Chemnitz, Techn. Univ., Diss., 2007. / Zugl. ersch. im Shaker Verl. Aachen, ISBN 978-3-8322-6348-5, - Parallelt.: Control engineered analysis and synthesis of MEMS with the electrostatic principle.

Zugl.: Dresden, Techn. Univ., Diss., 2009

abstract: Power supply management is important for MEMS (Micro-Electro-Mechanical-Systems) bio-sensing and chemical sensing applications. The dissertation focuses on discussion of accessibility to different power sources and supply tuning in sensing applications. First, the dissertation presents a high efficiency DC-DC converter for a miniaturized Microbial Fuel Cell (MFC). The miniaturized MFC produces up to approximately 10µW with an output voltage of 0.4-0.7V. Such a low voltage, which is also load dependent, prevents the MFC to directly drive low power electronics. A PFM (Pulse Frequency Modulation) type DC-DC converter in DCM (Discontinuous Conduction Mode) is developed to address the challenges and provides a load independent output voltage with high conversion efficiency. The DC-DC converter, implemented in UMC 0.18µm technology, has been thoroughly characterized, coupled with the MFC. At 0.9V output, the converter has a peak efficiency of 85% with 9µW load, highest efficiency over prior publication. Energy could be harvested wirelessly and often has profound impacts on system performance. The dissertation reports a side-by-side comparison of two wireless and passive sensing systems: inductive and electromagnetic (EM) couplings for an application of in-situ and real-time monitoring of wafer cleanliness in semiconductor facilities. The wireless system, containing the MEMS sensor works with battery-free operations. Two wireless systems based on inductive and EM couplings have been implemented. The working distance of the inductive coupling system is limited by signal-to-noise-ratio (SNR) while that of the EM coupling is limited by the coupled power. The implemented on-wafer transponders achieve a working distance of 6 cm and 25 cm with a concentration resolution of less than 2% (4 ppb for a 200 ppb solution) for inductive and EM couplings, respectively. Finally, the supply tuning is presented in bio-sensing application to mitigate temperature sensitivity. The FBAR (film bulk acoustic resonator) based oscillator is an attractive method in label-free sensing application. Molecular interactions on FBAR surface induce mass change, which results in resonant frequency shift of FBAR. While FBAR has a high-Q to be sensitive to the molecular interactions, FBAR has finite temperature sensitivity. A temperature compensation technique is presented that improves the temperature coefficient of a 1.625 GHz FBAR-based oscillator from -118 ppm/K to less than 1 ppm/K by tuning the supply voltage of the oscillator. The tuning technique adds no additional component and has a large frequency tunability of -4305 ppm/V. / Dissertation/Thesis / Ph.D. Electrical Engineering 2012

Résumé / Abstract

abstract: Testing and calibration constitute a significant part of the overall manufacturing cost of microelectromechanical system (MEMS) devices. Developing a low-cost testing and calibration scheme applicable at the user side that ensures the continuous reliability and accuracy is a crucial need. The main purpose of testing is to eliminate defective devices and to verify the qualifications of a product is met. The calibration process for capacitive MEMS devices, for the most part, entails the determination of the mechanical sensitivity. In this work, a physical-stimulus-free built-in-self-test (BIST) integrated circuit (IC) design characterizing the sensitivity of capacitive MEMS accelerometers is presented. The BIST circuity can extract the amplitude and phase response of the acceleration sensor's mechanics under electrical excitation within 0.55% of error with respect to its mechanical sensitivity under the physical stimulus. Sensitivity characterization is performed using a low computation complexity multivariate linear regression model. The BIST circuitry maximizes the use of existing analog and mixed-signal readout signal chain and the host processor core, without the need for computationally expensive Fast Fourier Transform (FFT)-based approaches. The BIST IC is designed and fabricated using the 0.18-µm CMOS technology. The sensor analog front-end and BIST circuitry are integrated with a three-axis, low-g capacitive MEMS accelerometer in a single hermetically sealed package. The BIST circuitry occupies 0.3 mm2 with a total readout IC area of 1.0 mm2 and consumes 8.9 mW during self-test operation. / Dissertation/Thesis / Doctoral Dissertation Electrical Engineering 2017

abstract: Micro Electro Mechanical Systems (MEMS) is one of the fastest growing field in silicon industry. Low cost production is key for any company to improve their market share. MEMS testing is challenging since input to test a MEMS device require physical stimulus like acceleration, pressure etc. Also, MEMS device vary with process and requires calibration to make them reliable. This increases test cost and testing time. This challenge can be overcome by combining electrical stimulus based testing along with statistical analysis on MEMS response for electrical stimulus and also limited physical stimulus response data. This thesis proposes electrical stimulus based built in self test(BIST) which can be used to get MEMS data and later this data can be used for statistical analysis. A capacitive MEMS accelerometer is considered to test this BIST approach. This BIST circuit overhead is less and utilizes most of the standard readout circuit. This thesis discusses accelerometer response for electrical stimulus and BIST architecture. As a part of this BIST circuit, a second order sigma delta modulator has been designed. This modulator has a sampling frequency of 1MHz and bandwidth of 6KHz. SNDR of 60dB is achieved with 1Vpp differential input signal and 3.3V supply / Dissertation/Thesis / M.S. Electrical Engineering 2013

abstract: The applications which use MEMS accelerometer have been on rise and many new fields which are using the MEMS devices have been on rise. The industry is trying to reduce the cost of production of these MEMS devices. These devices are manufactured using micromachining and the interface circuitry is manufactured using CMOS and the final product is integrated on to a single chip. Amount spent on testing of the MEMS devices make up a considerable share of the total final cost of the device. In order to save the cost and time spent on testing, researchers have been trying to develop different methodologies. At present, MEMS devices are tested using mechanical stimuli to measure the device parameters and for calibration the device. This testing is necessary since the MEMS process is not a very well controlled process unlike CMOS. This is done using an ATE and the cost of using ATE (automatic testing equipment) contribute to 30-40% of the devices final cost. This thesis proposes an architecture which can use an Electrical Signal to stimulate the MEMS device and use the data from the MEMS response in approximating the calibration coefficients efficiently. As a proof of concept, we have designed a BIST (Built-in self-test) circuit for MEMS accelerometer. The BIST has an electrical stimulus generator, Capacitance-to-voltage converter, ∑ ∆ ADC. This thesis explains in detail the design of the Electrical stimulus generator. We have also designed a technique to correlate the parameters obtained from electrical stimuli to those obtained by mechanical stimuli. This method is cost effective since the additional circuitry needed to implement BIST is less since the technique utilizes most of the existing standard readout circuitry already present. / Dissertation/Thesis / M.S. Electrical Engineering 2014

abstract: This thesis presents approaches to develop micro seismometers and accelerometers based on molecular electronic transducers (MET) technology using MicroElectroMechanical Systems (MEMS) techniques. MET is a technology applied in seismic instrumentation that proves highly beneficial to planetary seismology. It consists of an electrochemical cell that senses the movement of liquid electrolyte between electrodes by converting it to the output current. MET seismometers have advantages of high sensitivity, low noise floor, small size, absence of fragile mechanical moving parts and independence on the direction of sensitivity axis. By using MEMS techniques, a micro MET seismometer is developed with inter-electrode spacing close to 1μm, which improves the sensitivity of fabricated device to above 3000 V/(m/s^2) under operating bias of 600 mV and input acceleration of 400 μG (G=9.81m/s^2) at 0.32 Hz. The lowered hydrodynamic resistance by increasing the number of channels improves the self-noise to -127 dB equivalent to 44 nG/√Hz at 1 Hz. An alternative approach to build the sensing element of MEMS MET seismometer using SOI process is also presented in this thesis. The significantly increased number of channels is expected to improve the noise performance. Inspired by the advantages of combining MET and MEMS technologies on the development of seismometer, a low frequency accelerometer utilizing MET technology with post-CMOS-compatible fabrication processes is developed. In the fabricated accelerometer, the complicated fabrication of mass-spring system in solid-state MEMS accelerometer is replaced with a much simpler post-CMOS-compatible process containing only deposition of a four-electrode MET structure on a planar substrate, and a liquid inertia mass of an electrolyte droplet encapsulated by oil film. The fabrication process does not involve focused ion beam milling which is used in the micro MET seismometer fabrication, thus the cost is lowered. Furthermore, the planar structure and the novel idea of using an oil film as the sealing diaphragm eliminate the complicated three-dimensional packaging of the seismometer. The fabricated device achieves 10.8 V/G sensitivity at 20 Hz with nearly flat response over the frequency range from 1 Hz to 50 Hz, and a low noise floor of 75 μG/√Hz at 20 Hz. / Dissertation/Thesis / Ph.D. Electrical Engineering 2014

Orientadores: Peter Jurgen Tatsch, Stanislav Moshkalyov / Dissertação (mestrado) - Universidade Estadual de Campinas, Faculdade de Engenharia Eletrica e de Computação / Made available in DSpace on 2018-08-06T08:35:07Z (GMT). No. of bitstreams: 1 FioravanteJunior_NemerPaschoal_M.pdf: 3096593 bytes, checksum: 671d75f088339782b5b4b1dd5fc4463c (MD5) Previous issue date: 2004 / Resumo: O principal objetivo deste trabalho é o aperfeiçoamento dos processos de fotolitografia utilizados no Centro de Componentes Semicondutores (CCS) da Universidade Estadual de Campinas ¿ UNICAMP. Visa determinar os parâmetros de maior relevância do processo de fotolitografia utilizado no CCS para fabricação de estruturas micrométricas e a partir da sua caracterização identificar os seus valores ótimos. Os parâmetros tais como o contraste, a aderência, a resolução e a dimensão mínima dos padrões fotogravados foram estudados a fim de se determinar as possibilidades de melhoria e as limitações dos processos. No decorrer deste trabalho foi utilizado basicamente o fotorresiste AZ 5214E com o qual foi possível o desenvolvimento de processos repetitivos que permitiram a fabricação de estruturas periódicas com largura de até 2µm e estruturas isoladas com largura de até 0,8µm / Abstract: The aim of this work is to improve the photolithographic processes of the CCS/Unicamp. This work attempts findout and optimize the most significant process parameters for the fabrication of micrometric structures. Contrast, adhesion, resolution, and minimum dimension for the shapes were studied in order to improve the process and also determine their limitations. A procedure for the processing of AZ 5214E photoresist was established so that periodic structures with dimension as low as 2 µm and isolated structures down to 0,8 µm can be produced reproductively / Mestrado / Microeletronica / Mestre em Engenharia Elétrica

Because of thermal transients and gradients occurring upon rapid heating or cooling, microcomponents made from High-Temperature Co-fired Ceramics (HTCC) often fail at temperatures far below what the materials can withstand per se. This work investigates how resistance to thermal fracture in HTCC microcomponents can be increased by improving the component design, aiming at increasing the thermal performance of a microthruster with integrated heaters. The effect of four design parameters:  component and cavity geometries (circular or square), heater placement (central or peripheral), and addition of embedded platinum layers, on thermal fracture resistance was investigated experimentally through a study employing design of experiments. Components of different designs were manufactured, and their thermal fracture resistance tested by rapid heating until the occurrence of failure. Peripheral heater placement and presence of embedded platinum layers were seen to improve resistance to thermal fracture, whereas the shape of the component and the cavity did not significantly affect thermal performance. The most favourable design was then applied for a microthruster that was fabricated and evaluated with respect to thermal fracture resistance. The microthruster survived rapid heating up to 1461°C, and was operated as a cold gas microthruster at temperatures up to 772°C. None of these temperatures were limited by component failure, but by the component interface.