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Trapping Effects in AlGaN/GaN HEMTs for High Frequency Applications : Modeling and Characterization Using Large Signal Network Analyzer and Deep Level Optical SpectroscopyYang, Chieh Kai 13 September 2011 (has links)
No description available.
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New Pulsed-IV Pulsed-RF Measurement Techniques For Characterizing Power FETs For Pulsed-RF Power Amplifier DesignDoo, Seok Joo 05 September 2008 (has links)
No description available.
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Characterization of sub-90 nm Gate Length RF MOSFETs using Large Signal Network AnalyzerBalasubramanian, Venkatesh 04 February 2009 (has links)
No description available.
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Multi-Harmonic Broadband Measurement with an Large-Signal Network AnalyzerYoungseo, Ko 24 August 2010 (has links)
No description available.
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Trapping and Reliability investigations in GaN-based HEMTs / Investigation des effets de pièges et des aspects de fiabilité des transistors à haute mobilité d’électrons en Nitrure de GalliumBenvegnù, Agostino 28 September 2016 (has links)
Les transistors à haute mobilité d’électrons (HEMTs) en nitrure de gallium (GaN) s’affirment comme les candidats prometteurs pour les futurs équipements à micro-ondes - tels que les amplificateurs de puissance à état solide (SSPA), grâce à leurs excellentes performances. Une première démonstration d'émetteur en technologie GaN-MMIC a été développée et embarquée dans la mission spatiale PROBA-V. Mais cette technologie souffre encore des effets de pièges par des défauts présents au sein de la structure. L’objectif de ce travail est donc l'étude d’effets de pièges et des aspects de fiabilité des transistors de puissance GH50 pour des applications en bande C. Un protocole d’investigation des phénomènes de pièges est présenté, qui permet l’étude des dynamiques des effets de pièges du mode de fonctionnement DC au mode de fonctionnement radiofréquence, basé sur la combinaison des mesures IV impulsionnelles, des mesures de transitoires du courant de drain avec des impulsions DC et RF et des mesures de paramètres [S] en basse fréquence. Un modèle de HEMT AlGaN/GaN non-linéaire électrothermique est présenté, incluant un nouveau modèle thermique de pièges restituant le comportement dynamique de ces pièges et leurs variations en température afin de prédire correctement les performances en conditions réelles de fonctionnement RF. Enfin, une méthodologie temporelle pour l’évaluation de la fiabilité et de limites réelles d'utilisation de transistors dans l'amplificateur de puissance RF en régime d’overdrive (très forte compression), basée sur la mesure monitorée de Formes d'Onde Temporelles (FOT), est proposée. / GaN-based high electron mobility transistors (HEMTs) are promising candidates for future microwave equipment, such as new solid state power amplifiers (SSPAs), thanks to their excellent performance. A first demonstration of GaN-MMIC transmitter has been developed and put on board the PROBA-V mission. But this technology still suffers from the trapping phenomena, principally due to lattice defects. Thus, the aim of this research is to investigate the trapping effects and the reliability aspects of the GH50 power transistors for C-band applications. A new trap investigation protocol to obtain a complete overview of trap behavior from DC to radio-frequency operation modes, based on combined pulsed I/V measurements, DC and RF drain current measurements, and low-frequency dispersion measurements, is proposed. Furthermore, a nonlinear electro-thermal AlGaN/GaN model with a new additive thermal-trap model including the dynamic behavior of these trap states and their associated temperature variations is presented, in order to correctly predict the RF performance during real RF operating conditions. Finally, an advanced time-domain methodology is presented in order to investigate the device’s reliability and to determine its safe operating area. This methodology is based on the continual monitoring of the RF waveforms and DC parameters under overdrive conditions in order to assess the degradation of the transistor characteristics in the RF power amplifier.
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Efficient radio frequency power amplifiers for wireless communicationsCui, Xian 10 December 2007 (has links)
No description available.
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Nonlinear devices characterization and micromachining techniques for RF integrated circuitsParvais, Bertrand J. H. 10 December 2004 (has links)
The present work is dedicated to the development of high performance integrated circuits for wireless communications, by acting of three different levels: technologies, devices, and circuits.
Silicon-on-Insulator (SOI) CMOS technology is used in the frame of this work. Micromachining technologies are also investigated for the fabrication of three-dimensional tunable capacitors. The reliability of micromachined thin-film devices is improved by the coating of silanes in both liquid- and vapor-phases.
Since in telecommunication applications, distortion is responsible for the generation of spurious frequency bands, the linearity behavior of different SOI transistors is analyzed. The validity range of the existing low-frequency nonlinear characterization methods is discussed. New simple techniques valid at both low- and high-frequencies, are provided, based on the integral function method and on the Volterra series.
Finally, the design of a crucial nonlinear circuit, the voltage-controlled oscillator, is introduced. The describing function formalism is used to evaluate the oscillation amplitude and is embedded in a design methodology. The frequency tuning by SOI varactors is analyzed in both small- and large-signal regimes.
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