The main objective of this thesis is to develop models for the power distribution network of high performance gigascale chips. The two main concerns in distributing power in a chip are voltage drop and electromigration-induced reliability failures. The voltage drop on the power distribution network is due to IR-drop and simultaneous switching noise. IR-drop is the voltage drop due to current passing through the resistances of the power distribution network. Simultaneous switching noise is due to varying current passing through the inductances of the power distribution network. Compact physical models are derived for the IR-drop and electromigration for different types of packages. These chip-package co-design models enable designers in the early stages of the design to estimate the on-chip interconnect resources, and also to choose type and size of the package required for power distribution. Modeling of the simultaneous switching noise requires the simulation of a large circuit with thousands of inductances. The main obstacle challenging the simulation of a simultaneous switching noise circuit model is the computing resources required to solve the dense inductance matrix. In this work, a new relative inductance matrix is introduced to solve massively coupled RLC interconnects. It is proven that the analysis using this method is accurate for a wide frequency range and all configurations. Using the new inductance matrix makes the circuit simulations significantly faster without losing accuracy.

L'évolution des technologies microélectroniques voire déca-nanoélectroniques conduit simultanément à des tensions d'alimentation toujours plus faibles et à des quantités de transistors toujours plus grandes. De ce fait, les courants d'alimentation augmentent sous une tension d'alimentation qui diminue, situation qui exacerbe la sensibilité des circuits intégrés au bruit d'alimentation. Un bruit d'alimentation excessif se traduit par une augmentation du retard des portes logiques pouvant finalement produire des fautes de retard. Un bruit d'alimentation provoqué par des courants circulant dans les résistances parasites du Réseau de Distribution d'Alimentation est communément référencé sous la dénomination d'IR-Drop.Cette thèse s'intéresse à la modélisation et à la simulation de circuits logiques avec prise en compte du phénomène d'IR-Drop. Un algorithme original est tout d'abord proposé en vue d'une simulation de type ‘event-driven' du block logique sous test, en tenant compte de l'impact de l'ensemble du circuit intégré sur l'IR-Drop du block considéré. Dans ce contexte, des modèles précis et efficaces sont développés pour les courants générés par les portes en commutation, pour la propagation de ces courants au travers du réseau de distribution et pour les retards des portes logiques. D'abord, une procédure de pré-caractérisation des courants dynamiques, statiques et des retards est décrite. Ensuite, une seconde procédure est proposée pour caractériser la propagation des courants au travers du réseau de distribution. Nos modèles ont été implantés dans une première version du simulateur développé par nos collègues de Passau dans le cadre d'une collaboration. Enfin, l'impact des éléments capacitifs parasites du réseau de distribution est analysé et une procédure pour caractériser la propagation des courants est envisagée. / Scaling technology in deep-submicron has reduced the voltage supply level and increased the number of transistors in the chip, increasing the power supply noise sensitivity of the ICs. Excessive power supply noise affects the timing performance increasing the gate delay and may cause timing faults. Specifically, power supply noise induced by the currents that flow through the resistive parasitic elements of the Power Distribution Network (PDN) is called IR-Drop. This thesis deals with the modelling and simulation of logic circuits in the context of IR-drop. An original algorithm is proposed allowing to perform an event-driven delay simulation of the logic Block Under Test (BUT) while taking into account the whole chip IR-drop impact on the simulated block. To do so, we develop accurate and efficient electrical models for the currents generated by the switching gates, the propagation of the current draw through the PDN and the gate delays. First, the pre-characterization process for the dynamic currents, static currents and gate delays is described to generate a gate library. Then, another pre-characterization procedure is suggested to estimate the current distribution through the resistive PDN model. Our models are implemented in a first version of the simulator by the University of Passau in the context of a project collaboration. In addition, the impact of the parasitic capacitive elements of the PDN is analyzed and a procedure to derive the current distribution in a resistive-capacitive PDN model is proposed.

The imperfections in the semiconductor fabrication process and uncertainty in operating environment of VLSI circuits have emerged as critical challenges for the semiconductor industry. These are generally termed as process and environment variations, which lead to uncertainty in performance and unreliable operation of the circuits. These problems have been further aggravated in scaled nanometer technologies due to increased process variations and reduced operating voltage. Several techniques have been proposed recently for designing digital VLSI circuits under variability. However, most of them have targeted ASICs and custom designs. The flexibility of reconfiguration and unknown end application in FPGAs make design under variability different for FPGAs compared to ASICs and custom designs, and the techniques proposed for ASICs and custom designs cannot be directly applied to FPGAs. An important design consideration is to minimize the modifications in architecture and circuit to reduce the cost of changing the existing FPGA architecture and circuit. The focus of this work can be divided into three principal categories, which are, improving timing yield under process variations, improving power yield under process variations and improving the voltage profile in the FPGA power grid. The work on timing yield improvement proposes routing architecture enhancements along with CAD techniques to improve the timing yield of FPGA designs. The work on power yield improvement for FPGAs selects a low power dual-Vdd FPGA design as the baseline FPGA architecture for developing power yield enhancement techniques. It proposes CAD techniques to improve the power yield of FPGAs. A mathematical programming technique is proposed to determine the parameters of the buffers in the interconnect such as the sizes of the transistors and threshold voltage of the transistors, all within constraints, such that the leakage variability is minimized under delay constraints. Two CAD techniques are investigated and proposed to improve the supply voltage profile of the power grids in FPGAs. The first technique is a place and route technique and the second technique is a logic clustering technique to reduce IR-drops and spatial variation of supply voltage in the power grid.

The imperfections in the semiconductor fabrication process and uncertainty in operating environment of VLSI circuits have emerged as critical challenges for the semiconductor industry. These are generally termed as process and environment variations, which lead to uncertainty in performance and unreliable operation of the circuits. These problems have been further aggravated in scaled nanometer technologies due to increased process variations and reduced operating voltage. Several techniques have been proposed recently for designing digital VLSI circuits under variability. However, most of them have targeted ASICs and custom designs. The flexibility of reconfiguration and unknown end application in FPGAs make design under variability different for FPGAs compared to ASICs and custom designs, and the techniques proposed for ASICs and custom designs cannot be directly applied to FPGAs. An important design consideration is to minimize the modifications in architecture and circuit to reduce the cost of changing the existing FPGA architecture and circuit. The focus of this work can be divided into three principal categories, which are, improving timing yield under process variations, improving power yield under process variations and improving the voltage profile in the FPGA power grid. The work on timing yield improvement proposes routing architecture enhancements along with CAD techniques to improve the timing yield of FPGA designs. The work on power yield improvement for FPGAs selects a low power dual-Vdd FPGA design as the baseline FPGA architecture for developing power yield enhancement techniques. It proposes CAD techniques to improve the power yield of FPGAs. A mathematical programming technique is proposed to determine the parameters of the buffers in the interconnect such as the sizes of the transistors and threshold voltage of the transistors, all within constraints, such that the leakage variability is minimized under delay constraints. Two CAD techniques are investigated and proposed to improve the supply voltage profile of the power grids in FPGAs. The first technique is a place and route technique and the second technique is a logic clustering technique to reduce IR-drops and spatial variation of supply voltage in the power grid.

Power supply noise has become a critical issue for low power and high performance circuit design in recent years. The rapid scaling of the CMOS process has pushed the limit further and further in building low-cost and increasingly complex digital VLSI systems. Continued technology scaling has contributed to significant improvements in performance, increases in transistor density, and reductions in power consumption. However, smaller feature sizes, higher operation frequencies, and supply voltage reduction make current and future VLSI systems more vulnerable to power supply noise. Therefore, there is a strong demand for strategies to prevent problems caused by power supply noise. Design challenges exist in different design phases to reduce power supply noise. In terms of physical design, careful power distribution design is required, since it directly determines the quality of power stability and the timing integrity. In addition, power management, such as switching mode of the power gating technique, is another major challenge during the circuit design phase. A bad power gating switching strategy may draw an excessive rush current and slow down other active circuitry. After the circuit is implemented, another critical design challenge is to estimate power supply noise. Designers need to be aware of the voltage drop in order to enhance the power distribution network without wasting unnecessary design resources. However, estimating power supply noise is usually difficult, especially finding the circuit activity which induces the maximum supply noise. Blind search may be very time consuming and not effective. At post-silicon test, detecting power supply noise within a chip is also challenging. The visibility of supply noise is low since there is no trivial method to measure it. However, the supply noise measurement result on silicon is critical to debug and to characterize the chip. This dissertation focuses on novel circuit designs and design methodologies to prevent problems resulted from power supply noise in different design phases. First, a supply noise estimation methodology is developed. This methodology systematically searches the circuit activity inducing the maximum voltage drop. Meanwhile, once the circuit activity is found, it is validated through instruction execution. Therefore, the estimated voltage drop is a realistic estimation close to the real phenomenon. Simulation results show that this technique is able to find the circuit activity more efficiently and effectively compared to random simulation. Second, two on-chip power supply noise detectors are designed to improve the visibility of voltage drop during test phase. The first detector facilitates insertion of numerous detectors when there is a need for additional test points, such as a fine-grained power gating design or a circuit with multiple power domains. It focuses on minimizing the area consumption of the existing detector. This detector significantly reduces the area consumption compared to the conventional approach without losing accuracy due to the area minimization. The major goal of designing the second on-chip detector is to achieve self-calibration under process and temperature variations. Simulation and silicon measurement results demonstrate the capability of self-calibration regardless these variations. Lastly, a robust power gating reactivation technique is designed. This reactivation scheme utilizes the on-chip detector presented in this dissertation to monitor power supply noise in real time. It takes a dynamic approach to control the wakeup sequence according to the ambient voltage level. Simulation results demonstrate the ability to prevent the excessive voltage drop while the ambient active circuitry induces a high voltage drop during the wakeup phase. As a result, the fixed design resource, which is used to prevent the voltage emergency, can potentially be reduced by utilizing the dynamic reactivation scheme. / text

Scaling technology in deep-submicron has reduced the voltage supply level and increased the number of transistors in the chip, increasing the power supply noise sensitivity of the ICs. Excessive power supply noise affects the timing performance increasing the gate delay and may cause timing faults. Specifically, power supply noise induced by the currents that flow through the resistive parasitic elements of the Power Distribution Network (PDN) is called IR-Drop. This thesis deals with the modelling and simulation of logic circuits in the context of IR-drop. An original algorithm is proposed allowing to perform an event-driven delay simulation of the logic Block Under Test (BUT) while taking into account the whole chip IR-drop impact on the simulated block. To do so, we develop accurate and efficient electrical models for the currents generated by the switching gates, the propagation of the current draw through the PDN and the gate delays. First, the pre-characterization process for the dynamic currents, static currents and gate delays is described to generate a gate library. Then, another pre-characterization procedure is suggested to estimate the current distribution through the resistive PDN model. Our models are implemented in a first version of the simulator by the University of Passau in the context of a project collaboration. In addition, the impact of the parasitic capacitive elements of the PDN is analyzed and a procedure to derive the current distribution in a resistive-capacitive PDN model is proposed.

L'évolution des technologies microélectroniques voire déca-nanoélectroniques conduit simultanément à des tensions d'alimentation toujours plus faibles et à des quantités de transistors toujours plus grandes. De ce fait, les courants d'alimentation augmentent sous une tension d'alimentation qui diminue, situation qui exacerbe la sensibilité des circuits intégrés au bruit d'alimentation. Un bruit d'alimentation excessif se traduit par une augmentation du retard des portes logiques pouvant finalement produire des fautes de retard. Un bruit d'alimentation provoqué par des courants circulant dans les résistances parasites du Réseau de Distribution d'Alimentation est communément référencé sous la dénomination d'IR-Drop. Cette thèse s'intéresse à la modélisation et à la simulation de circuits logiques avec prise en compte du phénomène d'IR-Drop. Un algorithme original est tout d'abord proposé en vue d'une simulation de type 'event-driven' (déclenchement par évènement) du bloc logique sous test, en tenant compte de l'impact de l'ensemble du circuit intégré sur l'IR-Drop du bloc considéré. Dans ce contexte, des modèles précis et efficaces sont développés pour les courants générés par les portes en commutation, pour la propagation de ces courants au travers du réseau de distribution et pour les retards des portes logiques. D'abord, une procédure de pré-caractérisation des courants dynamiques, statiques et des retards est décrite. Ensuite, une seconde procédure est proposée pour caractériser la propagation des courants au travers du réseau de distribution. Nos modèles ont été implantés dans une première version du simulateur développé par nos collègues de Passau dans le cadre d'une collaboration. Enfin, l'impact des éléments capacitifs parasites du réseau de distribution est analysé et une procédure pour caractériser la propagation des courants est envisagée.

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