For many years some people have dismissed the idea that small generators placed close to loads could replace large central generation plants. In the near future, this idea will probably hold true. However, many companies today are producing small generators that will have a great impact on the power grid. These generators can be used to improve the overall service to a particular area. Also, these generators can also be used to save an electric utility or end-use customer a significant amount of money. However, there are a lot of concerns in using distributed generation. As a result, there are many different issues that need to be investigated when distributed generation is used. In this thesis, a guidebook is developed for an engineer to use when distributed generation is being considered. By following this guidebook an engineer should be able to investigate proper engineering and economic issues. The engineering issues the engineer should consider are coordination, application of protective devices, voltage control, transformer winding configuration, reduction of losses and islanding. By following this guidebook, the engineer should also consider certain economic issues that include the impact of distributed generation on generation, transmission and distribution companies, the impact of distributed generation on wholesale and retail rates, and the costs associated with installation, operation and maintenance of distributed generation. As an example application, the requirements found in the guidebook are applied to a particular scenario for an existing facility that is served by a distribution company.

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This dissertation focuses on the modeling and control of WECS (Wind Energy Conversion System) in a multi-machine system. As one of the fastest growing renewable energy resources, the trend of wind energy changes to variable speed wind turbines. The concept of the variable speed is based on the variable speed according to the instantaneous wind speed of wind turbines. Since the utility grid requires the stable frequency and magnitude voltages, there must be grid interconnection of the wind farm and the utility grid. The grid interconnection must support the concept of the variable speed wind turbines. Since each wind turbine locates in a different location in a wind site, it receives the different wind speed. Hence the grid interconnection must convert the variable frequency and magnitude output voltages of the wind turbines to a synchronous frequency and magnitude voltages associated to the grid. With the new technologies of power semiconductor devices, the power converter can operate with high voltage, high current, and high switching frequency. This results in a higher power capacity of a wind farm. Nonetheless, the power converters generate harmonic distortions to the utility grid. The harmonic distortions components in the voltages and currents of the grid degrade the power quality. This results in the damage of electrical components in the power system such as capacitor banks, inductors, protection devices, etc. The harmonic distortions can be reduced with the technology of the multi-level inverter. It is required that the wind energy provides the real and reactive power control for frequency and voltage stability. In order to achieve the power control, the modeling and control of the power electronic grid interconnection is presented in this dissertation. The grid interconnection is modeled with linearization techniques. The models in frequency domain in the form of transfer functions are used to design the compensators in the control system. The model is considered as a SISO (Single Input Single Output) system to design the compensators in SISO tool of MATLAB. The selected control system is current control that can control the real and reactive powers independently. Furthermore, since the grid interconnection is modeled separately for each sub-system, the control system is verified with integration of the sub-systems. The grid interconnection is modeled in Simulink and simulated in the PSCAD. In reality, the power system is comprised of multi-machines. They affect the power system stability, reliability, and quality. The dynamic modeling of an aggregated wind farm with synchronous generator and grid interconnection in a multi-machine system is presented. The test system is a 10-bus system with three generators and three loads. The dynamic modeling involves the power flow calculations that determine the equilibrium points of the system. The system is modeled with differential equations of wind turbines, synchronous generators, and grid interconnection. The system is modeled in the time domain in state space form. The system characteristics can be determined by poles or eigen values obtained from the characteristic equations. Since the system is MIMO (Multi Input Multi Output) system, the optimal control theory is used to reduce the deviation of system behaviors during disturbances. The LQR (Linear Quadratic Regulator) is utilized to control the system with eigen value assignment method. Simulation results in Simulink are illustrated. / Ph. D.

Ces travaux de doctorat portent sur la caractérisation, la modélisation et l'optimisation des performances électriques des réseaux d'interconnexions dans les empilements 3D de circuits intégrés. Dans un premier temps des outils de caractérisation ont été développés pour les briques élémentaires d'interconnexions spécifiques à l'intégration 3D : les interconnexions de redistribution (RDL), les interconnexions enfouies dans le BEOL, les vias traversant le silicium (TSV) et les piliers de cuivre (Cu-Pillar). Des modèles électriques équivalents sont proposés et validés sur une très large bande de fréquence (MHz-GHz) par modélisation électromagnétique. Une analyse des performances électriques des chaînes complètes d'interconnexions des empilements 3D de puces est ensuite effectuée. Les empilements « Face to Face », « Face to Back » et par « Interposer » sont comparés en vue d'établir leurs performances respectives en terme de rapidité de transmission. Une étude est aussi réalisée sur les inductances 2D intégrées dans le BEOL et dont les performances électriques sont fortement impactées par le report des substrats de silicium. La dernière partie est consacrée à l'établissement de stratégies d'optimisation des performances des circuits 3D en vue de maximiser leur fréquence de fonctionnement, minimiser les retards de propagation et assurer l'intégrité des signaux (digramme de l'œil). Des réponses sont données aux concepteurs de circuits 3D quant aux meilleurs choix d'orientation des puces, de routage et de densité d'intégration. Ces résultats sont valorisés sur une application concrète de circuits 3D « mémoire sur processeur » (Wide I/O) pour lesquels les spécifications requises sur les débits (Gbp/s) restent un véritable challenge. / This PhD work deals with characterization and electrical modeling of interconnection networks for 3D stacking of advanced integrated circuits. First, characterization tools have been developed for basic interconnect element specific of the 3D integration : ReDistribution Layer (RDL) interconnect, Back End Of Lines (BEOL) interconnect, Through Silicon Via (TSV) and Copper Pillar. Equivalent models are proposed and then validated on a broad band frequency (MHz-GHz) by electromagnetic modeling. An analysis of global electrical performances of interconnections networks is investigated for 3D wafer stacking. Face to Face, Face to Back and Interposer stacking are compared in order to establish their performances in term of data rate transmission. A study is also carried on 2D inductances integrated in the BEOL to find out which electrical performances are strongly impacted by the stacking of silicon substrate. The last part is dedicated to the optimization strategies of the 3D circuits performances in order to maximize their frequency bandwidth, to minimize the propagation delays and to insure the signal integrity (eye diagram). Answers are given to the 3D circuits designers for determining the best choices of chips orientation, routing and integration density. These results are valued on a concrete application of 3D circuits “memory on processor” (Wide I/O) where obtaining the required specifications on data rate (Gbyps) remain a real challenge.

In electricity markets, capacity cost must be determined in order to make capacity trading. In this thesis, capacity cost and the factors deriving the capacity cost are studied. First, fixed capacity cost of power plants is examined. Direct and indirect costs of fixed capacity cost are detailed with respect to different types of power plants and the impact of these factors to the capacity cost is given. Second, interconnection and system utilization costs of transmission and distribution system are considered in order to simulate energy flow from the producer to the customer. Finally, a capacity cost calculation program is practiced. By the help of this program, capacity cost of power plants is figured out, different cases are compared and the main factors affecting the capacity cost are discussed in detail.

Increasing bandwidth demands for cloud computing and autonomous applications push the need for system scaling instead of transistor scaling as predicted by Moore’s Law. Optoelectronic interconnections have the potential to enable system scaling at higher bandwidth, power efficiency, and lower cost than copper wiring. The objective of this research is to demonstrate polymer-based optical waveguides with integrated optical turning structures in ultra-thin glass interposers, for fiber-to-chip or chip-to-chip optical interconnections. The fundamental material and process challenges associated with achieving this objective are encompassed in: (1) polymer-glass interfaces and adhesion, (2) lithographically-defined polymer waveguides, and (3) integrated turning structures by inclined lithography. Process guidelines for substrate preparation, adhesion enhancement, and lithographic precision of siloxane-based polymer waveguides in glass were established by fundamentally breaking down and optimizing each process step. In addition, a new process was demonstrated to achieve, for the first time, waveguides with integrated turning structures with self-alignment and symmetry in a single exposure. The new process was enabled by fabricating pre-existing, direct-coated, metallic masks before the inclined exposure step. The demonstrated structures were imaged by polished cross-sectioning and Scanning Electronic Microscopy (SEM).

Conventional tin-lead solder alloys have been widely used in electronics interconnection owing to their properties such as low melting temperature, good ductility and excellent wettability on copper and other substrates. However, due to the worldwide legislation addressing the concern over the toxicity of lead, the usage of lead-containing solders has been phased out, thus stimulating substantial efforts on lead-free alternatives, amongst which eutectic Sn-Ag and Sn-Cu, and particularly Sn-Ag-Cu alloys, are promising candidates as recommended by international parties. To meet the increasing demands of advanced electronic products, high levels of integration of electronic devices are being developed and employed, which is leading to a reduction in package size, but with more and more input/output connections. Flip chip technology is therefore seen as a promising technique for chip interconnection compared with wire bonding, enabling higher density, better heat dissipation and a smaller footprint. This thesis is intended to investigate lead-free (eutectic Sn-Ag, Sn-Cu and Sn-Ag-Cu) wafer level solder bumping through electrodeposition for flip chip interconnection, as well as electroplating lead-free solderable finishes on electronic components. The existing knowledge gap in the electrochemical processes as well as the fundamental understanding of the resultant tin-based lead-free alloys electrodeposits are also addressed. For the electrodeposition of the Sn-Cu solder alloys, a methanesulphonate based electrolyte was established, from which near-eutectic Sn-Cu alloys were achieved over a relatively wide process window of current density. The effects of methanesulphonic acid, thiourea and OPPE (iso-octyl phenoxy polyethoxy ethanol) as additives were investigated respectively by cathodic potentiodynamic polarisation curves, which illustrated the resultant electrochemical changes to the electrolyte. Phase identification by X-ray diffraction showed the electrodeposits had a biphasic structure (β-Sn and Cu6Sn5). Microstructures of the Sn-Cu electrodeposits were comprehensively characterised, which revealed a compact and crystalline surface morphology under the effects of additives, with cross-sectional observations showing a uniform distribution of Cu6Sn5 particles predominantly along β-Sn grain boundaries. The electrodeposition of Sn-Ag solder alloys was explored in another pyrophosphate based system, which was further extended to the application for Sn-Ag-Cu solder alloys. Cathodic potentiodynamic polarisation demonstrated the deposition of noble metals, Ag or Ag-Cu, commenced before the deposition potential of tin was reached. The co-deposition of Sn-Ag or Sn-Ag-Cu alloy was achieved with the noble metals electrodepositing at their limiting current densities. The synergetic effects of polyethylene glycol (PEG) 600 and formaldehyde, dependent on reaching the cathodic potential required, helped to achieve a bright surface, which consisted of fine tin grains (~200 nm) and uniformly distributed Ag3Sn particles for Sn-Ag alloys and Ag3Sn and Cu6Sn5 for Sn-Ag-Cu alloys, as characterised by microstructural observations. Near-eutectic Sn-Ag and Sn-Ag-Cu alloys were realised as confirmed by compositional analysis and thermal measurements. Near-eutectic lead-free solder bumps of 25 μm in diameter and 50 μm in pitch, consisting of Sn-Ag, Sn-Cu or Sn-Ag-Cu solder alloys depending on the process and electrolyte employed, were demonstrated on wafers through the electrolytic systems developed. Lead-free solder bumps were further characterised by material analytical techniques to justify the feasibility of the processes developed for lead-free wafer level solder bumping.

In the first part of the thesis we define an automorphism φn for each star graph Stn of degree n-1, which yields permutations of labels for the edges of Stn taken from the set of integers {1,..., [n/2c]}. By decomposing these permutations into permutation cycles, we are able to identify edge-disjoint Hamilton cycles that are automorphic images of a known two-labelled Hamilton cycle H1 2(n) in Stn. The search for edge-disjoint Hamilton cycles in star graphs is important for the design of interconnection network topologies in computer science. All our results improve on the known bounds for numbers of any kind of edge-disjoint Hamilton cycles in star graphs.

Petroleum Development Oman (PDO) and Oman Electricity Transmission Company (OETC) are running the main 132kV power transmission grids in the Sultanate of Oman. In the year 2001, PDO and OETC grids were interconnected with a 132kV Over head transmission line linking Nahada 132kV substation at PDO's side to Nizwa 132kV sub-station at OETC's side. Since then the power exchange between PDO and OETC is driven by the natural impedances of the system and the frequency and power exchange is controlled by manually re-dispatching the generators. In light of the daily load profile and the forecasted Gulf Cooperation Council (GCC) states electrical interconnection, it is a great challenge for PDO and OETC grids operators to maintain the existing operation philosophy. The objective of this research is to investigate Automatic Generation Control (AGC) technology as a candidate to control the grid frequency and the power exchange between PDO and OETC grid. For this purpose, a dynamic power system model has been developed to represent PDO-OETC interconnected power system. The model has been validated using recorded data from the field which has warranted the requirement of refining the model. Novel approaches have been followed during the course of the model refining process which have reduced the modelling error to an acceptable limit. The refined model has then been used to assess the performance of different AGC control topologies. The recommended control topologies have been further improved using sophisticated control techniques like Linear Quadratic Regulator (LQR) and Fuzzy Logic (FL). Hybrid Fuzzy Logic Proportional Integral Derivative (FLPID) AGC controller has produced outstanding results. The FLPID AGC controller parameters have then been optimised using Multidimensional Unconstrained Nonlinear Minimization function (fminsearch) and Particle Swarm Optimisation (PSO) method. The PSO has been proved to be much superior to fminsearch function. The robustness of the LQR, the fminsearch optimized FLPID and the PSO FLPID optimized AGC controllers has been assessed. The LQR robustness found to be slightly better than the FLPID technique. However the FLPID supercedes the LQR due to the limited number of field feedback signals in comparison to the LQR. Finally, a qualitative assessment of the benefits of the ongoing GCC interconnection project on PDO and OETC has been done through modelling approach. The results proved that the GCC interconnection will bring considerable benefits to PDO and OETC but the interconnection capacity between PDO and OETC needs to be enhanced. However, the application of AGC on PDO and OETC will alleviate the PDO-OETC interconnection capacity enhancement imposed by the GCC interconnection.

The InfiniBand Architecture (IBA) network has been proposed as a new industrial standard with high-bandwidth and low-latency suitable for constructing high-performance interconnected cluster computing systems. This architecture replaces the traditional bus-based interconnection with a switch-based network for the server Input-Output (I/O) and inter-processor communications. The efficient Quality-of-Service (QoS) mechanism is fundamental to ensure the import at QoS metrics, such as maximum throughput and minimum latency, leaving aside other aspects like guarantee to reduce the delay, blocking probability, and mean queue length, etc. Performance modelling and analysis has been and continues to be of great theoretical and practical importance in the design and development of communication networks. This thesis aims to investigate efficient and cost-effective QoS mechanisms for performance analysis and improvement of InfiniBand networks in cluster-based computing systems. Firstly, a rate-based source-response link-by-link admission and congestion control function with improved Explicit Congestion Notification (ECN) packet marking scheme is developed. This function adopts the rate control to reduce congestion of multiple-class traffic. Secondly, a credit-based flow control scheme is presented to reduce the mean queue length, throughput and response time of the system. In order to evaluate the performance of this scheme, a new queueing network model is developed. Theoretical analysis and simulation experiments show that these two schemes are quite effective and suitable for InfiniBand networks. Finally, to obtain a thorough and deep understanding of the performance attributes of InfiniBand Architecture network, two efficient threshold function flow control mechanisms are proposed to enhance the QoS of InfiniBand networks; one is Entry Threshold that sets the threshold for each entry in the arbitration table, and other is Arrival Job Threshold that sets the threshold based on the number of jobs in each Virtual Lane. Furthermore, the principle of Maximum Entropy is adopted to analyse these two new mechanisms with the Generalized Exponential (GE)-Type distribution for modelling the inter-arrival times and service times of the input traffic. Extensive simulation experiments are conducted to validate the accuracy of the analytical models.