The wide-bandgap (WBG) devices, like gallium nitride (GaN) and silicon carbide (SiC) devices have proven to be a driving force of the development of the power conversion technology. Thanks to their distinct advantages over silicon (Si) devices including the faster switching speed and lower switching losses, WBG-based power converter can adopt a higher switching frequency and pursue higher power density and higher efficiency. As a trade-off of the advantages, there also exist the high-frequency-oriented challenges in the adoption of the GaN HEMT under research, including narrow safe gate operating area, increased switching overshoot, increased electromagnetic interference (EMI) in the gate loop and the power stages, the lack of the modules of packages for high current application, high gate oscillation under parallel operation. The dissertation is developed to addressed the all the challenges above to fully explore the potential of the GaN HEMTs. Due to the increased EMI emission in the gate loop, a small isolated capacitor in the gate driver power supply is needed to build a high-impedance barrier in the loop to protect the gate driver from interference. A 2 W dual-output gate driver power supply with ultra-low isolation capacitor for 650 V GaN-based half bridge is presented, featuring a PCB-embedded transformer substrate, achieving 85% efficiency, 1.6 pF isolation capacitor with 72 W/in3 power density. The effectiveness of the EMI reduction using the proposed power supply is demonstrated. The design consideration to build a compact 650 V GaN switching cell is presented then to address the challenges in the PCB layout and the thermal management. With the switching cell, a compact 1 kW 400 Vdc three-phase inverter is built and can operate with 500 kHz switching frequency. With the inverter, the high switching frequency effects on the inverter efficiency, volume, EMI emission and filter design are assessed to demonstrate the tradeoff of the adoption of high switching frequency in the motor drive application. In order to reduce the inverter CM EMI emission above 10 MHz, an active gate driver for 650 V GaN HEMT is proposed to control the dv/dt during turn-on and turn-off independently. With the control strategy, the penalty from the switching loss can be reduced. To build a high current power converter, paralleling devices is a normal approach. The dissertation comes up with the switching cell design using paralleled two and four 650 V GaN HEMTs with minimized and symmetric gate and power loop. The commutation between the paralleled HEMTs is analyzed, based on which the effects from the passive components on the gate oscillation are quantified. With the switching cell using paralleled GaN HEMTs, a 10 kW LLC resonant converter with the integrated litz-wire transformer is designed, achieving 97.9 % efficiency and 131 W/in3 power density. The design consideration to build the novel litz-wire transformer operated at 400 kHz switching frequency is also presented. In all, this work focuses on providing effective solutions or guidelines to adopt the 650 V GaN HEMT in the high frequency, high power density, high efficiency power conversion and demonstrates the advance of the GaN HEMTs in the hard-switched and soft-switched power converters. / Ph. D. / Silicon (Si) -based power semiconductor has developed several decades and achieved numerous outstanding performances, contributing a fast development of the power electronics. While the theatrical limit of the silicon semiconductor is almost reached limiting the progress speed to purse the high-efficiency, high-density high-reliability power conversion, the new material, including gallium-nitride (GaN) and silicon-carbide (SiC), based semiconductor, becomes the driven force to retain the development. Compared with Si-based device, GaN and SiC device own a faster switching speed and a lower on-resistance, enabling the adoption of high switching frequency and the possibility to increase the efficiency, power density and dynamic response. The GaN-based semiconductor is explored to be an even promising game changer than SiC device thanks to a higher theoretical ceiling. However, to adopt GaN-based semiconductors and fully utilize its benefits with high switching frequency, there are numerous high-frequency-oriented challenges, including high frequency oscillation at device termination, increased electromagnetic interference (EMI), the lack of the modules of packages for high current application, high frequency oscillation under parallel operation. The dissertation is developed to address the key high-frequency-oriented challenges to adopt GaN-based semiconductors in the power conversion and come up with the novel design strategy and analysis for high-switching-frequency power conversion using GaN devices. To the reduce the increased EMI emission in the gate loop, a novel PCB-embedded transformer structure is proposed to maintain a low isolation capacitor in the gate driver power supply for the GaN phase leg. With the proposed technique, the dual-output gate driver power supply can achieve high efficiency (85%), ultra-low isolation capacitor (1.6 pF) with high power density (72 W/in³ ). To reduce the high frequency oscillation at the GaN device termination, the strategy to layout GaN devices and its gate driver is proposed with corresponding thermal management. A compact structure for three-phase inverter is then presented, operating with a very high switching frequency (500 kHz). Within the inverter, the high switching frequency effects on the inverter performances are assessed to demonstrate the tradeoff and bottle neck to adopt high switching frequency in the motor drive application. In order to reduce the inverter EMI emission at high frequency ( >10 MHz), an active gate driver for GaN device is proposed for the active dv/dt control strategy. To build a high current power converter, the strategy to parallel GaN devices is proposed in the dissertation with the analysis on the commutation between the paralleled GaN devices. A high-frequency high-current litz-wire transformer structure for LLC resonant converter is presented with modeling and optimization. With the technique, a 10 kW LLC resonant converter achieves high efficiency (97.9 %) and high power density (131 W/in³).

With a higher power rating and broader application, Gallium nitride (GaN) is a promising next-generation power switch. The current four GaN HEMTs in paralleled phase leg that can block 400 V and conduct 200 A current is very beneficial, thus making the protection method on a GaN phase leg an urgent topic. This thesis starts with an overview of shortcircuit robustness among silicon (Si), silicon carbide (SiC) and GaN devices. An approximately safe operation area (SOA) for a GaN power switch will also be determined. The various common shortcircuit protection methods are mentioned. Additionally, current research on a GaN semiconductor is summarized. Among all of the protection methods, desaturation detection is selected and analyzed through simulation and then implemented in a parallel enhancement-mode high-electron-mobility transistor (E-HEMT) GaN phase leg. With this desaturation detection feature, the GaN E-HEMT can be turned off as quickly as 200 ns, and in the worst case, 500 ns, during a shortcircuit test. The phase leg survived a series of shortcircuit tests with shortcircuit protection. For the proposed protection scheme, the best-case reaction time (200 ns) is similar to others in the literature, while the shortcircuit peak current and peak energy are higher. The worst-case performance of this design is limited by both the gate driver and the device shortcircuit robustness. Due to the fast switching speed of the GaN HEMT, the false turn-on phenomenon caused by the Miller effect can be a problem. A shoot through may occur with one switch false turn on. The Miller clamp is added to the phase leg to improve its reliability. After the hardware was implemented, the Miller clamp was tested and verified through a double pulse test (DPT). Compared to the phase leg without the Miller clamp, the gate is better protected from gate voltage overshoot and undershoot. The switching loss is reduced by 20 percent by using a new gate driver IC with higher current driving capability. The degradation effect of GaN power switches in different shortcircuit pulses was also studied. The device passes through the shortcircuit tests, but any degradation effect that may change its parameters and influence its normal operation characteristic need to be addressed. Several GaN devices were selected and characterized after several shortcircuit tests to observe any degradation effect caused by the shortcircuit. The degradation test results reveal a "recovery effect" of the GaN HEMT used in this project. The parameter variations on threshold voltage and on-resistance recover to the original state, several hours after the shortcircuit test. The test results match with the conclusion drawn in degradation test conducts by other research groups that the parameter variation during shortcircuit test is negligible. Also, repetitively fast shortcircuit tests on the GaN HEMT show that the shortcircuit protection limit for this device under 400 V bus should be limited to 300 ns. / Master of Science

Surge-energy robustness is essential for power devices in many applications such as automotive powertrains and electricity grids. While Si and SiC MOSFETs can dissipate surge energy via avalanche, the GaN high-electron-mobility transistor (HEMT) has no avalanche capability and withstands surge energy by its overvoltage capability. However, a comprehensive study into the surge-energy robustness of the cascode GaN HEMT, a composite device made of a GaN HEMT and a Si metal-oxide-semiconductor field-effect-transistor (MOSFET), is still lacking. This work fills this gap by investigating the failure and degradation of 650-V-rated cascode GaN HEMTs in single-event and repetitive unclamped inductive switching (UIS) tests. The cascode was found to withstand surge energy by the overvoltage capability of the GaN HEMT, accompanied by an avalanche in the Si MOSFET. In single-event UIS tests, the cascode failed in the GaN HEMT at a peak overvoltage of 1.4~1.7 kV, which is statistically lower than the device's static breakdown voltage (1.8~2.2 kV). In repetitive UIS tests, the device failure boundary was found to be frequency-dependent. At 100 kHz, the failure boundary (~1.3 kV) was even lower than the single-event UIS boundary. After 1 million cycles of 1.25-kV UIS stresses, devices showed significant but recoverable parametric shifts. Physics-based device simulation and modeling were then performed to understand the circuit test results. The electron trapping in the buffer layer of the GaN HEMT can explain all the above failure and degradation behaviors in the GaN HEMT and the resulted change in its dynamic breakdown voltage. Moreover, the GaN buffer trapping is believed to be assisted by the Si MOSFET avalanche. An analytical model was also developed to extract the charges and losses produced in the Si avalanche in a UIS cycle. These results provide new insights into the surge-energy and overvoltage robustness of cascode GaN HEMTs. / M.S. / Power conversion technologies are now inseparable in industrial and commercial applications with widespread solar panels, laptops, data centers, and electric vehicles. Power devices are the critical components of power conversion systems. Since the introduction of Si power metal-oxide-semiconductor field-effect-transistor (MOSFET) in the mid-1970s, it has become the go-to device that enables efficient and reliable power conversion. After decades of practice on Si MOSFET, the device performance has reached the theoretical limit of the Si material. The recent introduction of wide-bandgap (WBG) power transistors, represented by silicon carbide (SiC) and gallium nitride (GaN) devices with superior figures of merits, opens the door for faster and more efficient power systems. To exploit the benefits of WBG devices, researchers need to evaluate the reliability and robustness of these devices comprehensively. The work presented here provides a study on the robustness of one mainstream GaN power transistor – the cascode GaN high-electron-mobility transistor (HEMT). This robustness test replicates the surge events in power electronics systems and exams their impact on power devices. Over the years, people have thoroughly investigated the surge-energy robustness of Si MOSFETs and concluded that Si MOSFETs are very robust against these surge events thanks to the avalanche mechanism. However, GaN HEMTs lack p-n junction structures between the two major electrodes, leading to the lack of avalanche ability. Instead, GaN HEMTs rely on the overvoltage capability to sustain the surge energy. For the first time, this work evaluates the surge-energy and overvoltage ruggedness of cascode GaN HEMTs, a major player in the GaN power device market. By analyzing the device failure mechanism and degradation behaviors, this research work provides insight into the weakness of these devices for both device designers and application engineers.

Pulsed power systems are concerned with the delivery of significant amounts of power in a greatly condensed time frame. To achieve this, energy is often stored in a capacitor, where it can be rapidly discharged. Certain applications require repeated charging and discharging of the load capacitor in a specifically modulated manner; special power electronics systems must be developed for these situations. Existing systems on the market sacrifice a small form factor for greater pulsed power output. The proposed design outlines the development of a compact pulsed power capacitor charger capable of charging a load capacitor to high voltages at a pulse repetition frequency of 30 kHz. Due to the compact form factor, the charger features a unique design of four full-bridge converters modularly connected in Input-Parallel Output-Series configuration. Experimental verification shows that the system exceeds expectations and can be utilized and adapted to fit many pulsed power applications.

This thesis deals with the research work carried out on the properties and applications such as GaN nanoparticles, Graphene etc. Chapter 1 of the thesis gives introduction to nanomaterials and various aspects of the thesis. Chapter 2 of the thesis describes the synthesis of GaN nanocrystals and their use as white light sources and as room temperature gas sensors. It also discusses negative differential resistance above room temperature exhibited by GaN. Electroluminescence from GaN-polymer heterojunction forms the last section of this chapter. Chapter 3 demonstrates the role of defect concentration on the photodetecting properties of ZnO nanorods with different defects prepared at different temperatures. Chapter 4 presents remarkable infrared and ultraviolet photodetector properties of reduced graphene oxide and graphene nanoribbons. Chapter 5 presents the infrared detecting properties of graphene-like few-layer MoS2. The summary of the thesis is given at the end of the thesis.

The present work has been focused on the growth of Group III-nitride epitaxial layers and nanostructures on Si (111) substrates by plasma-assisted molecular beam epitaxy. Silicon is regarded as a promising substrate for III-nitrides, since it is available in large quantity, at low cost and compatible to microelectronics device processing. However, three-dimensional island growth is unavoidable for the direct growth of GaN on Si (111) because of the extreme lattice and thermal expansion coefficient mismatch. To overcome these difficulties, by introducing β-Si3N4 buffer layer, the yellow luminescence free GaN can be grow on Si (111) substrate. The overall research work carried out in the present study comprises of five main parts. In the first part, high quality, crack free and smooth surface of GaN and InN epilayers were grown on Si(111) substrate using the substrate nitridation process. Crystalline quality and surface roughness of the GaN and InN layers are extremely sensitive to nitridation conditions such as nitridation temperature and time. Raman and PL studies indicate that the GaN film obtained by the nitridation sequences has less tensile stress and optically good. The optical band gaps of InN are obtained between ~0.73 to 0.78 eV and the blueshift of absorption edge can be induced by background electron concentration. The higher electron concentration brings in the larger blueshift, due to a possible Burstein–Moss effect. InN epilayers were also grown on GaN/Si(111) substrate by varying the growth parameters such as indium flux, substrate temperature and RF power. In the second part, InGaN/Si, GaN/Si3N4/n-Si and InN/Si3N4/n-Si heterostructures were fabricated and temperature dependent electrical transport behaviors were studied. Current density-voltage plots (J-V-T) of InGaN/Si heterostructure revealed that the ideality factor and Schottky barrier height are temperature dependent and the incorrect values of the Richardson’s constant produced, suggests an inhomogeneous barrier at the heterostructure interface. The higher value of the ideality factor compared to the ideal value and its temperature dependence suggest that the current transport is primarily dominated by thermionic field emission rather than thermionic emission. The valence band offset of GaN/β-Si3N4/Si and InGaN/Si heterojunctions were determined by X-ray photoemission spectroscopy. InN QDs on Si(111) substrate by droplet epitaxy and S-K growth method were grown in the third part. Single-crystalline structure of InN QDs (droplet epitaxy) was verified by TEM and the chemical bonding configurations of InN QDs were examined by XPS. The interdigitated electrode pattern was created and (I-V) characteristics of InN QDs were studied in a metal–semiconductor–metal configuration in the temperature range of 80–300 K. The I-V characteristics of lateral grown InN QDs were explained by using the trap model. A systematic manipulation of the morphology, optical emission and structural properties of InN/Si (111) QDs (S-K method) is demonstrated by changing the growth kinetics parameters such as flux rate and growth time. The growth kinetics of the QDs has been studied through the scaling method and observed that the distribution of dot sizes, for samples grown under varying conditions, has followed the scaling function. In the fourth part, InN nanorods (NRs) were grown on Si(111) and current transport properties of NRs/Si heterojunctions were studied. The rapid rise and decay of infrared on/off characteristics of InN NRs/Si heterojunction indicate that the device is highly sensitive to the IR light. Self-aligned GaN nanodots were grown on semi-insulating Si(111) substrate. The interdigitated electrode pattern was created on nanodots using photolithography and dark as well as UV photocurrent were studied. Surface band gaps of InN QDs were estimated from scanning tunneling spectroscopy (STS) I-V curves in the last part. It is found that band gap is strongly dependent on the size of InN QDs. The observed size-dependent STS band gap energy blueshifts as the QD’s diameter or height was reduced.

In this thesis I present and discuss the results of optical spectroscopy performed on InGaN/GaN single and multiple quantum well (QW) structures. I report on the optical properties of InGaN/GaN single and multiple QW structures, measured at high excitation power densities. I show a correlation exists between the reduction in PL efficiency at high excitation power densities, the phenomenon so-called ``efficiency-droop'', and a broadening of the PL spectra. I also show a distinct change in recombination dynamics, measured by time-resolved photoluminescence (PL), which occurs at the excitation power densities for which efficiency droop is measured. The broadening of the PL spectra at high excitation power densities is shown to occur due to a rapidly redshifting, short-lived high energy emission band. The high energy emission band is proposed to be due to the recombination of weakly localised/delocalised carriers occurring as a consequence of the progressive saturation of the local potential fluctuations responsible for carrier localisation, at high excitation power densities. I report on the effects of varying threading dislocation (TD) density on the optical properties of InGaN/GaN multiple QW structures. No systematic relationship exists between the room temperature internal quantum efficiency (IQE) and the TD density, in a series of nominally identical InGaN/GaN multiple QWs deposited on GaN templates of varying TD density. I also show the excitation power density dependence of the PL efficiency, at room temperatures, is unaffected for variation in the TD density between 2 x107 and 5 x109 cm-2. The independence of the optical properties to TD density is proposed to be a consequence of the strong carrier localisation, and hence short carrier diffusion lengths. I report on the effects of including an InGaN underlayer on the optical and microstructural properties of InGaN/GaN multiple QW structures. I show an increase in the room temperature IQE occurs for the structure containing the InGaN underlayer, compared to the reference. I show using PL excitation spectroscopy that an additional carrier transfer and recombination process occurs on the high energy side of the PL spectrum associated with the InGaN underlayer. Using PL decay time measurements I show the additional recombination process for carriers excited in the underlayer occurs on a faster timescale than the recombination at the peak of the PL spectrum. The additional contribution to the spectrum from the faster recombination process is proposed as responsible for the increase in room temperature IQE.

No description available.

Group III-nitride semiconductors have received much research attention and witnessed a significant development due to their ample applications in solid-state lighting and high-power/high-frequency electronics. Numerous growth methods were explored to achieve device quality epitaxial III-nitride semiconductors. Among the growth methods for III-nitride semiconductors, molecular beam epitaxy provides advantages such as formation of abrupt interfaces and in-situ monitoring of growth. The present research work focuses on the growth and characterizations of III-nitride based epitaxial films, nanostructures and heterostructures on c-sapphire substrate using plasma-assisted molecular beam epitaxy system. The correlation between structural, optical and electrical properties of III-nitride semiconductors would be extremely useful. The interfaces of the metal/semiconductor and semiconductor heterostructures are very important in the performance of semiconductor devices. In this regard, the electrical transport studies of metal/semiconductor and semiconductor heterostructures have been carried out. Besides, studies involved with the defect induced room temperature ferromagnetism of GaN films and InN nano-structures have also been carried out. The thesis is organized in eight different chapters and a brief overview of each chapter is given below. Chapter 1 provides a brief introduction on physical properties of group III-nitride semiconductors. It also describes the importance of III-nitride heterostructures in the operation of optoelectronic devices. In addition, it also includes the current strategy of the emergence of room temperature ferromagnetism in III-nitride semiconductors. Chapter 2 deals with the basic working principles of molecular beam epitaxy system and different characterization tools employed in the present work. Chapter 3 describes the growth of GaN films on c-sapphire by plasma-assisted molecular beam epitaxy. The effects of N/Ga flux ratio on structural, morphological and optical properties have been studied. The flux ratio plays a major role in controlling crystal quality, morphology and emission properties of GaN films. The dislocation density is found to increase with increase in N/Ga flux ratio. The surface morphologies of the films as seen by scanning electron microscopy show pits on the surface and found that the pit density on the surface increases with flux ratio. The room temperature photoluminescence study reveals the shift in band-edge emission towards the lower energy with increase in N/Ga flux ratio. This is believed to arise from the reduction in compressive stress in the GaN films as it is evidenced by room temperature Raman study. The transport studies on the Pt/GaN Schottky diodes showed a significant increase in leakage current with an increase in N/Ga ratio and is found to be caused by the increase in dislocation density in the GaN films. Chapter 4 deals with the fabrication and characterization of Au/GaN Schottky diodes. The temperature dependent current–voltage measurements have been used to determine the current transport mechanism in Schottky diodes. The barrier height (φb) and the ideality factor (η) are estimated from the thermionic emission model and are found to be temperature dependent in nature, indicating the existence of barrier height inhomogeneities at the Au/GaN interface. The conventional Richardson plot of ln(Is/T2) versus 1/kT gives Richardson constant value of 3.23×10-5 Acm-2 K-2, which is much lower than the known value of 26.4 Acm-2 K-2 for GaN. Such discrepancy of Richardson constant value was attributed to the existence of barrier height inhomogeneities at the Au/GaN interface. The modified Richardson plot of ln(Is/T2)-q2σs2/2k2T2 versus q/kT, by assuming a Gaussian distribution of barrier heights at the Au/GaN interface, provides the Schottky barrier height of 1.47 eV and Richardson constant value of 38.8 Acm-2 K-2 which is very close to the theatrical value of Richardson constant. The temperature dependence of barrier height is interpreted on the basis of existence of the Gaussian distribution of the barrier heights due to the barrier height inhomogeneities at the Au/GaN interface. Chapter 5 addresses on the influence of GaN underlayer thickness on structural, electrical and optical properties of InN thin films grown using plasma-assisted molecular beam epitaxy. The high resolution X-ray diffraction study reveals superior crystalline quality for the InN film grown on thicker GaN film. The electronic and optical properties seem to be greatly influenced by the structural quality of the films, as can be evidenced from Hall measurement and optical absorption spectroscopy. Also, we present the studies involving the dependence of structural, electrical and optical properties of InN films, grown on thicker GaN films, on growth temperature. The optical absorption edge of InN film is found to be strongly dependent on carrier concentration. Kane’s k.p model is used to describe the dependence of optical absorption edge on carrier concentration by considering the non-parabolic dispersion relation for carrier in the conduction band. Chapter 6 deals with the analysis of the temperature dependent current transport mechanisms in InN/GaN heterostructure based Schottky junctions. The barrier height (φb) and the ideality factor (η) of the InN/GaN Schottky junctions are found to be temperature dependent. The temperature dependence of the barrier height indicates that the Schottky barrier height is inhomogeneous in nature at the heterostructure interface. The higher value of the ideality factor and its temperature dependence suggest that the current transport is primarily dominated by thermionic field emission (TFE) other than thermionic emission (TE). The room temperature barrier height and the ideality factor obtained by TFE model are 1.43 eV and 1.21, respectively. Chapter 7 focuses on the defect induced room temperature ferromagnetism in Ga deficient GaN epitaxial films and InN nano-structures grown on c-sapphire substrate by using plasma-assisted molecular beam epitaxy. The observed yellow emission peak in room temperature photoluminescence spectra and the peak positioning at 300 cm-1 in Raman spectra confirms the existence of Ga vacancies in GaN films. The ferromagnetism in Ga deficient GaN films is believed to originate from the polarization of the unpaired 2p electrons of nitrogen surrounding the Ga vacancy. The InN nano-structures of different size are grown on sapphire substrate, the structural and magnetic properties are studied. The room temperature magnetization measurement of InN nano-structures exhibits the ferromagnetic behavior. The saturation magnetization is found to be strongly dependent on the size of the nano-structures. Finally, Chapter 8 gives the summary of the present work and the scope for future work in this area of research.

Thesis (MScEng (Electrical and Electronic Engineering))--University of Stellenbosch, 2010. / ENGLISH ABSTRACT: The main focus of this thesis is to document the formulation, extraction and validation of nonlinear models for the on-wafer gallium nitride (GaN) high-electron mobility (HEMT) devices manufactured at the Interuniversity Microelectronics Centre (IMEC) in Leuven, Belgium. GaN semiconductor technology is fast emerging and it is expected that these devices will play an important role in RF and microwave power amplifier applications. One of the main advantages of the new GaN semiconductor technology is that it combines a very wide band-gap with high electron mobility, which amounts to higher levels of gain at very high frequencies. HEMT devices based on GaN, is a fairly new technology and not many nonlinear models have been proposed in literature. This thesis details the design of hardware and software used in the development of the nonlinear models. An intermodulation distortion (IMD) measurement setup was developed to measure the second and higher-order derivative of the nonlinear drain current. The derivatives are extracted directly from measurements and are required to improve the nonlinear model IMD predictions. Nonlinear model extraction software was developed to automate the modelling process, which was fundamental in the nonlinear model investigation. The models are implemented in Agilent’s Advanced Design System (ADS) and it is shown that the models are capable of accurately predicting the measured S-parameters, large-signal singletone and two-tone behaviour of the GaN devices. / AFRIKAANSE OPSOMMING: Die hoofdoel van hierdie tesis is om die formulering, ontrekking en validasie van nie-lineêre modelle vir onverpakte gallium nitraat (GaN) hoë-elektronmobilisering transistors (HEMTs) te dokumenteer. Die transistors is vervaaardig by die Interuniversity Microelectronics Centre (IMEC) in Leuven, België. GaN-halfgeleier tegnologie is besig om vinnig veld te wen en daar word voorspel dat hierdie transistors ʼn belangrike rol gaan speel in RF en mikrogolf kragversterker toepassings. Een van die hoof voordele van die nuwe GaN-halfgeleier tegnologie is dat dit 'n baie wyd band-gaping het met hoë-elektronmobilisering, wat lei tot hoë aanwins by mikrogolf frekwensies. GaN HEMTs is 'n redelik nuwe tegnologie en nie baie nie-lineêre modelle is al voorgestel in literatuur nie. Hierdie tesis ondersoek die ontwerp van die hardeware en sagteware soos gebruik in die ontwikkeling van nie-lineêre modelle. 'n Intermodulasie distorsie-opstelling (IMD-opstelling) is ontwikkel vir die meting van die tweede en hoër orde afgeleides van die nie-lineêre stroom. Die afgeleides is direk uit die metings onttrek en moet die nie-lineêre IMD-voorspellings te verbeter. Nie-lineêre onttrekking sagteware is ontwikkel om die modellerings proses te outomatiseer. Die modelle word geïmplementeer in Agilent se Advanced Design System (ADS) en bewys dat die modelle in staat is om akkurate afgemete S-parameters, grootsein enkeltoon en tweetoon gedrag van die GaN-transistors te kan voorspel.