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Thermal stress induced voids in nanoscale Cu interconnects by in-situ TEM heatingAn, Jin Ho, January 1900 (has links)
Thesis (Ph. D.)--University of Texas at Austin, 2007. / Vita. Includes bibliographical references.
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Efficient numerical modeling of random surface roughness for interconnect internal impedance extractionChen, Quan, January 2007 (has links)
Thesis (M. Phil.)--University of Hong Kong, 2008. / Also available in print.
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Investigation of optical loss changes in siloxane polymer waveguides during thermal curing and agingHegde, Shashikant G. January 2008 (has links)
Thesis (Ph. D.)--Mechanical Engineering, Georgia Institute of Technology, 2008. / Committee Chair: Sitaraman, Suresh; Committee Member: Chang, Gee-Kung; Committee Member: Colton, Jonathan; Committee Member: Joshi, Yogendra; Committee Member: Swaminathan, Madhavan; Committee Member: Thompson, Patrick.
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Copper to copper bonding by nano interfaces for fine pitch interconnections and thermal applicationsJha, Gopal Chandra. January 2008 (has links)
Thesis (M. S.)--Materials Science and Engineering, Georgia Institute of Technology, 2008. / Committee Chair: Rao R. Tummala; Committee Member: C. P. Wong; Committee Member: P. M. Raj.
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Ultra thin ultrafine-pitch chip-package interconnections for embedded chip last approachMehrotra, Gaurav. January 2008 (has links)
Thesis (M. S.)--Materials Science and Engineering, Georgia Institute of Technology, 2008. / Committee Chair: Prof. Rao R Tummala; Committee Member: Dr. Jack Moon; Committee Member: Dr. P M Raj.
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Parameterized simulation and optimization of high-speed systems and interconnects /Jerome, Arumika, January 1900 (has links)
Thesis (M. App. Sc.)--Carleton University, 2004. / Includes bibliographical references (p. 57-62). Also available in electronic format on the Internet.
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Passivity checking and enforcement in VLSI model reduction exerciseLiu, Yansong. January 2008 (has links)
Thesis (M. Phil.)--University of Hong Kong, 2008. / Includes bibliographical references (leaf 95-101) Also available in print.
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Efficient numerical modeling of random surface roughness for interconnect internal impedance extraction /Chen, Quan, January 2007 (has links)
Thesis (M. Phil.)--University of Hong Kong, 2008. / Also available online.
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Capacity scaling in free-space-optical mobile ad-hoc networksBilgi, Mehmet. January 2008 (has links)
Thesis (M.S.)--University of Nevada, Reno, 2008. / "May, 2008." Includes bibliographical references (leaves 50-55). Online version available on the World Wide Web.
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High-speed data transmission using substrate integrated waveguide-type interconnectsSuntives, Asanee. January 1900 (has links)
Thesis (Ph.D.). / Written for the Dept. of Electrical & Computer Engineering. Title from title page of PDF (viewed 2009/06/11). Includes bibliographical references.
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