Transition Metal Silicides (TMS) are well known refractory materials because of their high thermal and structural stability at elevated temperature. In addition TMS materials are known for their moderate thermoelectric applications at high temperature since they exhibit superior semiconducting behavior. But TMS materials have relatively higher thermal conductivity which limits their applications in the field of thermoelectrics. So it is important to reduce their thermal conductivity to enhance conversion efficiency. In this regard, the work is performed to reduce the thermal conductivity of selected silicides such as CrSi2, MnSi2, and β-FeSi2 through alloys scattering and nano-structuring by mechanical alloying. A brief introduction about basic principles of thermoelectricity and related parameters are described in the chapter 1. Thermoelectric material’s figure of merit (zT) depends on the ratio of carrier charge transport and thermal energy transport. The conversion efficiency can be significantly enhanced by increasing the zT value. This chapter discusses the methods to increase the zT and list out some of the state-of-art of thermoelectric materials which possesses high zT value. Chapter 2 covers the preparation of selected silicides, such as CrSi2, MnSi2 and β-FeSi2, and the characterization techniques used to define the thermoelectric performance. In this chapter the suitability and the performance of transition metal silicides for high temperature thermoelectric application are discussed. In summary, the objective of the thesis has been framed. Chapter 3 deals with thermoelectric properties of pure and Mn, Al doped chromium disilicide (CrSi2). This chapter has been divided into three parts and discussed the effect of composition variation (CrSi1.90-2.10), point defects (by introducing Al at Si site), and mass-fluctuation scattering (by co-substitution of Mn and Al) on thermoelectric properties of polycrystalline CrSi2 in the temperature range of 300K-800K. In the first part, it is observed that CrSi2 has a homogeneity range of CrSi1.95-CrSi2.02. The secondary phases evolve above and below this homogeneity range. These secondary phases significantly scatter phonons and reduce the thermal conductivity. In the second part, Al has been introduced at Si site in CrSi2 and creates the point defects which is also scatter the short wavelength phonons and lead to low thermal conductivity. The third part explores the influence of co-substitution of Mn at Cr site and Al at Si site on lattice thermal conductivity. Here, substitution of Al creates point defects and addition of Mn leads to mass fluctuation scattering. These combined effects result in huge reduction in lattice thermal conductivity and thereby enhanced the zT. Chapter 4 deals with efforts of nano-structuring the CrSi2 through Mechanical Alloying (MA) using SS (stainless steel) and WC (Tungsten Carbide) milling media. The effects of two milling media on crystallite size reduction are discussed. It is seen that as milling time increases the rate of crystallite size reduction also increases. The X-ray diffraction studies of hot pressed pellets show the formation of secondary metallic phase like Cr1-xFexSi from SS milled samples and CrSi from WC milled samples. It indicates that CrSi2 gains metallic Fe atoms during mechanical alloying and the secondary phases are formed. As milling time increases it is observed that weight loss from the milling balls also increases. The Fe content coming from SS ball forms a solid solution with CrSi phase. The transport properties like resistivity, Seebeck coefficient and thermal conductivity were measured for milled samples from 300K-800K. It is observed that formation of the secondary metallic phase reduces resistivity and Seebeck coefficient of overall ceramics. Very large reduction in thermal conductivity was found for samples which were 15hrs-WC-milled (7.4 W/m.K at 375K) due to increased phonon scattering by grain boundaries. The 15hrs-SS-milled samples show thermal conductivity ~10 W/m.K which is considerably low as compared to the as-cast CrSi2 (13.5 W/m.K). This chapter explores the structural studies and mechano-chemical decomposition of CrSi2. In addition, the influences of mechanical milling media and micron size secondary phase on transport properties of CrSi2 are also discussed. Chapter 5 deals with the influence of microstructures of MnSi2 densified by hot uni-axial pressing (HP) and spark plasma sintering (SPS) on thermoelectric properties. The effects of these densification processes on arresting the grain growth during sintering are explored. The powder X-ray diffraction studies show higher manganese silicide (HMS) with secondary Si phase. The SEM and EPMA results confirmed the presence of Si phase. The TEM micrographs are shown the particle size distribution of HMS to be <200nm with fine precipitates of Si, of 5-10nm size, in the HMS matrix. The ball milled samples of MnSi2 showed increase in resistivity and Seebeck coefficient with large reduction in total thermal conductivity as compared to that seen in as-cast sample. The SPS densified samples show lower thermal conductivity, with reduction by about 52%, as compared to HP sample’s (45%) reduction for same conditions. An enhancement in zT by 73% could be achieved for the SPS densified for 2 min at 1060˚C. Chapter 6 examines (i) the decomposition of α–FeSi2, generally known as α-Fe2Si5, (eutectoid reaction) into β-FeSi2 with Si dispersoids (ii) formation of β-FeSi2 from ε-FeSi and α-Fe2Si5 (peritectoid reaction). This is accompanied by a discussion of the microstructural effect on thermoelectric properties. Prolonged annealing of peritectoid composition decomposes the α– FeSi2 phase, replaces the ε–FeSi phase, and forms pure β-FeSi2 whereas eutectoid composition of α–FeSi2 decomposes into lamellar structure of β-FeSi2 and Si dispersions. The aging heat treatment carried out for composition prepared from eutectoid reaction at various temperatures (600°C, 700°C, 800°C and 850°C for duration of 100hrs, 10hrs, 4hrs and 10hrs, respectively) below the equilibrium eutectoid temperature were found to have fine and homogenous dispersions of Si particles. The XRD and SEM studies confirmed the presence of a secondary Si phase on the matrix of β-FeSi2 for the heat treated eutectoid composition. The excess Si phase in β-FeSi2 increases the resistivity and Seebeck coefficient by the reducing carrier concentration of system as compared to those that of pure β-FeSi2, which is prepared from peritectoid composition. The samples heat treated at 600°C showed relatively low thermal conductivity as compared to that of β-FeSi2. This chapter gives a route map for reducing the thermal conductivity by micro structural engineering through Si dispersions on β-FeSi2. In addition, this comparison of two the decomposition processes and its influence on the microstructure and thermoelectric properties is made. Chapter 7 summarizes the key conclusions of the work performed in this thesis. The work reported in this thesis has been carried out by the candidate as a part of Ph.D training programme. He hopes that this would constitute a worthwhile contribution to the field of thermoelectrics for understanding the (i) effect of alloy scattering, (ii) mass fluctuation scattering, (iii) and nano-structuring of transition metal silicides for high temperature thermoelectric materials.

The knowledge of diffusion parameters provides important understanding of many physical and mechanical properties of materials. In most of the applications silicides are grown by a diffusion controlled process mainly in thin film condition. Because of this reason, most of the studies till date are available in thin film condition. Although more than one phase is present in all these systems, mainly disilicides were found at the interface. In this thesis bulk interdiffusion studies are conducted by coupling pure refractory metals (group IVB, VB and VIB elements) with single crystal Si. Several phase layers grow between binary refractory metal and Si systems. The layer thicknesses of the phases are measured from the microstructures. Composition profiles were measured in electron probe microanalyzer. Different diffusion parameters are estimated such as parabolic growth constants, integrated diffusion coefficients, activation energy for diffusion and ratio of tracer diffusivities of the components are estimated. Growth mechanisms of the phases are discussed with the help of diffusion parameters. The atomic mechanism of the diffusion is discussed considering crystal structure of the phases along with possible defects present. Solid diffusion couple experiments are conducted to analyse the growth mechanism of the phases and the diffusion mechanism of the components in the Ti-Si system. The calculation of the parabolic growth constant and of the integrated diffusion coefficients substantiates that the analysis is intrinsically prone to erroneous conclusions if it is based just on the parabolic growth constants determined for a multiphase interdiffusion zone. The location of the marker plane is detected based on the uniform grain morphology in the TiSi2 phase, which indicates that this phase grows mainly because of Si diffusion. The growth mechanism of the phases and morphological evolution in the interdiffusion zone are explained with the help of imaginary diffusion couples. The activation enthalpies for the integrated diffusion coefficient of TiSi2 and the Si tracer diffusion are calculated as 190±9 and 170±12 kJ/mol, respectively. The crystal structure, details on the nearest neighbours of the elements and the relative mobilities of the components indicate that the vacancies are mainly present on the Si sublattice. Diffusion controlled growth of the phases in the Hf-Si and Zr-Si are studied by bulk diffusion couple technique. Only two phases grow in the interdiffusion zone, although several phases are present in both the systems. The location of the Kirkendall marker plane detected based on the grain morphology indicates that the disilicides grow by the diffusion of Si. Diffusion of the metal species in these phases is negligible. This indicates that vacancies are present mainly on the Si sublattice. The activation energies for integrated diffusion coefficients in the HfSi2 and ZrSi2 are estimated as 394 ± 37 and 346 ± 34 kJ/mol, respectively. The same is calculated for the HfSi phase as 485±42 kJ/mol. The activation energies for Si tracer diffusion in the HfSi2 and ZrSi2 phases are estimated as 430 ± 36 and 348 ± 34 kJ/mol, respectively. We conducted interdiffusion studies to understand the atomic mechanism of the diffusing species and the growth mechanism of the phases. Integrated diffusion coefficients and the ratio of tracer diffusion coefficients were estimated for these analyses. The activation energies for the integrated diffusion coefficients were calculated as 550 ± 70 and 410 ± 39 kJ/mol in the TaSi2 and the Ta5Si3 phases, respectively. In the TaSi2 phase, Ta has a slightly lower but comparable diffusion rate with respect to Si, although no TaTa bonds are present in the crystal. In the Ta5Si3 phase, Si has higher diffusion rate, which is rather unusual, if we consider the atoms in the nearest-neighbor positions for both the elements. The ratio of Si to Ta tracer diffusion coefficients is found to be lower in the Si-rich phase, TaSi2, compared to the Si-lean phase, Ta5Si3, which is also unusual. This indicates the type of structural defects present. An analysis on the growth mechanism of the phases indicates that duplex morphology and the Kirkendall marker plane should only be present in the TaSi2 phase. This is not present in the Ta5Si3 phase because of the very high growth rate of the TaSi2 phase, which consumes most of the Ta5Si3 phase layer. The problems in the calculation method used previously by others in this system are also explained. Experiments are conducted in the W-Si system to understand the diffusion mechanism of the species. The activation energies for integrated diffusion are found to be 152±7 and 301±40 kJ/mol in the WSi2 and W5Si3 phases, respectively. In both the phases, Si has a much higher diffusion rate compared to W. The result found in the WSi2 phase is not surprising, if we consider the nearest neighbors in the crystal. However, it is rather unusual to find that Si has higher diffusion rate in the W5Si3 phase, indicating the presence of high concentration of Si antisites in this phase. In the group IVB, VB and VIB M-Si systems are considered to show an interesting pattern in diffusion of components with the change in atomic number in a particular group. MSi2 and M5Si3 are considered for this discussion. Except in the Ta-Si system, activation energy for integrated diffusion of MSi2 is always lower than M5Si3. Interestingly, in both the phases, the relative mobilities measured by the ratio of tracer D* diffusion coefficients, S i decreases with the increase in atomic number in both the DM* groups. Both the phases have similar crystal structures in a particular group in which these parameters are calculated. In both the phases Si has higher diffusion rate compared to M. Absence of any M-M bonds in MSi2 and increase in the diffusivities of M with the increase in atomic number substantiates the increasing concentration of M anti-sites and higher interactions of M with vacancies. Only one or two Si-Si bonds are present in M5Si3, however, the higher diffusion rate of Si indicates the presence of vacancies mainly D* on its sublattice. On the other hand, increase in S i with increasing atomic number in DM* Both the groups substantiates increasing interactions of M and vacancies.

La synthèse de siliciures métalliques sous la forme de films ultra-minces demeure un enjeu majeur en technologie CMOS. Le contrôle du budget thermique, afin de limiter la diffusion des dopants, est essentiel. Des techniques de recuit ultra-rapide sont alors couramment utilisées. Dans ce contexte, la technique de nanocalorimétrie est employée afin d'étudier, in situ, la formation en phase solide des siliciures de Ni à des taux de chauffage aussi élevés que 10^5 K/s. Des films de Ni, compris entre 9.3 et 0.3 nm sont déposés sur des calorimètres avec un substrat de a-Si ou de Si(100). Des mesures de diffraction de rayons X, balayées en température à 3 K/s, permettent de comparer les séquences de phase obtenues à bas taux de chauffage sur des échantillons de contrôle et à ultra-haut taux de chauffage sur les calorimètres. En premier lieu, il est apparu que l'emploi de calorimètres de type c-NC, munis d'une couche de 340 nm de Si(100), présente un défi majeur : un signal endothermique anormal vient fausser la mesure à haute température. Des micro-défauts au sein de la membrane de SiNx créent des courts-circuits entre la bande chauffante de Pt du calorimètre et l'échantillon métallique. Ce phénomène diminue avec l'épaisseur de l'échantillon et n'a pas d'effet en dessous de 400 °C tant que les porteurs de charge intrinsèques au Si ne sont pas activés. Il est possible de corriger la mesure de taux de chaleur en fonction de la température avec une incertitude de 12 °C. En ce qui a trait à la formation des siliciures de Ni à ultra-haut taux de chauffage, l'étude montre que la séquence de phase est modifiée. Les phases riches en m étal, Ni2Si et théta, ne sont pas détectées sur Si(100) et la cinétique de formation favorise une amorphisation en phase solide en début de réaction. Les enthalpies de formation pour les couches de Ni inférieures à 10 nm sont globalement plus élevées que dans le cas volumique, jusqu' à 66 %. De plus, les mesures calorimétriques montrent clairement un signal endothermique à haute température, témoignant de la compétition que se livrent la réaction de phase et l'agglomération de la couche. Pour les échantillons recuits a 3 K/s sur Si(100), une épaisseur critique telle que décrite par Zhang et Luo, et proche de 4 nm de Ni, est supposée. Un modèle est proposé, basé sur la difficulté de diffusion des composants entre des grains de plus en plus petits, afin d'expliquer la stabilité accrue des couches de plus en plus fines. Cette stabilité est également observée par nanocalorimétrie à travers le signal endothermique. Ce dernier se décale vers les hautes températures quand l'épaisseur du film diminue. En outre, une 2e épaisseur critique, d'environ 1 nm de Ni, est remarquée. En dessous, une seule phase semble se former au-dessus de 400 °C, supposément du NiSi2. / The synthesis of metal silicides in the form of ultra-thin films remains a major issue in CMOS technology. Controlling the thermal budget to limit dopant diffusion is essential and ultra-rapid annealing techniques are commonly used. In this context, the nanocalorimetry technique is used in situ to study Ni silicides phase formation at heating rate as high as 10^5 K/s. Ni films from 9.3 nm to 0.3 nm are carried out on calorimeters with either a-Si or Si(100) substrate. Ex situ temperature-resolved x-ray diffraction, scanned at low heating rate (3 K/s), is used in order to compare the phase sequence with the ones obtained at ultra-high heating rates. First, the use of c-NC calorimeters equipped with a Si(100) substrate, 340 nm thick, results in a major challenge. An abnormal endothermic signal is measured at high temperature. Results show that microdefects in the SiNx membrane create short circuits between the Pt heating strip of the calorimeter and the metal sample. This phenomenon decreases with the thickness of the metal sample and has no effect below 400 °C. Below this temperature the Si charge carriers are not activated. Then, the heat flow signal was corrected as a function of the temperature with an uncertainty of 12 ° C. In regard to the formation of Ni silicides at ultra-high heating rates, the study shows that the phase sequence is changed. On Si(100) substrate, the metal rich phases such as Ni2Si and theta -phase are no longer detected. Also, a solid state amorphization is favored at the beginning of the reaction. The enthalpies of formation for layers thinner than 10 nm are generally higher, up to 66 %, than those listed in literature for thick layers. Moreover, the calorimetric measurements clearly show an endothermic signal at high temperature, revealing a competition between the reaction of phase formation and the layer agglomeration. For sample annealed at 3 K/s on Si(100), the critical thickness as described by Zhang and Luo, is observed around 4 nm of Ni. A model is proposed in order to explain the increased stability when the layer thicknesses decrease. It is based on the fact that the diffusion of atoms is harder when grain sizes decrease. It also explains why the endothermic signals in nanocalorimetry shift toward higher temperatures when the layer thickness decreases. In addition, a second critical thickness of about 1 nm is noted. Below, it seems that only one phase forms, presumably the NiSi2.

<p>Materials with new or improved properties are crucial for technological development. To provide the foundation for future successful products, it is important to prepare and characterise new chemical compounds that could show unusual properties. The properties of magnetic materials are closely related to their crystal, magnetic and electronic structures. This thesis focuses on the novel synthesis and structural characterisation of a number of new ternary or <i>pseudo</i>-ternary silicides and germanides of manganese with iridium, cobalt or palladium. To provide a more complete picture of the complex magnetic properties, crystal and magnetic structure refinements by the Rietveld method of X-ray and neutron powder diffraction data are complemented by single-crystal X-ray diffraction, electron diffraction, magnetisation measurements and Reverse Monte Carlo simulations of magnetic short-range order. The experimental results are corroborated by first-principles electronic structure and total energy calculations. </p><p>A commensurate non-collinear antiferromagnetic structure is found for most compounds of the solid solution Mn₃Ir_1-yCo_ySi_1-xGe_x. The non-collinearity is a result of geometric frustration in a crystal structure with magnetic Mn atoms located on a three-dimensional network of triangles. The close structural similarity to the β-modification of elemental manganese, which does not order magnetically, inspired a closer theoretical comparison of the Mn₃Ir_1-yCo_ySi_1-xGe_x propertieswith β-Mn.</p><p>Magnetic frustration is also observed for Mn₄Ir_7-xMn_xGe₆, and is an important factor underlying the dramatic change from commensurate antiferromagnetic order to spin glass properties induced by a small variation in Mn concentration. Magnetic short-range order with dominant antiferromagnetic correlation is observed for Mn₈Pd₁₅Si₇, and results from a random distribution of Mn atoms in-between the geometrically frustrated magnetic moments on the Mn octahedra. </p><p>An incommensurate cycloidal magnetic structure, observed for IrMnSi, is stabilised by an electronic structure effect, which also accounts for the non-collinearity of the Mn₃IrSi type magnetic structure.</p>

Materials with new or improved properties are crucial for technological development. To provide the foundation for future successful products, it is important to prepare and characterise new chemical compounds that could show unusual properties. The properties of magnetic materials are closely related to their crystal, magnetic and electronic structures. This thesis focuses on the novel synthesis and structural characterisation of a number of new ternary or pseudo-ternary silicides and germanides of manganese with iridium, cobalt or palladium. To provide a more complete picture of the complex magnetic properties, crystal and magnetic structure refinements by the Rietveld method of X-ray and neutron powder diffraction data are complemented by single-crystal X-ray diffraction, electron diffraction, magnetisation measurements and Reverse Monte Carlo simulations of magnetic short-range order. The experimental results are corroborated by first-principles electronic structure and total energy calculations. A commensurate non-collinear antiferromagnetic structure is found for most compounds of the solid solution Mn3Ir1-yCoySi1-xGex. The non-collinearity is a result of geometric frustration in a crystal structure with magnetic Mn atoms located on a three-dimensional network of triangles. The close structural similarity to the β-modification of elemental manganese, which does not order magnetically, inspired a closer theoretical comparison of the Mn3Ir1-yCoySi1-xGex propertieswith β-Mn. Magnetic frustration is also observed for Mn4Ir7-xMnxGe6, and is an important factor underlying the dramatic change from commensurate antiferromagnetic order to spin glass properties induced by a small variation in Mn concentration. Magnetic short-range order with dominant antiferromagnetic correlation is observed for Mn8Pd15Si7, and results from a random distribution of Mn atoms in-between the geometrically frustrated magnetic moments on the Mn octahedra. An incommensurate cycloidal magnetic structure, observed for IrMnSi, is stabilised by an electronic structure effect, which also accounts for the non-collinearity of the Mn3IrSi type magnetic structure.

Transition Metal (TM) silicides are potential materials for different high temperature applications due to their high melting points and chemical stability at elevated temperatures. In the present work, the possible use of Gr (VIB) disilicides: MoSi2 and CrSi2 for high temperature structural application and thermopower generation respectively are investigated. Literature reports on MoSi2 indicate this material to have excellent mechanical and thermal behaviors at temperatures greater than 1273 K. The major problems limiting its use are the low temperature brittleness and oxidation at intermediate temperatures and form the scope of this work. Also, CrSi2 is reported to be a narrow band gap semiconductor. Its feasibility as a thermoelectric material for power generation is investigated. The first chapter briefly summarizes the literature on MoSi2 and CrSi2 relevant to structural and thermoelectric applications respectively. Based on the available literature, the scope of further work is discussed. The second chapter describes the methods of synthesis employed for these materials and the characterization techniques adopted. Some experimental setups like thermal conductivity and hot pressing unit that were fabricated as part of the work are described in detail. The thermal conductivity apparatus is based on the principle of parallel heat flow technique. It allows accurate measurement of K and S in the temperature range 300-700 K. The induction based hot-pressing unit allows compaction of polycrystalline powders to near theoretical densities thereby allowing quantitative evaluation of the physical properties. In the third chapter, an understanding of ductility/brittleness based of electron charge density distribution is attempted. The electron charge density in Tin and simple metals (BCC and FCC) is analyzed using Bader’s Atoms in Molecule (AIM) theory. Also the relevant surface and dislocation energies in these materials are calculated according to the Rice Model. It is found that the electron densities at the critical points correlate in a simple way with the relevant stacking fault and surface energetics. Based on these results, a ductility parameter (DM odel) based on electron charge distribution, to predict the effects of chemical substitutions on ductility/brittleness in materials is proposed. In the fourth chapter, possible elements to impart ductility in MoSi2 are identified based on the DM odel values. Calculations indicate, Nb, Ta, Al, Mg and Ga to be suitable candidates for improving ductility in MoSi2. Also oxidation studies based on present experiments and reported literature data reveal, Al to improve the intermediate temperature (773-873 K) oxidation behavior. Thus to simultaneously improve the low temperature ductility and oxidation resistance, Nb and Al were identified as suitable candidates. In the fifth chapter, the experimental data of Nb and Al co-substituted MoSi2 samples are reported. Oxidation studies carried out by thermogravimetry show improved oxidation resistance in Nb and Al co-substituted samples compared to pure MoSi2 in the temperature range of 773-873 K. Mechanical characterization was carried out for (Mo0.99Nb0.01)(Si0.96Al0.04)2 co-substituted composition. Compression testing at room temperature show plastic deformation at low strain rates (10−3 /sec). Indentation experiments show a reduction in the hardness and stiffness compared to pure MoSi2. There is also an increase in the fracture toughness (K1C ) value with the fracture modes being predominantly transgranular. The sixth chapter describes the structural, thermal and transport properties of CrSi2. Structural refinement was carried out by Rietveld method and the positional, thermal parameters and occupancy were fixed. Thermo-gravimetric analysis shows oxidation resistance in powdered samples upto 1000 K. Thermal expansion (α) studies reveal anisotropy in the α values with an unusual decrease in the average αV values between 500 and 600 K. Measurements of electrical resistivity and seebeck coefficient indicate a degenerate semiconducting behavior. Electronic band structure calculations indicate a narrow indirect band gap (EG) material with EG~0.35 eV. Thermal conductivity (K) measurements show a decrease in K value with increasing temperature. Calculation of the thermoelectric figure of merit (ZT) show a maximum value of 0.18 at 800 K for the temperature range studied. Based on an analysis of the experimental and theoretical results, it is identified that further improvements in ZT of CrSi2 may be possible by reducing the lattice thermal conductivity and optimization of the carrier concentration. In chapter seven, the effect of particle size on ZT of CrSi2 is studied. Nano powders of CrSi2 were prepared by mechanical milling. Contamination is found to be a major problem during milling and the different milling parameters (milling speed, atmosphere, dispersant etc) were optimized to minimize contamination. The milled powders were further hot pressed to achieve high densities in a short duration thereby minimizing the grain growth. It is observed that the lattice thermal conductivity is reduced significantly with decreasing grain size. Measurements of ZT show a maximum value of 0.20 in the milled sample compared to 0.14 in arc melted CrSi2 at 600 K. In chapter eight the effect of chemical substitutions on ZT of CrSi2 is studied. Mn substitutions in Cr site were carried out to study the effect of atomic mass on lattice thermal conductivity (KP ). Al substitutions in Si site were carried out to tune the Fermi level. Results of Mn substitution show a large decrease in KP but also a reduction in the thermoelectric power factor (S2σ). The maximum ZT observed in the Mn substituted samples was 0.12 at 600 K. Al substitution results in an increase in the thermoelectric power factor and a subsequent increase in ZT. The maximum ZT observed was 0.27 at 700 K for 10% substitution of Al in Si site. The work reported in the thesis has been carried out by the candidate as a part of the Ph.D. training programme at Materials Research Centre, Indian Institute of Science, Bangalore, India. He hopes that this work would constitute a worthwhile contribution towards (a) basic understanding of ductility/brittleness in materials and understanding the effects of chemical substitutions, (b) Suitability of chemically substituted MoSi2 to overcome the problems of low temperature brittleness and oxidation. (c) Development of CrSi2 as a high temperature thermoelectric material.