Mixed signal system-on-package (SoP) technology is a key enabler for increasing functional integration, especially in mobile and wireless systems. Due to the presence of multiple dissimilar modules, each having unique power supply requirements, the design of the power distribution network (PDN) becomes critical. Typically, this PDN is designed as alternating layers of power and ground planes with signal interconnects routed in between or on top of the planes. The goal for the simulation of multi-layer power/ground planes, is the following: Given a stack-up and other geometrical information, it is required to find the network parameters (S/Y/Z) between port locations. Commercial packages have extremely complicated stack-ups, and the trend to increasing integration at the package level only points to increasing complexity. It is computationally intractable to solve these problems using these existing methods. The approach proposed in this thesis for obtaining the response of the PDN is the multi-layer finite difference method (M-FDM). A surface mesh / finite difference based approach is developed, which leads to a system matrix that is sparse and banded, and can be solved efficiently. The contributions of this research are the following: 1. The development of a PDN modeler for multi-layer packages and boards called the the multi-layer finite difference method. 2. The enhancement of M-FDM using multi-port connection networks to include the effect of fringe fields and gap coupling. 3. An adaptive triangular mesh based scheme called the multi-layer finite element method (MFEM) to address the limitations of M-FDM 4. The use of modal decomposition for the co-simulation of signal nets with the PDN. 5. The use of a robust GA-based optimizer for the selection and placement of decoupling capacitors in multi-layer geometries. 6. Implementation of these methods in a tool called MSDT 1.

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Current electrical systems are faced with the limitation in performance by the electrical interconnect technology determining overall processing speed. In addition, the electrical interconnects containing many long distance interconnects require high power to drive. One of the best ways to overcome these bottlenecks is through the use of optical interconnect to limit interconnect latency and power. This research explores new computer-aided design algorithms for developing optoelectronic systems. These algorithms focus on place and route problems using optical interconnections covering system-on-a-chip design as well as system-on-a-package design. In order to design optoelectronic systems, optical interconnection models are developed at first. The CAD algorithms include optical interconnection models and solve place and route problems for optoelectronic systems. The MCNC and GSRC benchmark circuits are used to evaluate these algorithms.

Integrated systems with billions of transistors on a single chip are a now reality. These systems include multi-core microprocessors and are built today using deca-nanometer devices organized into synchronous digital circuits. The movement of data within such systems is regulated by a set of predictable timing signals, called clocks, which must be distributed to a large number of sequential elements. Collectively, these clocks have a significant impact on the frequency of operation and, consequently, on the performance of the systems. The clocks are also responsible for a large fraction of the power consumed by these systems. The objective of this dissertation is to better understand clock distribution in order to identify opportunities and strategies for improvement by analyzing the conditions under which the optimal tradeoff between power and performance can be achieved, by modeling the constraints associated with local and global clocking, by evaluating the impact of noise, and by investigating promising new design strategies for future integrated systems.