Global ETD Search

21	A multi-scale method for the prediction of delamination in electronic packages / Fan, Haibo. January 2005 (has links) Thesis (Ph.D.)--Hong Kong University of Science and Technology, 2005. / Includes bibliographical references. Also available in electronic version. Electronic packaging Laminates materials
22	Extreme service packaging for silicon carbide electronic devices Guinel, Maxime Jean-Franc̜ois. January 2006 (has links) (PDF) Thesis (Ph. D.)--Washington State University, May 2006. / Includes bibliographical references. Silicon carbide Electronic packaging.
23	Thermal deformation of electronic packages and packaging effect on reliability for copper/low-k interconnect structures Wang, Guotao, Ho, P. S. January 2004 (has links) (PDF) Thesis (Ph. D.)--University of Texas at Austin, 2004. / Supervisor: Paul S. Ho. Vita. Includes bibliographical references.
24	Eliminating package resonances in printed circuit boards over wide frequency band Bapu, Vijay Madhukar. January 2004 (has links) Thesis (M.S.)--State University of New York at Binghamton, Department of Electrical and Computer Engineering, 2004. / Includes bibliographical references. Printed circuits Electronic packaging.
25	Electroplating bonding technology for chip interconnect, wafer level packaging and interconnect layer structures Joung, Yeun-Ho 01 December 2003 (has links) No description available. Electronic packaging Microelectromechanical systems Microelectromechanical systems Electronic packaging
26	Development of a polymer-metal nanocomposite dielectric by in situ reduction for embedded capacitor application Pothukuchi, Suresh V. 01 December 2003 (has links) No description available. Dielectrics Research Electronic packaging Nanoparticles Dielectrics Research Electronic packaging Nanoparticles
27	Principal component regression models for thermo-mechanical reliability of plastic ball grid arrays on CU-core and no CU-core PCB assemblies in harsh environments Shirgaokar, Aniket, Lall, Pradeep. January 2009 (has links) Thesis--Auburn University, 2009. / Abstract. Vita. Includes bibliographic references (p.80-97).
28	Thermo-mechanical reliability of the VSPA package solder joints Murphy, R. Sean 12 1900 (has links) No description available. Solder and soldering Testing Electronic packaging Reliability Electronic packaging Testing
29	Enhance thermomechanical reliability of microsystems packaging through new base substrate and dielectric materials Hegde, Shashikant 05 1900 (has links) No description available. Electronic packaging Reliability Electronic packaging Thermal fatigue Dielectric devices
30	High throughput flip chip assembly process and reliability analysis using no-flow underfill materials Thorpe, Ryan 05 1900 (has links) No description available. Electronic packaging Materials Electronic packaging Reliability Surface mount technology

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