise the available resources efficiently. To increase this efficiency, a novel dynamically reconfigurable NoC (drNoC) is developed in this thesis. The proposed drNoC reconfigures itself in terms of switching, routing and packet size with the changing communication requirements of the system at run time, thus utilising the maximum available channel bandwidth. In order to increase the applicability of drNoC, the network interface is designed to support OCP socket standard. This makes drNoC a highly reuseable communication framework, qualifying it as a communication centric platform for high data intensive SoC architectures. Simulation results show a 32% increase in data throughput and 22-35% decrease in network delay when compared with a traditional NoC with fixed parameters.

Continuing advances with VLSI have enabled engineers to build high performance computer systems to solve complex problems. The real-world problems and tasks like pattern recognition, speech recognition, etc. still remain elusive to the most advanced computer systems today. Many advances in the science of computer design and technology are coming together to enable the creation of the next-generation computing machines to solve real-world problems, which the human brain does with ease. One such engineering advance is the field of neuromorphic engineering, which tries to establish closer links to biology and help us investigate the problem of designing better computing machines. A chip built with the principles of neuromorphic engineering is called as neuromorphic chip. Neuromorphic chip aims to solve real-world problems. As the complexity of the problem increases, the computation capability of these chips can become a limitation. In order to improve the performance and accomplish a complex task in the real-world, many such chips need to be integrated into a system. Hence, efficiency of such a system depends on effective inter-chip communication. Here, the work presented aims at building a message-passing network (Digital Fabric) simulator, that integrates many such chips. Each chip represents a binary event-based unit called spiking analog cortical module. The inter-chip communication protocol employed here is called as Address Event Representation. Here, the Digital Fabric is built in three revisions, with different architectures being considered in each revision. The complexity is increased at each iteration stage. The experiments performed in each revision test the performance of such configuration systems and results proves to lay a foundation for further studies. In the future, building a high level simulation model will assist in scaling and evaluating various network topologies.

This thesis presents the design, implementation, and fabrication of an analog front-end (AFE) targeting 2x blind ADC-based receivers. The front-end consists of a combination of an anti-aliasing filter (AAF) and a 2-tap feed-forward equalizer (FFE) (AAF/FFE), the required clock generation circuitry (Ck Gen), 4 time-interleaved 4-b ADCs, and DeMUX. The contributions of this design are the AAF/FFE and the Ck Gen. The overall front-end optimizes the channel/filter characteristics for data-rates of 2-10 Gb/s. The bandwidth of the AAF is scalable with the data-rate and the analog 2-tap feed-forward equalizer (FFE) is designed without the need for noise-sensitive analog delay cells. The test-chip is implemented in 65-nm CMOS and the AAF/FFE occupies 152×86 μm2 and consumes 2.4 mW at 10 Gb/s. Measured frequency responses at data-rates of 10, 5, and 2 Gb/s confirm the scalability of the front-end bandwidth. FFE achieves 11 dB of high-frequency boost at 10 Gb/s.

This thesis presents the design, implementation, and fabrication of an analog front-end (AFE) targeting 2x blind ADC-based receivers. The front-end consists of a combination of an anti-aliasing filter (AAF) and a 2-tap feed-forward equalizer (FFE) (AAF/FFE), the required clock generation circuitry (Ck Gen), 4 time-interleaved 4-b ADCs, and DeMUX. The contributions of this design are the AAF/FFE and the Ck Gen. The overall front-end optimizes the channel/filter characteristics for data-rates of 2-10 Gb/s. The bandwidth of the AAF is scalable with the data-rate and the analog 2-tap feed-forward equalizer (FFE) is designed without the need for noise-sensitive analog delay cells. The test-chip is implemented in 65-nm CMOS and the AAF/FFE occupies 152×86 μm2 and consumes 2.4 mW at 10 Gb/s. Measured frequency responses at data-rates of 10, 5, and 2 Gb/s confirm the scalability of the front-end bandwidth. FFE achieves 11 dB of high-frequency boost at 10 Gb/s.