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Modeling and process optimization of solder paste stencil printing for micro-BGA and fine pitch surface mount assembly /Pan, Jianbiao, January 2000 (has links)
Thesis (Ph. D.)--Lehigh University, 2000. / Includes vita. Includes bibliographical references (leaves 101-106).
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Electroplating bonding technology for chip interconnect, wafer level packaging and interconnect layer structuresJoung, Yeun-Ho, January 2003 (has links) (PDF)
Thesis (Ph. D.)--School of Electrical and Computer Engineering, Georgia Institute of Technology, 2004. Directed by Mark G. Allen. / Vita. Includes bibliographical references (leaves 271-284).
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Development of a polymer-metal nanocomposite dielectric by in situ reduction for embedded capacitor applicationPothukuchi, Suresh V., January 2003 (has links) (PDF)
Thesis (M.S. in M.S.E.)--School of Materials Science and Engineering, Georgia Institute of Technology, 2004. Directed by C.P. Wong. / Includes bibliographical references (leaves 94-102).
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MEMS packaging with stereolithographyTse, Laam Angela 05 1900 (has links)
No description available.
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Palletization and design-of-simulations for large area processing and assembly in electronic packagingVariyam, Manjula N. 08 1900 (has links)
No description available.
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Thermo-mechanical behavior and reliability of High Density Interconnect (HDI) viasSmith, Kyle Edward 08 1900 (has links)
No description available.
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Study on thermally reworkable underfills for flip chip, BGA, and CSP applicationsWang, Lejun 05 1900 (has links)
No description available.
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Study of high K polymers for integral capacitor applicationsYue, Jireh Jon-Kai 12 1900 (has links)
No description available.
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No-flow underfill materials for environment sensitive flip-chip processZhang, Zhuqing 08 1900 (has links)
No description available.
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Steam driven delamination in electronics packages /Chong, Iok Tong. January 2002 (has links)
Thesis (M. Phil.)--Hong Kong University of Science and Technology, 2002. / Includes bibliographical references. Also available in electronic version. Access restricted to campus users.
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