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Les micro-dispositifs comportant des structures libérées et mobiles sont d’une part très sensibles aux variations de leur environnement de travail, et d’autre part très fragiles mécaniquement. L’étape de découpe du substrat en plusieurs puces est extrêmement agressive et peut entrainer la destruction totale des micro-dispositifs. L’encapsulation avant la découpe va alors prémunir les micro-composants lors de cette étape critique et continuer à garantir leur bon fonctionnement tout au long de leur utilisation en conservant la stabilité et la fiabilité de leur performance. Le conditionnement doit en outre interfacer les micro-dispositifs encapsulés avec le monde macroscopique en vue de leur utilisation. De nombreux procédés de fabrication ont déjà été développés pour l’élaboration d’un conditionnement. C’est le cas de l’encapsulation puce par puce, substrat - substrat, par couche sacrificielle par exemple. Ils sont toutefois très contraignants (encombrement, compatibilité, coût, …). Nous avons étudié, au cours de cette thèse, un procédé innovant de conditionnement hermétique par transfert de film utilisant une couche à adhésion contrôlée. Cette technologie consiste à élaborer des capots protecteurs sur le substrat moule puis à les reporter collectivement pour encapsuler les micro-dispositifs. Ce procédé est totalement compatible avec un interfaçage électrique de composant qui traverse les cordons de scellement ou le capot. Ce procédé nécessite la maîtrise de la croissance de divers films (C, CxFy, Ni, AlN, parylène, BCB, Au-In) et permet d’obtenir des boitiers étanches, hermétiques et robustes qui devraient très rapidement pouvoir être utilisés pour le conditionnement de MEMS. / Micro-devices which are composed of free standing or mobile structures are very sensitive to the working condition and mechanically very fragile. The saw dicing steps is very aggressive and it can destroy the micro-devices. Packaging will prevent the micro devices from any damage during this critical step and also take care of it all along its life by controlling its performance stability and reliability. Moreover, the suited devices use needs a connection to the macroscopic word through the packaging. Many packaging process flow has already developed such as pick and place, wafer to wafer, thin film packaging with a sacrificial layer. Nevertheless, they have got many drawbacks (footprint, process compatibility, cost …). We have developed an attractive wafer level hermetic packaging process by film transfer technology during this these. It relies on a transferred molded film cap from a carrier wafer to the donor wafer. Electrical path can be done through the cap or the bonding ring. Cap manufacturing need a high layer growth skill for example in C, CxFy, Ni, AlN, parylène, BCB, Au-In films to make robust, hermetic encapsulation which should be soon used for MEMS packaging.

Made available in DSpace on 2015-04-11T13:41:40Z (GMT). No. of bitstreams: 1 Graciene _Siqueira.pdf: 2489522 bytes, checksum: bd087e1a5255602fcaa9049e5730b839 (MD5) Previous issue date: 2011-05-16 / CAPES - Coordenação de Aperfeiçoamento de Pessoal de Nível Superior / The study aimed to analyze the benefits and limitations of using digital technology in the development / production and distribution of cinema in Manaus. First stood the image production in contemporary society, a process examined by authors such as Nöth and Santaella (2008), Virilio (2002), Couchot (1993) and Dubois (2004), showing the main changes in the image production, suggesting a division from the technique used in this task by discussing how it interferes with the formation of image, starting with the photographic image to the image synthesis, computergenerated. Based on Machado (1997, 2008), Baudrillard (1991) and Santaella (2003) it was discussed the main features of the synthesized image and how it changed the landscape of visual art, especially cinema. Through Mattos (2006), Manovich (2001) Lipovetsky and Serroy (2009) it was analyzed the key technical developments in film, including sound and color, and then we get to image synthesis, their benefits and limitations. We then discussed the democratic aspect made possible by digital technology as a possible emergence of new producers to provide multiple image capture devices, creating new viewports productions, among others, providing the development of a film culture. As for the methodological approach, the research conducted survey descriptive / critical conditions of film production in Manaus, the use of questionnaire and interviews with the independent filmmakers. / O estudo objetivou analisar os benefícios e limitações do uso da tecnologia digital no desenvolvimento/produção e distribuição da cinematografia em Manaus. Primeiramente situou-se a produção imagética na contemporaneidade, processo analisado por autores como Nöth e Santaella (2008), Virilio (2002), Couchot (1993) e Dubois (2004), apontando as principais transformações na produção da imagem, propondo uma divisão a partir da técnica utilizada nessa tarefa, discutindo de que forma ela interfere na constituição imagética, iniciando pela imagem fotográfica até a imagem de síntese, gerada por computador. Já em Machado (1997;2008), Baudrillard (1991) e Santaella (2003) discutimos as principais características da imagem de síntese e de que forma ela modificou o cenário das artes visuais, especialmente o cinema. Por meio de Mattos (2006), Manovich (2001) e Lipovetsky e Serroy (2009) analisamos as principais evoluções técnicas no cinema, entre elas o som e a cor, para então chegarmos à imagem de síntese, seus benefícios e limitações. Discutimos a seguir o aspecto democrático da tecnologia digital como possibilidade do surgimento de novos produtores de imagens ao disponibilizar vários dispositivos de captação, a criação de novas janelas de exibição das produções, entre outros, propiciando o desenvolvimento de uma cultura cinematográfica. Quanto ao aporte metodológico, a pesquisa realizou um levantamento descritivo/crítico das condições de produção cinematográfica em Manaus, com a aplicação de questionário e de entrevistas junto aos realizadores independentes.