ABSTRACT Wireless communication products require thinner and small packaging to allow for reductions in Cell Phone and PDA product sizes. Currently, the Film-BGA (Ball Grid Array) package is in production for thinner and small case. The Film-BGA package is a thin package that uses polyimide tape as a substrate to reduce the overall package profile to 1 mm and ball pitch is 0.5 mm. The Film substrate can reach 0.11 mm thick or less. Analysis the Film-BGA model consists of a sequentially coupled thermal- mechanical analysis considering epoxy curing, post molding compound and IR-Reflow by MARC. After these processes Film-BGA will occur warpage and residual stress, we will study the sizes of materials on the warpage and residual stress by Taguchi Method. From the MARC analysis, it is found that due to the coefficient of thermal expansion (CTE) mismatch between solder ball, die, molding compound, epoxy and substrate, there exists very high stress near the interfaces of epoxy and results the maximum warpage (y-displacement) that occurs at the edge of the substrate after IR-Reflow. By means of the Taguchi Method, it is found that die size greatly affect the warpage of Film-BGA more than epoxy size and molding compound size. It is also found that epoxy size has more effect than die size and molding compound size on the residual stress of Film-BGA.

This study aims to investigate the effect of a 96 I/O Film-BGA package of surface mounted components on the thermal induced nonlinear viscoplastic deformation of solder balls during temperature cyclic loading between -40¢J to 125¢J. Specifically, it aims to study the trend effect of the joint fatigue life with respect to four control factors of the PI (Polyimide) thickness, die size, die thickness, and the upper copper trace thickness. Then, two different package types of Fan-in and Fan-out design in terms of the joint fatigue life are discussed. Due to the structure/loading symmetry, a three-dimension octant finite element structure was modeled to capture the entire package structural behaviors and a formulation of Modified Coffin-Manson was used to predict the joint fatigue life. Under temperature cyclic loading, the study results show that the die size, die thickness, and PI thickness had significant impact on the solder joint fatigue life, especially the effect of applying die size to the joint, but the upper copper trace thickness had little effect on the joint fatigue life. The study results also show that the package type of Fan-out design had higher joint fatigue life than that the package type of Fan-in design did for this Film-BGA package. In addition, by using the Taguchi method, the research could find the intensity of affected fatigue life due to the selected four control factors, and determine the optimized design by means of the optimized dimensions of the control factors. Then, the use of the ANOVA (analysis of variance) method helped the researcher predict the optimized joint fatigue life in comparison with the study results by using ANSYS finite element software analysis.

L'objectif de cette thèse est de développer des techniques de modélisation et de simulation multi-échelle avancées et efficaces pour étudier les phénomènes d'instabilité dans trois structures d'ingénierie courantes: membrane, film/substrat et structures sandwich, en combinant la technique des coefficients de Fourier lentement variables (TSVFC) et la méthode numérique asymptotique (ANM). À cette fin, basée sur les équations de la plaque de Von Karman, la TSVFC été utilisée pour développer un modèle de Fourier à bidimensionnel (2D) qui a également été implémenté dans ABAQUS via sa sous-routine UEL. Ensuite, un 2D modèle de Fourier est construit pour le film/substrat. En outre, en utilisant leurs caractéristiques de déformation, un 1D modèle de Fourier est développé en utilisant à la fois le TSVFC et le CUF. Par la suite, sur la base d'une cinématique Zig-Zag d'ordre supérieur, un 2D modèle de Fourier est déduit pour une plaque sandwich. Les équations directrices pour les modèles ci-dessus sont discrétisées par la méthode des éléments finis, et les systèmes non linéaires résultants sont résolus par le solveur non linéaire efficace et robuste ANM. Ces modèles sont ensuite adoptés pour étudier les instabilités dans ces structures. Les résultats montrent que les modèles établis peuvent simuler avec précision et efficacité divers phénomènes d'instabilité. En outre, on constate que l'instabilité membranaire est sensible aux conditions aux limites et qu'il existe un paramètre sans dimension presque constant près du point de bifurcation pour différents cas de charge et paramètres géométriques, ce qui peut être utile pour prédire rapidement l'apparition des rides / The main aim of this thesis is to develop advanced and efficient multi-scale modeling and simulation techniques to study instability phenomena in three common engineering structures, i.e., membrane, film/substrate and sandwich structures, by combining the Technique of Slowly Variable Fourier Coefficients (TSVFC) and the Asymptotic Numerical Method (ANM). Towards this end, based on the Von Karman plate equations, the TSVFC has been firstly used to develop a two-dimensional (2D) Fourier double-scale model for membrane, which has also been implemented into ABAQUS via its subroutine UEL. Then a 2D Fourier model is constructed for film/substrate. Further, making use of deformation features of the film/substrate, a 1D Fourier model is developed by using both the TSVFC and the Carrera’s Unified Formulation (CUF). Subsequently, based on high-order kinematics belonging to Zig-Zag theory, a 2D Fourier model is deduced for sandwich plate. The governing equations for the above models are discretized by the Finite Element Method, and the resulting nonlinear systems are solved by the efficient and robust nonlinear solver ANM. These models are then adopted to study instabilities in these structures. Results show that the established models could accurately and efficiently simulate various instability phenomena. Besides, it’s found that the membrane instability is very sensitive to boundary conditions, and there exists a dimensionless parameter that is almost constant near bifurcation point for various loading cases and geometric parameters, which may be helpful for fast predicting the occurrence of wrinkles