Orientadores: Amauri Garcia, Wislei Riuper Ramos Osório / Tese (doutorado) - Universidade Estadual de Campinas, Faculdade de Engenharia Mecânica / Made available in DSpace on 2018-08-21T02:28:07Z (GMT). No. of bitstreams: 1 Garcia_LeonardoRicheli_D.pdf: 14084477 bytes, checksum: f9b96fac198700cfcafeecf1edca6f9b (MD5) Previous issue date: 2012 / Resumo: A preocupação ambiental sobre a toxicidade do Pb combinada com normas rígidas, estão gradualmente proibindo a aplicação de Pb em ligas de soldas. As ligas alternativas Sn-Ag e Sn-Bi podem estar entre as mais promissoras candidatas à substituição das ligas de solda sem chumbo em função de apresentarem propriedades compatíveis com as da liga Sn-Pb. A fim de adequar os produtos aos novos requisitos, produtores de componentes microeletrônicos necessitam desenvolver novas ligas de solda. Estudos sobre a influência da taxa de resfriamento sobre a microestrutura e as propriedades mecânicas resultantes e as características de recobrimento dessas ligas necessitam ser realizados. Esse trabalho tem exatamente esse objetivo, e no qual é realizado um estudo experimental comparativo das principais características da tradicional liga Sn-Pb e das ligas Sn-Ag e Sn-Bi visando a aplicação dessas ligas como ligas alternativas de solda. As seguintes atividades foram desenvolvidas para atingir tais propósitos: i) solidificação unidirecional das ligas Sn-Ag (hipoeutética Sn-2%Ag e eutética Sn-3,5%Ag) e Sn-Bi (Sn-10, 20 e 40%Bi); ii) ensaios de mergulho de lâminas de cobre nas ligas Sn-Ag e Sn-Bi fundidas e; iii) ensaios de tração de acordo com as especificações da norma ASTM E 8M/04. Foi utilizado um dispositivo de solidificação vertical ascendente para obter os lingotes das ligas e os correspondentes perfis térmicos. Variáveis térmicas de solidificação como: taxa de resfriamento, velocidade de solidificação e tempo local de solidificação foram determinadas para as ligas Sn-Ag e Sn-Bi. Essas variáveis experimentais foram correlacionadas com os espaçamentos dendríticos secundários (l2) e foram propostas equações experimentais de crescimento dendrítico. A espessura da camada solidificada, a área recoberta e as microestruturas resultantes das ligas no substrato de cobre foram avaliadas após o ensaio de mergulho em diferentes temperaturas. Verificou-se que, considerando-se as ligas Sn-Ag e Sn-Bi examinadas, a liga Sn- 40%Bi apresenta maior resistência mecânica e a liga Sn-3,5%Ag apresenta molhabilidade similar quando comparada com a tradicional liga de solda Sn-40%Pb / Abstract: The increasingly environmental concern over the toxicity of Pb combined with strict regulations, are gradually banning the application of Pb-based solders. Sn-Ag and Sn-Bi solder alloys are among the most promising candidates for Pb-free alternatives due to their compatible properties with the Sn-Pb solder alloy. In order to adequate products to such restriction requirements, electronic components manufacturers have to meet such requirements by developing new lead-free solder alloys. Studies focusing on the influence of the cooling rate on the resulting microstructures and on both the mechanical properties and recovery of these alloys need to be carried out. This work has precisely such objective, in which a comparative experimental study of the main features of the traditional Sn-Pb alloy and Sn-Ag and Sn-Bi alloys is carried out with a view to application of the latter alloys as alternative solder materials. The following activities were developed to attain such purpose: i) unidirectional solidification of Sn-Ag alloys (hypoeutectic Sn-2 wt.% Ag, eutectic Sn-3.5 wt.% Ag), and Sn-Bi alloys (Sn-10, 20 and 40 wt.% Bi); ii) copper blades dipped in both molten Sn-Ag and Sn-Bi alloys (hot dipping) and iii) tensile testing according to specifications of ASTM standard E 8M/04. An upward vertical solidification system has been used to obtain the alloys ingots and their correspondent thermal profiles. Solidification thermal variables such as: the cooling rate, tip growth rate and local solidification time have been determined for Sn-Ag and Sn-Bi alloys. Such experimental variables have been correlated with secondary dendrite arm spacings (l2) and experimental equations of dendritic growth have been proposed. The thickness of the coating layers, the spreading areas and the resulting microstructures of these alloys on the copper substrates were evaluated after the hot dipping procedures at different temperatures. It was found that, of the examined Sn-Ag and Sn-Bi alloys, the Sn-40 wt.% Bi alloy has offered the highest mechanical strength and the Sn- 3.5 wt.% Ag alloy has shown similar wettability when compared with the traditional Sn-40 wt.% Pb solder alloy / Doutorado / Materiais e Processos de Fabricação / Doutor em Engenharia Mecânica

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Over the last few decades, body-centered-cubic (bcc) beta (β) titanium alloys have largely been exploited as structural alloys owing to the richness in their microstructural features. These features, which lead to a unique combination of high specific strength and ductility, excellent hardenability, good fatigue performance, and corrosion resistance, make these alloys viable candidates for many applications, including aerospace, automobile, and orthopedic implants. The mechanical properties of these alloys strongly depend on the various phases present; which can be controlled by thermomechanical treatments and/or alloy design. The two most important and studied phases are the metastable ω phase and the stable α phase. The present study focuses on the microstructural evolution and the mechanical behavior of these two phases in a model β-Ti alloy, binary Ti-12wt. %Mo alloy, and a commercial β-Ti alloy, β-21S. Microstructures containing athermal and isothermal ω phases in the binary Ti-12wt. %Mo alloy are obtained under specific accurate temperature controlled heat treatments. The formation and the evolution of the ω-phase based microstructures are investigated in detail via various characterization techniques such as SEM, TEM, and 3D atom probe tomography. The mechanical behavior was investigated via quasi-static tensile loading; at room and elevated temperatures. The effect of β phase stability on the deformation behavior is then discussed. Similar to the Ti-12wt. %Mo, the formation and the evolution of the athermal and isothermal ω phases in the commercial β-21S alloy was studied under controlled heat treatments. The structural and compositional changes were tracked using SEM, TEM, HR-STEM, and 3D atom probe tomography (3D-APT). The presence of additional elements in the commercial alloy were noted to make a considerable difference in the evolution and morphology of the ω phase and also the mechanical behavior of the alloys. The Portevin-Le Chatelier (PLC) like effect was observed in iii this alloy at elevated temperature and this has been attributed to the shearing of the ω precipitates and the dynamic precipitation of the α phase within these channels. The formation of the stable α phase in the commercial β-21S alloy due to the influence of precursor phases, like the metastable ω phase, is investigated. It is evident from the microstructural characterization, using SEM, TEM, HR-STEM, and 3D-APT, that the ω phase does play a role on the fine scale α precipitation. The mechanical behavior of the β+α microstructure, investigated via tensile testing, shows that these alloys are ideal candidate for precipitation hardening. The exceptional strength values obtained in this alloy have been attributed to a combination of several factors.