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  • About
  • The Global ETD Search service is a free service for researchers to find electronic theses and dissertations. This service is provided by the Networked Digital Library of Theses and Dissertations.
    Our metadata is collected from universities around the world. If you manage a university/consortium/country archive and want to be added, details can be found on the NDLTD website.
11

Estudo da liga cu-11,8al-xbe-0,3ti (x = 0,5; 0,6; 0,7) processadas termomecanicamente / Study of the alloy cu-11,8al-xbe-0,3ti (x = 0,5, 0,6 and 0,7) thermomechanical processing

Júnior., Manoel Quirino da Silva 28 September 2010 (has links)
Made available in DSpace on 2015-05-08T15:00:04Z (GMT). No. of bitstreams: 1 arquivototal.pdf: 2663427 bytes, checksum: 32fe62098d052c5ec88062947422c2d1 (MD5) Previous issue date: 2010-09-28 / Coordenação de Aperfeiçoamento de Pessoal de Nível Superior - CAPES / Shape memory alloys have been object of diverse studies due to a vast fan of possible applications, such as: medical applications (materials for applications in dentistry and orthopedics), sensor (thermostats) and thermal-mechanics actuators (connections of tubes). The objectives of this work were the elaboration and characterization of Cu-Al shape memory alloys which contend beryl and titanium in the following percentages: Cu-11,8Al- XBe-0,3Ti (X = 0,5; 0,6 and 0.7% weight); and to analyze the viability of the thermomechanical process in these alloys. The influence of the variables about chemical composition, quench hardening, thermal cycling and the thermomechanical treatment in the transformation temperatures were investigated. It was possible to verify that the addition of small amounts of Be alters the matrix composition and, consequently, the transformation temperatures. For its time, Ti forms precipitated with amounts of copper and aluminum that inhibit the growth of the grain in the thermomechanical process. The alloys were cycled themically in a range among the temperature below of Mf and above of Af reaching stable values being evidenced a great thermal stability. The microstructural evolution before and after the thermomechanical process, the transformation temperatures and the thermal stability were characterized by the thermal analysis (DSC and DTA), scanning electron microscopy and x-ray diffraction. Under low speeds of cooling, the alloys show a decomposition of the β phase with formation of the γ2 and α phases, whereas in the fast cooling, the β phase passes to β1 without the presence of the other phases. With the increase of the percentile of Be, the γ2 phase increases and it maintains precipitated together in the matrix with rich particles of second phase in titanium. However, after ix lamination and temper, the γ2 phase is not presented anymore staying the dispersed particles of second phase in the matrix. / As ligas com efeito memória de forma têm sido objeto de diversos estudos, devido a um vasto leque de aplicações possíveis, tais como: médicas (materiais para aplicações em odontologia e ortopedia), sensores (termostatos) e atuadores termomecânicos (conexões de tubos). Os objetivos deste trabalho foi a elaboração e caracterização de ligas com memória de forma do sistema Cu-Al contendo berílio e titânio nos seguintes percentuais: Cu- 11,8Al-XBe-0,3Ti (X = 0,5; 0,6 e 0,7 %peso). Forma estudados os efeitos das variáveis de processamento nas propriedades microestruturais e na estabilidade térmica. Além disso, foram investigadas a influência das variáveis composição química, meio de têmpera, ciclagem térmica e o tratamento termomecânico nas temperaturas de transformação. Foi possível constatar que a adição de pequenos teores de Be altera a composição da matriz e, consequentemente, as temperaturas de transformação. O Ti por sua vez, forma precipitados com teores de cobre e alumínio que inibem o crescimento do grão no processo termomecânico. As ligas foram cicladas termicamente numa faixa entre a temperatura abaixo da transformação final da martensita e acima da transformação final da austenita, atingindo valores estáveis, ficando evidenciada uma ótima estabilidade térmica. A evolução microestrutural antes e depois do processo termomecânico, as temperaturas de transformação e a estabilidade térmica foram caracterizadas pelas analises térmicas (calorimetria exploratória diferencial e análise térmica diferencial), microscopia eletrônica de varredura e difração de raios-X. Sob baixas velocidades de resfriamento as ligas mostram uma decomposição da fase β CCC com formação das fases γ2 e α CFC, enquanto que no resfriamento rápido a fase β passa para β1 sem a presença das demais fases. Com o aumento do percentual de Be a fase γ2 aumenta e se mantém precipitada na matriz vii juntamente com partículas de segunda fase ricas em titânio. No entanto, após laminação e têmpera, a fase γ2 não mais se apresenta permanecendo as partículas de segunda fase dispersas na matriz.
12

Estudo da cinética de precipitação de Ag na liga Cu-7% Al-4% Ag

Maia Neto, Alfredo dos Santos [UNESP] 02 1900 (has links) (PDF)
Made available in DSpace on 2014-06-11T19:29:06Z (GMT). No. of bitstreams: 0 Previous issue date: 2005-02Bitstream added on 2014-06-13T19:37:59Z : No. of bitstreams: 1 maianeto_as_me_araiq.pdf: 907997 bytes, checksum: 246ee7468bbd3c17dd5762fc7651b5eb (MD5) / Coordenação de Aperfeiçoamento de Pessoal de Nível Superior (CAPES) / Neste trabalho, foi feito um estudo da cinética de precipitação da fase rica em prata, na liga Cu-7%Al-4%Ag, em peso, utilizando-se o modelo cinético isotérmico de Johnson-Mehl-Avrami e os modelos cinéticos nãoisotérmicos de Kissinger e Ozawa. A reação de precipitação da fase rica em prata foi acompanhada por medidas de variação da microdureza da liga com a temperatura de têmpera e o tempo de envelhecimento, e também por medidas de dilatometria. As fases presentes nas diversas temperaturas e tempos considerados, foram identificadas e caracterizadas por microscopia óptica e eletrônica de varredura, análise por dispersão de energias de raios X e por difratometria de raios X. Os resultados obtidos indicaram que a formação dos precipitados ricos em prata corresponde a um processo controlado por difusão da prata nos contornos de grão da matriz, no intervalo de temperaturas de 400 a 600 oC. O cálculo da energia de ativação para a formação dos precipitados, utilizando-se a equação de Johnson-Mehl-Avrami, forneceu um valor bastante próximo daquele encontrado na literatura, confirmando que o processo é controlado pela difusão da prata. O valor da energia de ativação para o crescimento dos precipitados ricos em Ag, calculado a partir de um método que considera o inverso do tempo necessário para o precipitado atingir seu tamanho máximo como proporcional à taxa de crescimento, ficou próximo daquele obtido utilizando-se a equação de Johnson-Mehl-Avrami, indicando que esse método pode ser utilizado para o cálculo da energia de ativação do processo cinético. Os valores da energia de ativação associados ao processo de precipitação de Ag, obtidos por métodos não isotérmicos, ficaram razoavelmente próximos daqueles encontrados na literatura e os valores assim obtidos associados à solubilização de Ag foram maiores do que aqueles encontrados na literatura... / In this work, the Ag-rich phase precipitation kinetics in the Cu-7wt.%Al-4wt.%Ag alloy, was studied using the Johnson-Mehl-Avrami isothermal kinetic model and the Kissinger and Ozawa non-isothermal kinetic models. The Ag-rich phase precipitation reaction was followed by microhardness changes measurements with quenching temperature and with aging time, and also by dilatometric measurements. The identification and characterization of the phases present at the considered temperatures and times were made by optical and scanning electronic microscopy, energy dispersive X-ray analysis and X-ray diffractometry. The results showed that the Ag-rich precipitates formation corresponds to a diffusion controlled process at the matrix grain boundaries, in the temperatures range from 400 to 600 oC. The activation energy value for the precipitates formation, calculated using the Johnson-Mehl-Avrami equation, is close to that found in the literature, thus confirming that the process is diffusion controlled. The activation energy value for the growing of Ag-rich precipitates, obtained considering that the inverse of the time to reach the precipitates maximum size is proportional to the growing rate, is close to that found using the Johnson-Mehl-Avrami equation, indicating that this method is useful to evaluate the activation energy for the kinetic process. The activation energy values obtained by non-isothermal methods and associated to the precipitation process were very close to those found in the literature, and the values associated to Ag dissolution were greater than those reported in the literature. This discrepancy may be associated to the presence of Al, and the Al-Ag interaction may be disturbing the diffusion process.
13

Zr-based Bulk Metallic Glass A Study Of Processing, Welding And Subsurface Deformation Mechanism

Bhowmick, Ranadeep 07 1900 (has links) (PDF)
No description available.
14

Influence des conditions d'impact sur l'adhérence de cuivre projeté dynamiquement sur de l'aluminium

Guetta, Serge 02 February 2010 (has links) (PDF)
Lors de la projection dynamique par gaz froid, nommée " cold spray ", les particules sont accélérées aérodynamiquement et maintenues à l'état solide jusqu'au moment de l'impact sur le substrat. L'empilement de ces particules constitue le revêtement dont l'adhérence représente un paramètre déterminant quant à la qualité des pièces industrielles. L'enjeu de cette étude est la compréhension et la quantification de l'adhérence interfaciale par l'analyse de la phase d'accrochage des premières particules dispersées à la surface du substrat, en fonction des conditions d'impact. Vitesse d'impact, température de préchauffage et oxydation des surfaces mises en contact ont, en effet, une influence directe sur les phénomènes survenant à l'interface donc sur l'adhérence. Cette étude propose une méthode permettant de relier les conditions de projection aux conditions d'impact, aux mécanismes survenant entre la particule et le substrat durant l'impact et, enfin, au niveau d'adhérence des particules correspondantes. Pour cela, les conditions d'impact ont été déterminées par l'utilisation conjointe de techniques expérimentales et de modélisations numériques. Les températures locales et les pressions de contact alors induites à l'interface durant l'impact ont été calculées par simulation numérique. Des analyses fines par transmission ont été réalisées afin d'étudier les phénomènes survenant le long de l'interface, en fonction des conditions d'impact. Enfin, les niveaux d'adhérence correspondants ont été obtenus par une utilisation originale de l'essai LASAT (LAser Shock Adhesion Test). Les phénomènes responsables de l'adhésion ont ainsi pu être mis en évidence et leur influence quantifiée.
15

Étude et modélisation du comportement cyclique des Alliages à Mémoire de Forme

Saint-Sulpice, Luc 29 October 2009 (has links) (PDF)
Les Alliages à Mémoire de Forme sont utilisés dans un grand nombre d'applications. Or celles-ci imposent généralement un chargement cyclique qui fait évoluer leur comportement. Nous avons donc étudié ce comportement en réalisant une base d'essais en super-élasticité et en effet mémoire assisté montrant l'apparition d'une déformation résiduelle au cours du cyclage. À la fin de ces essais l'application d'un flash thermique a permis de déterminer que l'origine de cette déformation résiduelle provient majoritairement de martensite résiduelle pour l'alliage utilisé. Un modèle macroscopique a ensuite été développé afin de prendre en compte cet aspect du comportement des Alliages à Mémoire de Forme. C'est un modèle à seuil permettant de prendre en compte les différentes propriétés des Alliages à Mémoire de Forme telles que la dissymétrie traction-compression, l'effet point-mémoire, la réorientation de la martensite lors de chargements multiaxiaux non-proportionnels ainsi que l'apparition de martensite bloquée lors de chargements cycliques. Le modèle a été implanté dans un code de calcul par éléments finis afin de simuler le comportement de structures sous chargement cyclique. L'utilisation du modèle pour la validation de comportement ou l'aide à la conception a été montrée sur deux applications courantes utilisant des Alliages à Mémoire de Forme.
16

Estudo da cinética de precipitação de Ag na liga Cu-7% Al-4% Ag /

Maia Neto, Alfredo dos Santos. January 2005 (has links)
Orientador: Antonio Tallarico Vicente Adorno / Resumo: Neste trabalho, foi feito um estudo da cinética de precipitação da fase rica em prata, na liga Cu-7%Al-4%Ag, em peso, utilizando-se o modelo cinético isotérmico de Johnson-Mehl-Avrami e os modelos cinéticos nãoisotérmicos de Kissinger e Ozawa. A reação de precipitação da fase rica em prata foi acompanhada por medidas de variação da microdureza da liga com a temperatura de têmpera e o tempo de envelhecimento, e também por medidas de dilatometria. As fases presentes nas diversas temperaturas e tempos considerados, foram identificadas e caracterizadas por microscopia óptica e eletrônica de varredura, análise por dispersão de energias de raios X e por difratometria de raios X. Os resultados obtidos indicaram que a formação dos precipitados ricos em prata corresponde a um processo controlado por difusão da prata nos contornos de grão da matriz, no intervalo de temperaturas de 400 a 600 oC. O cálculo da energia de ativação para a formação dos precipitados, utilizando-se a equação de Johnson-Mehl-Avrami, forneceu um valor bastante próximo daquele encontrado na literatura, confirmando que o processo é controlado pela difusão da prata. O valor da energia de ativação para o crescimento dos precipitados ricos em Ag, calculado a partir de um método que considera o inverso do tempo necessário para o precipitado atingir seu tamanho máximo como proporcional à taxa de crescimento, ficou próximo daquele obtido utilizando-se a equação de Johnson-Mehl-Avrami, indicando que esse método pode ser utilizado para o cálculo da energia de ativação do processo cinético. Os valores da energia de ativação associados ao processo de precipitação de Ag, obtidos por métodos não isotérmicos, ficaram razoavelmente próximos daqueles encontrados na literatura e os valores assim obtidos associados à solubilização de Ag foram maiores do que aqueles encontrados na literatura...(Resumo completo, clicar acesso eletrônico abaixo) / Abstract: In this work, the Ag-rich phase precipitation kinetics in the Cu-7wt.%Al-4wt.%Ag alloy, was studied using the Johnson-Mehl-Avrami isothermal kinetic model and the Kissinger and Ozawa non-isothermal kinetic models. The Ag-rich phase precipitation reaction was followed by microhardness changes measurements with quenching temperature and with aging time, and also by dilatometric measurements. The identification and characterization of the phases present at the considered temperatures and times were made by optical and scanning electronic microscopy, energy dispersive X-ray analysis and X-ray diffractometry. The results showed that the Ag-rich precipitates formation corresponds to a diffusion controlled process at the matrix grain boundaries, in the temperatures range from 400 to 600 oC. The activation energy value for the precipitates formation, calculated using the Johnson-Mehl-Avrami equation, is close to that found in the literature, thus confirming that the process is diffusion controlled. The activation energy value for the growing of Ag-rich precipitates, obtained considering that the inverse of the time to reach the precipitates maximum size is proportional to the growing rate, is close to that found using the Johnson-Mehl-Avrami equation, indicating that this method is useful to evaluate the activation energy for the kinetic process. The activation energy values obtained by non-isothermal methods and associated to the precipitation process were very close to those found in the literature, and the values associated to Ag dissolution were greater than those reported in the literature. This discrepancy may be associated to the presence of Al, and the Al-Ag interaction may be disturbing the diffusion process. / Mestre
17

Interfacial Electrochemistry of Cu/Al Alloys for IC Packaging and Chemical Bonding Characterization of Boron Doped Hydrogenated Amorphous Silicon Films for Infrared Cameras

Ross, Nick 05 1900 (has links)
We focused on a non-cooling room temperature microbolometer infrared imaging array device which includes a sensing layer of p-type a-Si:H component layers doped with boron. Boron incorporation and bonding configuration were investigated for a-Si:H films grown by plasma enhanced chemical deposition (PECVD) at varying substrate temperatures, hydrogen dilution of the silane precursor, and dopant to silane ratio using multiple internal reflection infrared spectroscopy (MIR-IR). This study was then confirmed from collaborators via Raman spectroscopy. MIR-IR analyses reveal an interesting counter-balance relationship between boron-doping and hydrogen-dilution growth parameters in PECVD-grown a-Si:H. Specifically, an increase in the hydrogen dilution ratio (H2/SiH4) or substrate temperature was found to increase organization of the silicon lattice in the amorphous films. It resulted in the decrease of the most stable SiH bonding configuration and thus decrease the organization of the film. The new chemical bonding information of a-Si:H thin film was correlated with the various boron doping mechanisms proposed by theoretical calculations. The study revealed the corrosion morphology progression on aluminum alloy (Al, 0.5% Cu) under acidic chloride solution. This is due to defects and a higher copper content at the grain boundary. Direct galvanic current measurement, linear sweep voltammetry (LSV), and Tafel plots are used to measure corrosion current and potential. Hydrogen gas evolution was also observed (for the first time) in Cu/Al bimetallic interface in areas of active corrosion. Mechanistic insight that leads to effective prevention of aluminum bond pad corrosion is explored and discussed. (Chapter 4) Aluminum bond pad corrosion activity and mechanistic insight at a Cu/Al bimetallic interface typically used in microelectronic packages for automotive applications were investigated by means of optical and scanning electron microscopy (SEM), energy dispersive X-ray spectroscopy (EDX) and electrochemistry. Screening of corrosion variables (temperature, moisture, chloride ion concentration, pH) have been investigated to find their effect on corrosion rate and to better understand the Al/Cu bimetallic corrosion mechanism. The study revealed the corrosion morphology progression on aluminum alloy (Al, 0.5% Cu) under acidic chloride solution. The corrosion starts as surface roughening which evolves into a dendrite structure and later continues to grow into a mud-crack type corrosion. SEM showed the early stage of corrosion with dendritic formation usually occurs at the grain boundary. This is due to defects and a higher copper content at the grain boundary. The impact of copper bimetallic contact on aluminum corrosion was explored by sputtering copper microdots on aluminum substrate. Copper micropattern screening revealed that the corrosion is activated on the Al/Cu interface area and driven by the large potential difference; it was also seen to proceed at much higher rates than those observed with bare aluminum. Direct galvanic current measurement, linear sweep voltammetry (LSV), and Tafel plots are used to measure corrosion current and potential. Hydrogen gas evolution was also observed (for the first time) in Cu/Al bimetallic interface in areas of active corrosion. Mechanistic insight that leads to effective prevention of aluminum bond pad corrosion is explored and discussed. Micropattern corrosion screening identified hydrogen evolution and bimetallic interface as the root cause of Al pad corrosion that leads to Cu ball lift-off, a fatal defect, in Cu wire bonded device. Complete corrosion inhibition can be achieved by strategically disabling the mutually coupled cathodic and anodic reaction cycles.

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