This study investigates the reliability of SnPb and SnAg solder joints in semiconductor packages subjected to thermal cycling. More specifically, solder joint crack growth and life are experimentally measured, and FEM models are run to explain the test results. Ultimately a life-prediction model is proposed for both SnPb and SnAg solder joint packages. Motorola 357-plastic ball grid array packages on printed wiring boards were thermal cycled with the following test parameters: SnPb and SnAg solders, three post-process conditions (aged, aircooled and quenched), four package layouts on the printed circuit boards (singledense, single-sparse, double-alternating, and double-dense), three accelerated thermal cycling protocols (0°C to 100°C, -40°C to 125°C, and -55°C to 125°C), and tests run at Motorola and the University of Texas. At predetermined thermal cycles, packages were removed from the environmental chambers, dyepenetrated, packages removed to expose the solder joints, and optical images taken. Images were processed to measure crack area, shape, orientation and length to show crack growth. Selected joints were sectioned and polished to investigate microstructure and failure modes. Selected boards were connected to an ANATECH event detector to monitor life from joint failures. FEM crack initiation and propagation models were developed to better understand failure mechanisms. Major experimental results are: 1) SnPb joints have about 50% faster crack growth rates than SnAg joints, subsequently SnPb joints have half the life of SnAg joints, 2) air-cooled and quenched packages had similar failure characteristics, but aged SnPb joints had lower life and aged SnAg joints had significantly longer life than the comparable nonaged joints, 3) double-dense package layout significantly decreased life (by 75%) over the other package layouts, which were similar to each other, 4) the test results at the two locations (UT and Motorola) were similar for SnPb solder joints, but significantly different for SnAg solder joints, and 5) the largest cracks occurred at the corners of joints just under the die edge. Major FEM simulation results are: 1) the crack initiation life of SnAg joints is approximately 100% longer than SnPb joints, 2) shear load is a major cause of crack growth, but the contribution of tensile load increases as the cracks grow, 3) primary cracks at the board interface appear to reduce the propagation rate of the primary crack on the package interface, 4) secondary cracks are suppressed when compressive stresses prevent voids from nucleating, 5) the double-dense configuration shows no PWB warping due to symmetry, and its stresses are larger than for the other package layouts, and (6) the stresses and strains for single-dense, single-sparse, and double-alternating package layouts are similar because the stresses/strains are dominated by local effects due to the CTE mismatch between the die and board. Based upon the experimental results and FEM simulations, a lifeprediction model based upon a severity metric was proposed. The metric estimates damage to the solder joints and links material properties and parameters associated with package layout and thermal test conditions to the time-dependent creep, time-independent plastic deformation, and a time-dependent and geometric effective stress of the solder. The severity metric predicted life very well for most of the data tested and was more accurate than the industry-standard life-prediction models for SnPb solder joints.

Silicon-based nanostructures are essential building blocks for nanoelectronic devices and nano-electromechanical systems (NEMS), and their mechanical and electrical properties play an important role in controlling the functionality and reliability of the nano-devices. The objective of this dissertation is twofold: The first is to investigate the mechanical properties of silicon nanolines (SiNLs) with feature size scaled into the tens of nanometer level. And the second is to study the electron transport in nickel silicide formed on the SiNLs. For the first study, a fabrication process was developed to form nanoscale Si lines using an anisotropic wet etching technique. The SiNLs possessed straight and nearly atomically flat sidewalls, almost perfectly rectangular cross sections and highly uniform linewidth at the nanometer scale. To characterize mechanical properties, an atomic force microscope (AFM) based nanoindentation system was employed to investigate three sets of silicon nanolines. The SiNLs had the linewidth ranging from 24 nm to 90 nm, and the aspect ratio (Height/linewidth) from 7 to 18. During indentation, a buckling instability was observed at a critical load, followed by a displacement burst without a load increase, then a fully recoverable deformation upon unloading. For experiments with larger indentation displacements, irrecoverable indentation displacements were observed due to fracture of Si nanolines, with the strain to failure estimated to be from 3.8% to 9.7%. These observations indicated that the buckling behavior of SiNLs depended on the combined effects of load, line geometry, and the friction at contact. This study demonstrated a valuable approach to fabrication of well-defined Si nanoline structures and the application of the nanoindentation method for investigation of their mechanical properties at the nanoscale. For the study of electron transport, a set of nickel monosilicde (NiSi) nanolines with feature size down to 15 nm was fabricated. The linewidth effect on nickel silicide formation has been studied using high-resolution transmission electron microscopy (HRTEM) for microstructural analysis. Four point probe electrical measurements showed that the residual resistivity of the NiSi lines at cryogenic temperature increased with decreasing line width, indicating effect of increased electron sidewall scattering with decreased line width. A mean free path for electron transport at room temperature of 5 nm was deduced, which suggests that nickel silicide can be used without degradation of device performance in nanoscale electronics.

M. Tech. Metallurgical Engineering. / Aims at improving Cu interconnection problem by homogeneous distribution of ruthenium and tantalum in Cu matrix for excellent interconnection in electronics packaging. The aim will be achieved through the following objectives.Development of appropriate technology for homogenizing submicron metal powders with suitable methods for controlling grain growth during sintering. Study the mechanisms of synergistic incorporation of Ru, and Ta on improving copper interconnection properties. To investigate metallurgical interactions and phenomena occurring during sintering. To investigate specific property and behaviour advantages intrinsic due to the composites and material mix.

Typescript (photocopy). / Digitized by Kansas Correctional Industries

Typescript (photocopy). / Digitized by Kansas Correctional Industries

Typescript (photocopy). / Digitized by Kansas Correctional Industries

Typescript (photocopy). / Digitized by Kansas Correctional Industries

Call number: LD2668 .T4 1979 R65 / Master of Science

Call number: LD2668 .T4 1966 M648 / Master of Science

Submitted in complete fulfillment for the Degree of Master of Technology: Biotechnology, Durban University of Technology, 2010. / Xanthomonas campestris pv phaseoli produced an extracellular endoinulinase on various carbon sources. The highest inulinase production of 9.24 ± 0.03 IU ml¯¹by X. campestris pv. phaseoli was attained using an optimized medium comprising of 3% sucrose and 2.5% tryptone. Inulinase production in X. campestris pv. phaseoli was further enhanced through ethylmethanesulfonate mutagenesis. The resulting mutant, X. campestris pv. phaseoli KM 24 demonstrated enhanced inulinase production of 22.09 ± 0.03 IU ml¯¹after 24 h, which was 2.4 – fold higher than that of the wild type. Inulinase production by this mutant was scaled up in a 5 L fermenter yielding a final activity of 21.87 ± 0.03 IU ml¯¹with an inulinase/invertase (I/S) ratio of 2.6 after 18 h. Maximum volumetric (21 865 IU 1¯¹ h¯¹) and specific (119 025 IU g¯¹ h¯¹) productivities of inulinase were attained in a fermenter after 18h growth. Inulin hydrolysis by the crude inulinase and subsequent detection of mono- and oligosaccharides indicated the presence of an endoinulinase. The extracellular endoinulinase from the mutant KM 24 was purified to homogeneity by gel filtration chromatography and had a specific activity of 174.74U/mg. the optimum pH and temperature of the purified enzyme were found to be 6.0 and 50°C, respectively. The enzyme was stable up to 60°C, retaining over 60% activity for 30 min, but activity rapidly declined at temperatures above 60°C. The pure inulinase enzyme was also found to be stable between pH 6-9. The Lineweaver-Burk plots showed that the apparent Km and Vmax values of the inulinase for inulin were 1.15 mg/ml and 15µM/min, respectively. The Kcat value was found to be 0.145 min¯¹ with an enzyme catalytic efficiency of 0.126 mg¯¹.ml.min¯¹.This mutant demonstrated good potential for large scale production of inulinase and fructooligosaccharides. / National Research Foundation