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  • About
  • The Global ETD Search service is a free service for researchers to find electronic theses and dissertations. This service is provided by the Networked Digital Library of Theses and Dissertations.
    Our metadata is collected from universities around the world. If you manage a university/consortium/country archive and want to be added, details can be found on the NDLTD website.
11

Simulation and design of planarizing materials and interfacial adhesion studies for step and flash imprint lithography

Lin, Michael Wayne, 1980- 18 September 2012 (has links)
Step and flash imprint lithography (SFIL) was developed in 1999 at The University of Texas at Austin as a high resolution, cost-effective alternative to photolithography for nanoscale patterning. Unlike current projection steppers, which are resolution limited by diffraction phenomena, SFIL tools have demonstrated patterning capability down to 20 nm, a resolution currently unattainable using traditional lithographic techniques. The combination of high resolution and low cost of ownership make SFIL a strong candidate for future semiconductor integrated circuit manufacturing. For SFIL to be viable as a high volume process, there are numerous technical issues that need to be resolved. Reverse-tone step and flash imprint lithography (SFIL-R) is a reverse tone variant of SFIL that requires the successful application of a planarizing topcoat over topography through spincoating. Photopolymerizable nonvolatile fluids are ideal topcoat materials because they planarize better than volatile fluids during spincoating and can continue to level after spincoating. Fluid mechanics analyses indicate that complete planarization using capillary force is slow. Therefore, defining the acceptable or critical degree of planarization (DOP[subscript crit]) becomes necessary. Finite difference simulation of the spincoat and post-spin leveling processes was used to determine the planarization time for various topographic and material property combinations. A new material, Si-14, was designed to have ideal planarization characteristics and satisfy SFIL-R processing requirements and was used to validate the models through profilometry and interferometry experiments. During spincoating, minimizing the spin speed generates more planar films, however, this increases the spin time. To rectify this problem, a 2-stage spincoating process -- a first step with high spin speeds to achieve the target thickness quickly and a second step with low spin speeds to improve planarization -- was proposed and experimentally demonstrated. An alternative planarization technique is to generate a reverse-conformal film coating through Marangoni-driven flow. The SFIL process requires the clean separation of a quartz template from a polymer, and the force required to create this separation must be minimized to prevent the generation of defects. Fracture mechanics analyses show that control of the polymer modulus and interfacial fracture energy is the key to minimizing the separation force. Adjusting the crosslinker concentration in the imprint formulation reduces the modulus but has no significant impact on the fracture energy. On the other hand, adding surfactants to the imprint formulation reduces both the modulus and fracture energy. The fracture energy is further decreased by using a nonreactive, liquid surfactant versus a surfactant that reacts with the polymer matrix. Angleresolved X-ray photoelectron spectroscopy (XPS) results indicate that surfactant migration is more effective with a fluorinated surface treatment compared to an untreated quartz or organic surface. However, the fluorinated surface treatment that drives the migration process degrades over multiple imprints. Based on these results, it was concluded that the use of fluorinated surfactants must be accompanied by a surface treatment that is both stable and of a similar energy or polarity to induce migration and to lower the adhesive strength. Mixed-mode fracture affects the separation force, especially if shear stresses are present. Overfilling the templatesubstrate gap causes large amounts of shear stresses during separation; however, this phenomenon can be prevented by controlling the surface energies of the imprint template and substrate. / text
12

Computer simulation of the wire coating process

Petsalis, Spyro. January 1984 (has links)
No description available.
13

Hydrodynamics of droplet impingement on heated surfaces : effects of nanofluid and nano-structured surface /

Shen, Jian. January 1900 (has links)
Thesis (Ph. D.)--Oregon State University, 2010. / Printout. Includes bibliographical references (leaves 83-87). Also available on the World Wide Web.
14

The effect of particle size on the amount of coating received during a batch fluidized bed coating operation

Sudsakorn, Kandis. January 1999 (has links)
Thesis (M.S.)--West Virginia University, 1999. / Title from document title page. Document formatted into pages; contains x, 98 p. : ill. (some col.) Includes abstract. Includes bibliographical references (p. 63-68).
15

The influence of particle coating via electrochemical deposition on the compressibility of iron powders /

Lorcharoensery, Suradej (Kai), January 2004 (has links)
Thesis (Ph. D.)--Lehigh University, 2004. / Includes vita. Includes bibliographical references (leaves 113-119).
16

Computer simulation of the wire coating process

Petsalis, Spyro. January 1984 (has links)
No description available.
17

Simultaneous chrominizing-aluminizing of iron and iron-base alloys /

Wang, Da-yung January 1987 (has links)
No description available.
18

THE ION-ASSISTED DEPOSITION OF OPTICAL THIN FILMS.

TARGOVE, JAMES DONALD. January 1987 (has links)
The columnar microstructure of most thermally evaporated thin films detrimentally affects many of their properties through a reduction in packing density. In this work, we have investigated ion-assisted deposition as a means of disrupting this columnar growth for a number of coating materials. A Kaufman hot-cathode ion source bombarded thermally evaporated films with low-energy (< 1000 eV) positive ions during deposition in a cryopumped box coater. We have investigated MgF₂, Na₃AIF₆, AIF₃, LaF₃, CeF₃, NdF₃, Al₂O₃, and AIN. Argon ion bombardment of the fluoride coatings increased their packing densities dramatically. We achieved packing densities near unity without significant absorption for MgF₂, LaF₃, and NdF₃, while Na₃AIF₆, AIF₃, and CeF₃ began to absorb before unity packing density could be achieved. Fluorine was preferentially sputtered by the ion bombardment, creating anion vacancies. The films adsorbed water vapor and hydroxyl radicals from the residual chamber atmosphere. These filled the vacancy sites, eliminating absorption in the visible, but the oxygen complexes caused increased absorption in the ultraviolet. For LaF₃ and NdF₃, a sufficient amount of oxygen caused a phase transformation from the fluoride phase to an oxyfluoride phase. The refractive indices of Al₂O₃ films increased with ion bombardment. Values as high as 1.70 at 350 nm were achieved with bombardment by 500 eV oxygen ions. Since all of the Al₂O₃ films had packing densities near unity and were amorphous, we postulate that the increase in refractive index was due to a change in amorphous networking. Aluminum nitride was deposited by bombarding thermally evaporated aluminum with nitrogen ions. Films with N:Al ratios of 0.5-1.5 could be deposited by varying the deposition conditions. Films with low absorption for wavelengths longer than 1 μm could be deposited. Annealing the films at 500°C eliminated absorption at wavelengths longer than 500 nm.
19

Encapsulation of particles using brittle coatings for subterranean applications

Bhatia, Aashish. January 1999 (has links)
Thesis (M.S.)--West Virginia University, 1999. / Title from document title page. Document formatted into pages; contains x, 74 p. : ill. Includes abstract. Includes bibliographical references (p. 70-71).
20

Influence of processing variables on the mechanical properties of SiC fibers prepared by chemical vapor deposition

Prasad, Ajit 08 1900 (has links)
No description available.

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