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Packaging-compatible micromachined magnetic devices : integrated passive components and modulesPark, Jae Yeong 12 1900 (has links)
No description available.
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Process modeling and interfacial delamination in peripheral array packagesHarries, Richard 08 1900 (has links)
No description available.
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Thermochemical modeling of composite materials for base substrate applications in microelectronic systemsBassett, Julien 05 1900 (has links)
No description available.
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Study of polyarylene ether and its application in isotropically conductive adhesiveLiong, Silvia 08 1900 (has links)
No description available.
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Process development of double bump flip chip with enhanced reliability and finite element analysisYan, Wei, Johnson, R. Wayne, January 2005 (has links) (PDF)
Dissertation (Ph.D.)--Auburn University, 2005. / Abstract. Vita. Includes bibliographic references.
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Wafer level LED packaging with integrated DRIE trenches for encapsulation /Zhang, Rong. January 2008 (has links)
Thesis (M.Phil.)--Hong Kong University of Science and Technology, 2008. / Includes bibliographical references (leaves 76-80). Also available in electronic version.
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Health monitoring for damage initiation & progression during mechanical shock in electronic assembliesChoudhary, Prakriti, Lall, Pradeep. January 2007 (has links) (PDF)
Thesis(M.S.)--Auburn University, 2007. / Abstract. Vita. Includes bibliographic references.
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Theoretical analysis and experimental investigation of a "tower" heat pipe for desktop computer cooling /Duncan, Tyler Baxter. January 2004 (has links)
Thesis (M.S.)--University of Missouri-Columbia, 2004. / Typescript. Includes bibliographical references (leaves 59-60). Also available on the Internet.
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Theoretical analysis and experimental investigation of a "tower" heat pipe for desktop computer coolingDuncan, Tyler Baxter. January 2004 (has links)
Thesis (M.S.)--University of Missouri-Columbia, 2004. / Typescript. Includes bibliographical references (leaves 59-60). Also available on the Internet.
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Finite element analysis of nonlinear deformation mechanisms in semiconductor packages /Ayhan, Ali Osman, January 1999 (has links)
Thesis (Ph. D.)--Lehigh University, 2000. / Includes vita. Includes bibliographical references (leaves 246-255).
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