The development of state-of-the-art AlGaN/GaN high electron mobility transistors (HEMTs) has shown much promise for advancing future RF and microwave communication systems. These revolutionary devices demonstrate great potential and superior performance and many commercial companies have demonstrated excellent reliability results based on multiple temperature accelerated stress testing. However, a physical understanding of the various reliability limiting mechanisms is lacking and the role and relative contribution of the various intrinsic material factors, such as physical stress and strain has not been clearly explained in the literature. Part of issues that impact device reliability are the mechanical stresses induced in the devices as well as the self-heating that also limit device performance. Thus, quantification of stress and temperature in AlGaN/GaN HEMTs is of great importance. To address some of the needs for metrology to quantify stress in AlGaN/GaN HEMTs, micro-Raman spectroscopy and micro-photoluminescence (micro-PL) were utilized to quantify the residual stress in these devices. Through the use of micro-Raman and micro-PL optical characterization methods, mapping of the vertical and lateral stress distributions in the device channels was performed. Results show that stress can be influenced by the substrate material as well as patterned structures including metal electrodes and passivation layers. Previously developed and reported micro-Raman thermometry methods require an extensive calibration process for each device investigated. To improve the implementation of micro-Raman thermometry, a method was developed which offers both experimental simplicity and high accuracy in temperature results utilizing a universal calibration method that can be applied to a broad range of GaN based devices. This eliminates the need for performing calibration on different devices. By utilizing this technique, it was revealed that under identical power dissipation levels, the bias conditions (combination of Vgs and Vds) alter the heat generation profile across the conductive channel and thus influence the degree of device peak temperature. The role of stress in the degradation of AlGaN/GaN HEMTs was also explored. A combined analysis using micro-Raman spectroscopy, coupled electro-thermo-mechanical simulation, and electrical step stress tests was conducted to investigate the link between performance degradation and the evolution of total stress in devices. It was found that in addition to stresses arising from the inverse piezoelectric effect, the substrate induced residual stress and the operational themo-elastic stress in the AlGaN layer play a major role in determining the onset of mechanically driven device degradation. Overall, these experiments were the first to suggest that a critical level of stress may exist at which point device degradation will start to occur. The optical characterization methods developed in this study show the ability to reveal unprecedented relationships between temperature/stress and device performance/reliability. They can be used as effective tools for facilitating improvement of the reliability of future AlGaN/GaN HEMTs.

AlGaN/GaN high electron mobility transistors (HEMTs) have appeared as attractive candidates for high power, high frequency, and high temperature operation at microwave frequencies. In particular, these devices are being considered for use in the area of high RF power for microwave and millimeter wave communications transmitter applications at frequencies greater than 100 GHz and at temperatures greater than about 150 °C. However, there are concerns regarding the reliability of AlGaN/GaN HEMTs. First of all, thermal reliability is the chief concern since high channel temperatures significantly affect the lifetime of the devices. Therefore, it is necessary to find the solutions to decrease the temperature of AlGaN/GaN HEMTs. In this study, we explored the methods to reduce the channel temperature via high thermal conductivity diamond as substrates of GaN. Experimental verification of AlGaN/GaN HEMTs on diamond substrates was performed using micro-Raman spectroscopy, and investigation of the design space for devices was conducted using finite element analysis as well. In addition to the thermal impact on reliability, environmental effects can also play a role in device degradation. Using high density and pinhole free films deposited using atomic layer deposition, we also explore the use of ultra-thin barrier films for the protection of AlGaN/GaN HEMTs in high humidity and high temperature environments. The results show that it is possible to protect the devices from the effects of moisture under high negative gate bias stress testing, whereas devices, which were unprotected, failed under the same bias stress conditions. Thus, the use of the atomic layer deposition (ALD) coatings may provide added benefits in the protection and packaging of AlGaN/GaN HEMTs.

Le nitrure de gallium (GaN) est un matériau semi-conducteur de la famille III-V à large bande interdite directe, ayant des propriétés électriques et thermiques intéressantes. Grâce à sa large bande interdite, son fort champ de claquage et sa forte vitesse de saturation, il est très convoité pour la réalisation de dispositifs électroniques de puissance et de hautes fréquences pouvant fonctionner à haute température. De plus, grâce au caractère direct de sa bande interdite et son pouvoir d’émission à faible longueur d’onde, il est aussi avantageux pour la réalisation de dispositifs optoélectroniques de hautes performances en émission ou en détection tels que les DELs, les lasers ou les photo-détecteurs. Les difficultés de son élaboration, les problèmes d’inefficacités du dopage p et les densités élevées de défauts cristallins dans les couches épitaxiées ont constitué pendant longtemps des handicaps majeurs au développement des technologies GaN. Il a fallu attendre le début des années 1990 pour voir apparaître des couches épitaxiales de meilleures qualités et surtout pour obtenir un dopage p plus efficace [I. Akasaki, 2002]. Cet événement a été l’une des étapes clés qui a révolutionnée cette technologie et a permis d’amorcer son intégration dans le milieu industriel. Malgré l’avancé rapide qu’a connu le GaN et son potentiel pour la réalisation de sources optoélectroniques de haute efficacité, certains aspects de ce matériau restent encore mal maîtrisés, tels que la réalisation de contacts ohmiques avec une faible résistivité, ou encore le contrôle des interfaces métal/GaN et isolant/GaN. Les hétérostructures isolant/GaN sont généralement caractérisées par la présence d’une forte densité d’états de surface (D[indice inférieur it]). Cette forte D[indice inférieur it], aussi rapportée sur GaAs et sur d’autres matériaux III-V, détériore considérablement les performances des dispositifs réalisés et peut induire l’ancrage (‘pinning’) du niveau de Fermi. Elle constitue l’un des freins majeurs au développement d’une technologie MIS-GaN fiable et performante. Le but principal de ce projet de recherche est l’élaboration et l’optimisation d’un procédé de passivation du GaN afin de neutraliser ou minimiser l’effet de ses pièges. Les conditions de préparation de la surface du GaN avant le dépôt de la couche isolante (prétraitement chimique, gravure, prétraitement plasma etc.), les paramètres de dépôt de la couche diélectrique par PECVD (pression, température, flux de gaz, etc.) et le traitement post dépôt (tel que le recuit thermique) sont des étapes clés à investiguer pour la mise au point d’un procédé de passivation de surface efficace et pour la réalisation d’une interface isolant/GaN de bonne qualité (faible densité d’états de surface, faible densité de charges fixes, bonne modulation du potentiel de surface, etc.). Ceci permettra de lever l’un des verrous majeurs au développement de la technologie MIS-GaN et d’améliorer les performances des dispositifs micro- et optoélectroniques à base de ce matériau. Le but ultime de ce projet est la réalisation de transistors MISFETs ou MIS-HEMTs de hautes performances sur GaN.

<p>Management of incoming solar radiation and use of the sky as an ultimate heat sink are technological imperatives as climate change shifts our reliance from fossil fuels to sustainable sources.  Selective solar absorbers are a possible route for solar harvesting as they collect the incoming radiation for process heat or space heating.  Here, improvement in the performance of selective solar absorbers via photon recycling is investigated using a stepped index rugate filter.  The final proposed filter when integrated with a high vacuum selective solar absorber could see an improvment in solar-thermal conversion efficiency from 13% to 30.6%. Then, a frequency selective optical filter is fabricated with uses including improvement of radiative coolers.  The measured optical characteristics are compared with simulation data and found to match well.</p> <p><br></p> <p>The shift to sustainable sources of electricity will require an expansion of the electrical grid.  The backbone of the grid for converting high voltage AC to DC, and vice versa, is power electronics.  The current state-of-the-art technology is GaN HEMTs, but GaN MISHEMTs are poised to replace them since MISHEMTs reduce the gate leakage current; a deficiency of the GaN HEMT architecture.  First, time dependent dielectric breakdown in GaN MISHEMTs is investigated using concurrent electrical and thermoreflectance methods.  A susceptibility in the MISHEMT architecture is found and possible solutions are proposed.  Then, liquid cooling of GaN HEMT PAs is explored by demonstrating integration of an X-band front end module, printed circuit board, and fluid manifold.  The integration shows great promise as two-phase cooling performance improved with increasing power dissipated, while single-phase cooling performance degraded.</p>

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La microscopie à émission de photons spectrale (SPEM) est une technique non destructive utilisée comme outil de localisation des défauts et comme indicateur des mécanismes de défaillance. Cette thèse présente un nouveau système de SPEM développé pour étudier la fiabilité des dispositifs de puissance à large bande interdite, notamment les MOSFET SiC et les MEMTs AlGaN/GaN. Un aperçu des différents aspects fondamentaux de l'émission de lumière dans les dispositifs à semi-conducteurs est présenté. L'analyse spectrale en électroluminescence des MOSFET SiC à haute puissance et des HEMTs AlGaN/GaN est rapportée et corrélée avec des analyses électriques et micro-structurales pour localiser les défaillances et identifier l'origine physique de la dérive des performances de ces composants. / Spectroscopic photon emission microscopy (SPEM) is a non-destructive technique used as a defect localizing tool and as an indicator of the failure mechanisms. This thesis presents a new system of SPEM developed to study the reliability of wide band Gap power devices notably SiC MOSFETs and AlGaN/GaN HEMTs. An overview of different fundamental aspects of the light emission defects on semiconductors devices is presented. The electroluminescence spectral analysis of high power stressed SiC MOSFETs and AlGaN/GaN HEMTs is reported and correlated with electrical and micro-structural analysis to localize the failures and identify the physical origin of the performance drift of these components.

L’intégration monolithique hétérogène de composants III-N sur silicium (Si) offre de nombreuses possibilités en termes d’applications. Cependant, gérer l’hétéroépitaxie de matériaux à paramètres de maille et coefficients de dilatation très différents, tout en évitant les contaminations, et concilier des températures optimales de procédé parfois très éloignées requière inévitablement certains compromis. Dans ce contexte, nous avons cherché à intégrer des transistors à haute mobilité électronique (HEMT) à base de nitrure de Gallium (GaN) sur substrat Si par épitaxie sous jets moléculaires (EJM) en vue de réaliser des circuits monolithiques GaN sur CMOS Si. / The monolithic integration of heterogeneous devices and materials such as III-N compounds with silicon (Si) CMOS technology paves the way for new circuits applications and capabilities for both technologies. However, the heteroepitaxy of such materials on Si can be challenging due to very different lattice parameters and thermal expansion coefficients. In addition, contamination issues and thermal budget constraints on CMOS technology may prevent the use of standard process parameters and require various manufacturing trade-offs. In this context, we have investigated the integration of GaN-based high electron mobility transistors (HEMTs) on Si substrates in view of the monolithic integration of GaN on CMOS circuits.

<p dir="ltr">Rapid evolution in wireless technology and the increasing demand for high bandwidth communication for 5G/6G and the Internet of Things (IoT) have necessitated a growing number of components in radio front-end modules in an increasingly overcrowded radio frequency (RF) spectrum. Low-cost ad-hoc radios have drawn consumer interest, enabling new devices like microelectromechanical (MEMS) resonators for on-chip clocking, frequency-selective filters, RF signal processing, and spectral sensing for their small footprint and low power consumption. Gallium nitride (GaN) is an attractive electromechanical material due to its high coupling coefficient, acoustic velocity, and low viscoelastic losses. These benefits enable high-Q MEMS resonators in GaN monolithic microwave integrated circuits (MMICs) with scaling capability up to mm-wave frequencies, making this technology platform a contender for high-performance programmable radios in RF/mm-wave, sensors for harsh environments, and information processing in quantum systems.</p><p dir="ltr">The bias-dependent control mechanism of the 2D electron gas (2DEG) in GaN heterostructures can be exploited to design different switchable and tunable devices for reconfigurable MEMS components. This work presents, for the first time, a comprehensive study of the electromechanical performances of different transduction mechanisms in switchable GaN MEMS resonators. A unique OFF-state shunt design, where the 2DEG in an AlN/GaN heterostructure is utilized to control electromechanical transduction in Lamb mode resonators, is also experimentally demonstrated in this work. To make a valid comparison among switchable transducers, equivalent circuit models are developed to extract key parameters from the measurements by fitting them in both ON and OFF states. The switchable transducer with Ohmic interdigitated transducers (IDTs) and Schottky control gate shows superior performance among the designs under consideration with complete suppression of the mechanical mode in the OFF state and a maximum frequency-quality factor product of 5x10¹²s^-1 and a figure-of-merit of 5.18 at 1GHz in the ON state.</p><p dir="ltr">Over the past few years, there have been numerous efforts to scale the frequencies of MEMS devices in the GaN platform towards mm-wave frequencies. However, challenges remain due to the multi-layer thick buffer, typical in the growth of GaN epilayer on a substrate. This work presents the investigation of SweGaN QuanFINEbuffer-free and ultrathin GaN-on-SiC for the performance of surface acoustic wave (SAW) devices beyond 10GHz. Finite element analysis (FEA) is performed to find the range of frequencies for the Sezawa mode in the structure. Transmission lines and resonators are designed, fabricated, and characterized. Modified Mason circuit models are developed for each class of devices to extract critical performance metrics and benchmark with the state-of-the-art and theoretical limits for GaN. Sezawa modes are observed at frequencies up to 14.3GHz, achieving a record high in GaN MEMS to the best of our knowledge. A maximum piezoelectric coupling of 0.61% and frequency-quality factor product of 6x10¹²s^-1 are achieved for Sezawa resonators at 11GHz, with a minimum propagation loss of 0.26dB/λ for the two-port devices. The devices also exhibit high linearity with input third-order intercept points (IIP3) of 65dBm at 9GHz.</p><p dir="ltr">This work also investigates tunable acoustoelectric (AE) devices in the QuanFINE platform, leveraging its inherent 2DEG in the AlGaN/GaN heterostructure. Using 9.7GHz Sezawa mode acoustic delay lines, we report the highest frequency of AE in GaN to date. Active and passive AE devices are designed for voltage-dependent non-reciprocity and propagation loss without modification to the standard process for the High Electron Mobility Transistors (HEMTs) in MMICs. Drain/source Ohmic contacts control the drift velocity of the 2DEG, and the Schottky gate modulates 2DEG carrier concentration, resulting in a 30dB/cm separation between forward and reverse acoustic waves for a 2.56kV/cm lateral DC electric field and a maximum change in propagation loss of 50dB/cm for -5V DC at the control gate, respectively. The QuanFINEtechnology with AlGaN/GaN heterostructure enables a platform for switchable MEMS resonators and tunable acoustoelectric devices in MMICs for reconfigurable front end approaching mm-wave frequencies.</p>

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