O projeto de sistemas eletrônicos atuais segue o paradigma do reuso de componentes de hardware. Este paradigma reduz a complexidade do projeto de um chip, mas cria novos desafios para o projetista do sistema em relação ao teste do produto final. O acesso aos núcleos profundamente embutidos no sistema, a integração dos diversos métodos de teste e a otimização dos diversos fatores de custo do sistema são alguns dos problemas que precisam ser resolvidos durante o planejamento do teste de produção do novo circuito. Neste contexto, esta tese propõe duas abordagens para o planejamento de teste de sistemas integrados. As abordagens propostas têm como principal objetivo a redução dos custos de teste através do reuso dos recursos de hardware disponíveis no sistema e da integração do planejamento de teste no fluxo de projeto do circuito. A primeira abordagem considera os sistemas cujos componentes se comunicam através de conexões dedicadas ou barramentos funcionais. O método proposto consiste na definição de um mecanismo de acesso aos componentes do circuito e de um algoritmo para exploração do espaço de projeto. O mecanismo de acesso prevê o reuso das conexões funcionais, o uso de barramentos de teste locais, núcleos transparentes e outros modos de passagem do sinal de teste. O algoritmo de escalonamento de teste é definido juntamente com o mecanismo de acesso, de forma que diferentes combinações de custos sejam exploradas. Além disso, restrições de consumo de potência do sistema podem ser consideradas durante o escalonamento dos testes. Os resultados experimentais apresentados para este método mostram claramente a variedade de soluções que podem ser exploradas e a efi- ciência desta abordagem na otimização do teste de um sistema complexo. A segunda abordagem de planejamento de teste propõe o reuso de redes em-chip como mecanismo de acesso aos componentes dos sistemas construídos sobre esta plataforma de comunicação. Um algoritmo de escalonamento de teste que considera as restrições de potência da aplicação é apresentado e a estratégia de teste é avaliada para diferentes configurações do sistema. Os resultados experimentais mostram que a capacidade de paralelização da rede em-chip pode ser explorada para reduzir o tempo de teste do sistema, enquanto os custos de área e pinos de teste são drasticamente minimizados. Neste manuscrito, os principais problemas relacionados ao teste dos sistemas integrados baseados em componentes virtuais são identificados e as soluções já apresentadas na literatura são discutidas. Em seguida, os problemas tratados por este traballho são listados e as abordagens propostas são detalhadas. Ambas as técnicas são validadas através dos sistemas disponíveis no ITC’02 SoC Test Benchmarks. As técnicas propostas são ainda comparadas com outras abordagens de teste apresentadas recentemente. Esta comparação confirma a eficácia dos métodos desenvolvidos nesta tese. / Electronic applications are currently developed under the reuse-based paradigm. This design methodology presents several advantages for the reduction of the design complexity, but brings new challenges for the test of the final circuit. The access to embedded cores, the integration of several test methods, and the optimization of the several cost factors are just a few of the several problems that need to be tackled during test planning. Within this context, this thesis proposes two test planning approaches that aim at reducing the test costs of a core-based system by means of hardware reuse and integration of the test planning into the design flow. The first approach considers systems whose cores are connected directly or through a functional bus. The test planning method consists of a comprehensive model that includes the definition of a multi-mode access mechanism inside the chip and a search algorithm for the exploration of the design space. The access mechanism model considers the reuse of functional connections as well as partial test buses, cores transparency, and other bypass modes. The test schedule is defined in conjunction with the access mechanism so that good trade-offs among the costs of pins, area, and test time can be sought. Furthermore, system power constraints are also considered. This expansion of concerns makes it possible an efficient, yet fine-grained search, in the huge design space of a reuse-based environment. Experimental results clearly show the variety of trade-offs that can be explored using the proposed model, and its effectiveness on optimizing the system test plan. Networks-on-chip are likely to become the main communication platform of systemson- chip. Thus, the second approach presented in this work proposes the reuse of the on-chip network for the test of the cores embedded into the systems that use this communication platform. A power-aware test scheduling algorithm aiming at exploiting the network characteristics to minimize the system test time is presented. The reuse strategy is evaluated considering a number of system configurations, such as different positions of the cores in the network, power consumption constraints and number of interfaces with the tester. Experimental results show that the parallelization capability of the network can be exploited to reduce the system test time, whereas area and pin overhead are strongly minimized. In this manuscript, the main problems of the test of core-based systems are firstly identified and the current solutions are discussed. The problems being tackled by this thesis are then listed and the test planning approaches are detailed. Both test planning techniques are validated for the recently released ITC’02 SoC Test Benchmarks, and further compared to other test planning methods of the literature. This comparison confirms the efficiency of the proposed methods.

The high cost of chip testing makes testability an important aspect of any chip design. Two important testability considerations are addressed namely, the power consumption and test quality. The power consumption during shift is reduced by efficiently adding control logic to the design. Test quality is studied by determining the sensitization characteristics of a path to be tested. The path delay fault models have been used for the purpose of studying this problem. Another important aspect in chip design is performance validation, which is increasingly perceived as the major bottleneck in integrated circuit design. Given the synthesizable HDL code, the proposed technique will efficiently identify infeasible paths, subsequently, it determines the worst case execution time (WCET) in the HDL code.

O projeto de sistemas eletrônicos atuais segue o paradigma do reuso de componentes de hardware. Este paradigma reduz a complexidade do projeto de um chip, mas cria novos desafios para o projetista do sistema em relação ao teste do produto final. O acesso aos núcleos profundamente embutidos no sistema, a integração dos diversos métodos de teste e a otimização dos diversos fatores de custo do sistema são alguns dos problemas que precisam ser resolvidos durante o planejamento do teste de produção do novo circuito. Neste contexto, esta tese propõe duas abordagens para o planejamento de teste de sistemas integrados. As abordagens propostas têm como principal objetivo a redução dos custos de teste através do reuso dos recursos de hardware disponíveis no sistema e da integração do planejamento de teste no fluxo de projeto do circuito. A primeira abordagem considera os sistemas cujos componentes se comunicam através de conexões dedicadas ou barramentos funcionais. O método proposto consiste na definição de um mecanismo de acesso aos componentes do circuito e de um algoritmo para exploração do espaço de projeto. O mecanismo de acesso prevê o reuso das conexões funcionais, o uso de barramentos de teste locais, núcleos transparentes e outros modos de passagem do sinal de teste. O algoritmo de escalonamento de teste é definido juntamente com o mecanismo de acesso, de forma que diferentes combinações de custos sejam exploradas. Além disso, restrições de consumo de potência do sistema podem ser consideradas durante o escalonamento dos testes. Os resultados experimentais apresentados para este método mostram claramente a variedade de soluções que podem ser exploradas e a efi- ciência desta abordagem na otimização do teste de um sistema complexo. A segunda abordagem de planejamento de teste propõe o reuso de redes em-chip como mecanismo de acesso aos componentes dos sistemas construídos sobre esta plataforma de comunicação. Um algoritmo de escalonamento de teste que considera as restrições de potência da aplicação é apresentado e a estratégia de teste é avaliada para diferentes configurações do sistema. Os resultados experimentais mostram que a capacidade de paralelização da rede em-chip pode ser explorada para reduzir o tempo de teste do sistema, enquanto os custos de área e pinos de teste são drasticamente minimizados. Neste manuscrito, os principais problemas relacionados ao teste dos sistemas integrados baseados em componentes virtuais são identificados e as soluções já apresentadas na literatura são discutidas. Em seguida, os problemas tratados por este traballho são listados e as abordagens propostas são detalhadas. Ambas as técnicas são validadas através dos sistemas disponíveis no ITC’02 SoC Test Benchmarks. As técnicas propostas são ainda comparadas com outras abordagens de teste apresentadas recentemente. Esta comparação confirma a eficácia dos métodos desenvolvidos nesta tese. / Electronic applications are currently developed under the reuse-based paradigm. This design methodology presents several advantages for the reduction of the design complexity, but brings new challenges for the test of the final circuit. The access to embedded cores, the integration of several test methods, and the optimization of the several cost factors are just a few of the several problems that need to be tackled during test planning. Within this context, this thesis proposes two test planning approaches that aim at reducing the test costs of a core-based system by means of hardware reuse and integration of the test planning into the design flow. The first approach considers systems whose cores are connected directly or through a functional bus. The test planning method consists of a comprehensive model that includes the definition of a multi-mode access mechanism inside the chip and a search algorithm for the exploration of the design space. The access mechanism model considers the reuse of functional connections as well as partial test buses, cores transparency, and other bypass modes. The test schedule is defined in conjunction with the access mechanism so that good trade-offs among the costs of pins, area, and test time can be sought. Furthermore, system power constraints are also considered. This expansion of concerns makes it possible an efficient, yet fine-grained search, in the huge design space of a reuse-based environment. Experimental results clearly show the variety of trade-offs that can be explored using the proposed model, and its effectiveness on optimizing the system test plan. Networks-on-chip are likely to become the main communication platform of systemson- chip. Thus, the second approach presented in this work proposes the reuse of the on-chip network for the test of the cores embedded into the systems that use this communication platform. A power-aware test scheduling algorithm aiming at exploiting the network characteristics to minimize the system test time is presented. The reuse strategy is evaluated considering a number of system configurations, such as different positions of the cores in the network, power consumption constraints and number of interfaces with the tester. Experimental results show that the parallelization capability of the network can be exploited to reduce the system test time, whereas area and pin overhead are strongly minimized. In this manuscript, the main problems of the test of core-based systems are firstly identified and the current solutions are discussed. The problems being tackled by this thesis are then listed and the test planning approaches are detailed. Both test planning techniques are validated for the recently released ITC’02 SoC Test Benchmarks, and further compared to other test planning methods of the literature. This comparison confirms the efficiency of the proposed methods.

Cette thèse vise l’étude de techniques de type BIST pour un front-end RF, considérant des nouveaux types des capteurs intégrés très simples pour l’extraction de signaux. Ces signaux et les stimuli de test associés seront par la suite traités par des algorithmes de l’apprentissage automatique qui devront permettre une prédiction des performances des différents blocs du système. Une évaluation des capteur proposés en tant que métriques de test paramétrique et couverture des fautes catastrophique sera nécessaire pour pouvoir aboutir à des techniques de test à bas coût pour le test de production, permettant une réduction importante du coût de revient des produits. / This thesis aims to study techniques such BIST for RF front-end, whereas new types of simple integrated sensors for signal extraction. These signals and stimuli associated test will then be processed by machine learning algorithms that will allow prediction of the performance of different blocks of the system. An evaluation of the proposed sensor as parametric test metrics and coverage of catastrophic faults will be needed to reach test techniques for low-cost production test, allowing a significant reduction in the cost of products

O projeto de sistemas eletrônicos atuais segue o paradigma do reuso de componentes de hardware. Este paradigma reduz a complexidade do projeto de um chip, mas cria novos desafios para o projetista do sistema em relação ao teste do produto final. O acesso aos núcleos profundamente embutidos no sistema, a integração dos diversos métodos de teste e a otimização dos diversos fatores de custo do sistema são alguns dos problemas que precisam ser resolvidos durante o planejamento do teste de produção do novo circuito. Neste contexto, esta tese propõe duas abordagens para o planejamento de teste de sistemas integrados. As abordagens propostas têm como principal objetivo a redução dos custos de teste através do reuso dos recursos de hardware disponíveis no sistema e da integração do planejamento de teste no fluxo de projeto do circuito. A primeira abordagem considera os sistemas cujos componentes se comunicam através de conexões dedicadas ou barramentos funcionais. O método proposto consiste na definição de um mecanismo de acesso aos componentes do circuito e de um algoritmo para exploração do espaço de projeto. O mecanismo de acesso prevê o reuso das conexões funcionais, o uso de barramentos de teste locais, núcleos transparentes e outros modos de passagem do sinal de teste. O algoritmo de escalonamento de teste é definido juntamente com o mecanismo de acesso, de forma que diferentes combinações de custos sejam exploradas. Além disso, restrições de consumo de potência do sistema podem ser consideradas durante o escalonamento dos testes. Os resultados experimentais apresentados para este método mostram claramente a variedade de soluções que podem ser exploradas e a efi- ciência desta abordagem na otimização do teste de um sistema complexo. A segunda abordagem de planejamento de teste propõe o reuso de redes em-chip como mecanismo de acesso aos componentes dos sistemas construídos sobre esta plataforma de comunicação. Um algoritmo de escalonamento de teste que considera as restrições de potência da aplicação é apresentado e a estratégia de teste é avaliada para diferentes configurações do sistema. Os resultados experimentais mostram que a capacidade de paralelização da rede em-chip pode ser explorada para reduzir o tempo de teste do sistema, enquanto os custos de área e pinos de teste são drasticamente minimizados. Neste manuscrito, os principais problemas relacionados ao teste dos sistemas integrados baseados em componentes virtuais são identificados e as soluções já apresentadas na literatura são discutidas. Em seguida, os problemas tratados por este traballho são listados e as abordagens propostas são detalhadas. Ambas as técnicas são validadas através dos sistemas disponíveis no ITC’02 SoC Test Benchmarks. As técnicas propostas são ainda comparadas com outras abordagens de teste apresentadas recentemente. Esta comparação confirma a eficácia dos métodos desenvolvidos nesta tese. / Electronic applications are currently developed under the reuse-based paradigm. This design methodology presents several advantages for the reduction of the design complexity, but brings new challenges for the test of the final circuit. The access to embedded cores, the integration of several test methods, and the optimization of the several cost factors are just a few of the several problems that need to be tackled during test planning. Within this context, this thesis proposes two test planning approaches that aim at reducing the test costs of a core-based system by means of hardware reuse and integration of the test planning into the design flow. The first approach considers systems whose cores are connected directly or through a functional bus. The test planning method consists of a comprehensive model that includes the definition of a multi-mode access mechanism inside the chip and a search algorithm for the exploration of the design space. The access mechanism model considers the reuse of functional connections as well as partial test buses, cores transparency, and other bypass modes. The test schedule is defined in conjunction with the access mechanism so that good trade-offs among the costs of pins, area, and test time can be sought. Furthermore, system power constraints are also considered. This expansion of concerns makes it possible an efficient, yet fine-grained search, in the huge design space of a reuse-based environment. Experimental results clearly show the variety of trade-offs that can be explored using the proposed model, and its effectiveness on optimizing the system test plan. Networks-on-chip are likely to become the main communication platform of systemson- chip. Thus, the second approach presented in this work proposes the reuse of the on-chip network for the test of the cores embedded into the systems that use this communication platform. A power-aware test scheduling algorithm aiming at exploiting the network characteristics to minimize the system test time is presented. The reuse strategy is evaluated considering a number of system configurations, such as different positions of the cores in the network, power consumption constraints and number of interfaces with the tester. Experimental results show that the parallelization capability of the network can be exploited to reduce the system test time, whereas area and pin overhead are strongly minimized. In this manuscript, the main problems of the test of core-based systems are firstly identified and the current solutions are discussed. The problems being tackled by this thesis are then listed and the test planning approaches are detailed. Both test planning techniques are validated for the recently released ITC’02 SoC Test Benchmarks, and further compared to other test planning methods of the literature. This comparison confirms the efficiency of the proposed methods.

Two-dimensional scan design is an effective BIST architecture that uses multiple scan chains in parallel to test the Circuit Under Test (CUT). Linear Finite State Machines (LFSMs) are often used as on-board Pseudo Random Pattern Generators (PRPGs) in two-dimensional scan designs. However, linear dependencies present in the LFSM generated test-bit sequences adversely affect the resultant fault coverage in two-dimensional scan designs. In this work, we present methods that improve the resultant fault coverage in two-dimensional scan designs through the minimization of linear dependencies. Currently, metric of channel separation and matrix-based metric are used in order to estimate linear dependencies in a CUT. When the underlying sub-circuit (cone) structure of a CUT is available, the matrix-based metric can be used more effectively. Fisrt, we present two methods that use matrix-based metric and minimize the overall linear dependencies in a CUT through explicitly minimizing linear dependencies in the highest number of underlying cones of the CUT. The first method minimizes linear dependencies in a CUT through the selection of an appropriate LFSM structure. On the other hand, the second method synthesizes a phase shifter for a specified LFSM structure such that the overall linear dependencies in a CUT are minimized. However, the underlying structure of a CUT is not always available and in such cases the metric of channel separation can be used more effectively. The metric of channel separation is an empirical measure of linear dependencies and an ad-hoc large channel separation is imposed between the successive scan chains of a two-dimensional scan design in order to minimize the linear dependencies. Present techniques use LFSMs with additional phase shifters (LFSM/PS) as PRPGs in order to obtain desired levels of channel separation. We demonstrate that Generalized LFSRs (GLFSRs) are a better choice as PRPGs compared to LFSM/PS and obtain desired levels of channel separations at a lower hardware cost than the LFSM/PS. Experimental results corroborate the effectiveness of the proposed methods through increased levels of the resultant fault coverage in two-dimensional scan designs.

Depuis plusieurs années, la complexité des circuits intégrés ne cesse d'augmenter : du SOC (System On Chip) vers le SIP (System In Package), et plus récemment les circuits empilés en 3D : les 3D SIC (Stacked Integrated Circuits) à base de TSVs (Through Silicon Vias) interconnectant verticalement les tiers, ou puces, du système. Les 3D SIC présentent de nombreux avantages en termes de facteur de forme, de performance et de consommation mais demandent aussi de relever de nombreux défis en ce qui concerne leur test, étape nécessaire avant la mise en service de ces systèmes complexes. Dans cette thèse, nous nous attachons à définir les infrastructures de test qui permettront de détecter les éventuels défauts apparaissant lors de la fabrication des TSVs ou des différentes puces du système. Nous proposons une solution de BIST (Built In Self Test) pour le test avant empilement des TSVs. Cette solution est basée sur l'utilisation d'oscillateurs en anneaux dont la fréquence d'oscillation dépend des caractéristiques électriques des TSVs. La solution de test proposée permet non seulement la détection de TSVs fautifs mais aussi de renseigner sur le nombre d'éléments défectueux et leur identification. D'autre part, nous proposons une architecture de test 3D basée sur la nouvelle proposition de norme IEEE P1687. Cette infrastructure permet de donner accès aux composants du système 3D avant et après empilement. Elle permet d'autre part de profiter du recyclage des données de test développées et appliquées avant empilement pour chacun des tiers puis ré-appliqués durant ou après l'empilement. Ces travaux aboutissent finalement à l'ouverture d'une nouvelle problématique liée à l'ordonnancement des tests sous contraintes (puissance consommée, température).Mots-clés : test, circuits 3D, TSV, BIST, oscillateur en anneau, architecture de test 3D, IEEE P1687, test avant empilement, test après empilement. / For several years, the complexity of integrated circuits continues to increase, from SOC (System On Chip) to SIP (System In Package) , and more recently 3D SICs (Stacked Integrated Circuits) based on TSVs (Through Silicon Vias ) that vertically interconnect stacked circuits in a 3D system. 3D SICs have many advantages in terms of small form factor, high performances and low power consumption but have many challenges regarding their test which is a necessary step before the commissioning of these complex systems. In this thesis we focus on defining the test infrastructure that will detect any occurring defects during the manufacturing process of TSVs or the different sacked chips in the system. We propose a BIST (Built In Self Test) solution for TSVs testing before stacking, this solution is based on the use of ring oscillators which their oscillation frequencies depend on the electrical characteristics of the TSVs. The proposed test solution not only allows the detection of faulty TSVs but also gives information about the number of defective TSVs and their location. On the other hand, we propose a 3D DFT (Design For Test) architecture based on the new proposed test standard IEEE P1687. The proposed test architecture provides test access to the components of the 3D system before and after stacking. Also it allows the re-use of recycled test data developed and applied before stacking to each die in the mid-bond and post-bond test levels. This work lead to the opening of a new problem related to the test scheduling under constraints such as: power consumption, temperature.Keywords: test, 3D circuits, TSV, BIST, ring oscillators, 3D DFT architecture, IEEE P1687, pre-bond test, post-bond test.

In this dissertation we propose several DFT techniques specific to 3D stacked IC systems. The goal has explicitly been to create techniques that integrate easily with existing IC test systems. Specifically, this means utilizing scan- and wrapper-based techniques, two foundations of the digital IC test industry. First, we describe a general test architecture for 3D ICs. In this architecture, each tier of a 3D design is wrapped in test control logic that both manages tier test pre-bond and integrates the tier into the large test architecture post-bond. We describe a new kind of boundary scan to provide the necessary test control and observation of the partial circuits, and we propose a new design methodology for test hardcore that ensures both pre-bond functionality and post-bond optimality. We present the application of these techniques to the 3D-MAPS test vehicle, which has proven their effectiveness. Second, we extend these DFT techniques to circuit-partitioned designs. We find that boundary scan design is generally sufficient, but that some 3D designs require special DFT treatment. Most importantly, we demonstrate that the functional partitioning inherent in 3D design can potentially decrease the total test cost of verifying a circuit. Third, we present a new CAD algorithm for designing 3D test wrappers. This algorithm co-designs the pre-bond and post-bond wrappers to simultaneously minimize test time and routing cost. On average, our algorithm utilizes over 90% of the wires in both the pre-bond and post-bond wrappers. Finally, we look at the 3D vias themselves to develop a low-cost, high-volume pre-bond test methodology appropriate for production-level test. We describe the shorting probes methodology, wherein large test probes are used to contact multiple small 3D vias. This technique is an all-digital test method that integrates seamlessly into existing test flows. Our experimental results demonstrate two key facts: neither the large capacitance of the probe tips nor the process variation in the 3D vias and the probe tips significantly hinders the testability of the circuits. Taken together, this body of work defines a complete test methodology for testing 3D ICs pre-bond, eliminating one of the key hurdles to the commercialization of 3D technology.

En esta tesis se propone un método de diseño para test orientado hacia circuitos mixtos empotrados. El método de test está basado en el análisis del consumo de corriente dinámica (IDDX) tanto estacionaria como transitoria.Con objeto de procesar adecuadamente la información de los transitorios de corriente, la medida se efectúa internamente integrando dentro del chip un bloque sensor de corriente (BICS) junto al circuito bajo test (CUT). Se ha desarrollado una estructura del módulo sensor para otorgar más peso específico al muestreo de las componentes de alta frecuencia de la corriente.El método de test estructural propuesto busca disminuir el tiempo necesario para realizar el test y reducir la complejidad de los equipos de medida comúnmente utilizados en el test analógico. Por ello, el circuito sensor de corriente realiza un procesado de la información para proporcionar una firma digital que codifica el funcionamiento del circuito. La tesis también extiende la propuesta de test a circuitos de capacidades conmutadas (SC) utilizando un circuito sensor de carga integrado junto al circuito bajo test. / This thesis describes a design-for-test method for embedded mixed signal circuits. It is based on the analysis of the dynamic current consumption (IDDX), both quiescent and transient.In order to correctly process the information contained in the transient current, the measurement is performed by a built-in current sensor circuit (BICS) integrated within the circuit under test (CUT). A structure for the sensor block has been developed to give more specific weight to the high-frequency components of the current.The proposed structural test method aims to reduce the test time and the complexity of the measurement equipment commonly used in analog tests. Therefore, the current sensor performs internal data processing to provide a digital signature that encodes the circuit behaviour.The thesis also extends the test method to switched capacitor circuits (SC) using a charge sensor circuit integrated within the circuit under test.

Cette thèse discute le problème de test de production en grand volume des circuits radio-fréquences (RF) et à ondes millimétriques (mm-wave). Le test des fonctionnalités RF et à ondes millimétriques est très onéreux. Le test intégré est une alternative prometteuse pour faciliter la procédure et réduire les couts, mais il est difficile à mettre en œuvre car il ne faut en aucun cas qu'il réduit la performance du circuit sous test (CUT). Dans cette thèse, nous étudions une technique du test intégré qui repose sur l'utilisation de capteurs non-intrusifs qui prend en compte la variabilité du procédé de fabrication. Cette technique est extrêmement intéressante pour les concepteurs des circuits RF et mm-wave car il leur permet de dissocier le test de la conception. Les capteurs non-intrusifs sont constitués d'étages analogiques triviaux et de composants simples qui sont copiés de la topologie du CUT et sont placés sur la puce à proximité du CUT. Ils offrent simplement une "image" des variations du procédé de fabrication, ce qui leur permet de suivre les variations de performance du CUT. En substance, cette technique tire parti des phénomènes non désirés de variabilité de procédé de fabrication. Le paradigme du test alternatif est utilisé pour estimer les performances du CUT à partir des mesures des capteurs non intrusifs, afin de remplacer les tests standards qui mesurent les performances directement. Ce principe de test est appliqué à deux différents CUTs, nommément un amplificateur à bas bruit à 2.4GHz réalisé en CMOS 65nm et un amplificateur à bas bruit large bande à 60GHz réalisé en CMOS 65nm. Nous démontrons qu'en ajoutant quelques capteurs non-intrusifs sur la puce, qui n'engendrent pratiquement pas de surcout de surface, et en obtenant de ces capteurs non-intrusifs certaines mesures dans le domaine continu et à basse fréquence, nous sommes capable de suivre les variations de toutes les performances du CUT avec une erreur de prédiction moyenne inférieure à l’écart-type de la performance, et une erreur de prédiction maximum qui est inférieure ou au moins comparable aux erreurs de mesure dans un équipement de test automatisé conventionnel. / This thesis addresses the high-volume production test problem for RF and millimeter-wave (mm-wave) circuits. Testing the RF/mm-wave functions of systems-on-chip (SoCs) incurs a very high cost. Built-in test is a promising alternative to facilitate testing and reduce costs, but it is challenging since it should by no means degrade the performance of the Circuit Under Test (CUT). In this work, we study a built-in test technique which is based on non-intrusive variation-aware sensors. The non-intrusive property is very appealing for designers since the sensors are totally transparent to the design and, thereby, the test is completely dissociated from the design. The non-intrusive sensors are dummy analog stages and single layout components that are copied from the topology of the CUT and are placed on the die in close physical proximity to the CUT. They simply offer an “image” of process variations and by virtue of this they are capable of tracking variations in the performances of the CUT. In essence, the technique capitalizes on the undesired phenomenon of process variations. The alternate test paradigm is employed to map the outputs of the non-intrusive sensors to the performances of the CUT, in order to replace the standard tests for measuring the performances directly. The proposed test idea is applied to two different CUTs, namely a 2.4GHz CMOS 65nm inductive degenerated Low-Noise Amplifier (LNA) and a wide-band mm-wave 60GHz CMOS 65nm 3-stage LNA. We demonstrate that by adding on-chip a few non-intrusive sensors of practically zero area-overhead and by obtaining on these non-intrusive sensors DC or low-frequency measurements, we are able to track variations in all performances of the CUT with an average prediction error lower than one standard deviation of the performance and a maximum prediction error that is lower or at least comparable to the measurement and repeatability errors in a conventional Automatic Test Equipment (ATE) environment.