La tendance à la miniaturisation des produits n'est pas sans influence sur l'évolution de leurs moyens de production et d'assemblage. En effet, dû à la réduction d'échelle, l'assemblage de petits composants (appelé microassemblage) est perturbé par les forces de surface comme les forces de capillarité. Ces forces, exercées par le pont liquide reliant manipulateur et composant, sont habituellement négligeables (et négligées) dans l'assemblage conventionnel dominé par les forces de gravité. L'approche originale suivie dans ce travail consiste à tirer parti de ces effets et à les utiliser pour la manipulation de microcomposants, c'est-à-dire de composants dont la taille va de quelques dizaines de microns à quelques millimètres. Ce travail tente donc d'apporter quelques réponses aux problèmes de conception posés par un tel choix: quels sont les avantages d'une telle approche? Comment ces forces `fonctionnent-elles'? Sont-elles suffisamment grandes pour manipuler des microcomposants? Comment, dans ce cas, relâcher le composant? Quel rôle la tension de surface joue-t-elle? En quoi le choix des matériaux est-il important? Comment optimiser la conception du manipulateur? Tout au long de ce travail, le lecteur trouvera un inventaire des principes de manipulation existants, les éléments nécessaires à la modélisation des forces de capillarité, ainsi que la description de la simulation et du banc d'essai développés par l'auteur dans le but d'étudier ces paramètres de conception. Les résultats présentés dans cette thèse recouvrent essentiellement deux thèmes: quelles sont les règles de conception à suivre pour maximiser les forces de capillarité (problème de la préhension) et comment choisir une stratégie de relâche adéquate (problème de la relâche)?

La force de diélectrophorèse (DEP) est utilisée pour manipuler, séparer et positionner différent types des particules (cellules, bactéries, nanotubes de carbone). Dans le but d étudieret de simuler une loi de commande permettant le suivi de la trajectoire d une particule soumise à la force DEP un modèle est nécessaire. Les méthodes utilisées pour simuler la force DEP sont généralement basées soit sur des simulateurs à éléments finis (FEM), soit sur des équations analytiques. Les simulateurs FEM ne permettent pas la variation des paramètres (tensions électriques) lors du calcul de la trajectoire et les équations analytiques sont limitées à des géométries simples des électrodes. Dans ce manuscrit, une méthode hybride basée sur les calculs FEM et analytique est proposée. Cette méthode permet de simuler la trajectoire d une particule en utilisant des géométries complexes et en variant les tensions électriques lors de la simulation. Ce modèle est ensuite validé en le comparant à des relevés expérimentaux. Finalement, une loi de commande, basée sur la commande prédictive généralisée (GPC) est proposée dans le but de contrôler la trajectoire, en profitant de la grande dynamique du déplacement de la particule, et ce malgré les non-linéarités. Cette loi de commande a été validée par des résultats de simulations et une comparaison avec une loi de commande classique. / Micro and nano-particles can be trapped by a non uniform electric field through the effect of dielectrophoretic (DEP) principle. Dielectrophoresis is used to separate, manipulate and detect micro particles in several domains, such as in biological or Carbon Nano-Tubes (CNTs) manipulations. To study and simulate a vision based closed loop control law in order to control the trajectory of micro objects using DEP a numeric model is required. Current methods to simulate the trajectory of micro-particles under a DEP force field are based on finite element modeling (FEM) which requires new simulations when one of its parameters, like the electric voltage, is changed, or on analytic equations which is limited to very simple geometries. In the first section of this manuscript, we propose a hybrid method between analytic and numeric calculation able to simulate complex geometries and to easily change electrode voltage along the trajectory. This numeric model is, then, validated by comparing it with several experimental results. Finally, a control strategy based on the generalized predictive control method is proposed with the aim of controlling the trajectory, taking advantage of the high dynamics despite the non linearity. This control law has been validated by simulation and compared to classical control strategy.

The goal of the present work is to develop, and evaluate a parametric model of a basic microscale Self-Assembly (SA) interaction that provides scaling predictions of process rates as a function of key process variables. At the microscale, assembly by “grasp and release” is generally challenging. Recent research efforts have proposed adapting nanoscale self-assembly (SA) processes to the microscale. SA offers the potential for reduced equipment cost and increased throughput by harnessing attractive forces (most commonly, capillary) to spontaneously assemble components. However, there are challenges for implementing microscale SA as a commercial process. The existing lack of design tools prevents simple process optimization. Previous efforts have characterized a specific aspect of the SA process. However, the existing microscale SA models do not characterize the inter-component interactions. All existing models have simplified the outcome of SA interactions as an experimentally-derived value specific to a particular configuration, instead of evaluating it outcome as a function of component level parameters (such as speed, geometry, bonding energy and direction). The present study parameterizes the outcome of interactions, and evaluates the effect of key parameters. The present work closes the gap between existing microscale SA models to add a key piece towards a complete design tool for general microscale SA process modeling. First, this work proposes a simple model for defining the probability of assembly of basic SA interactions. A basic SA interaction is defined as the event where a single part arrives on an assembly site. The model describes the probability of assembly as a function of kinetic energy, binding energy, orientation and incidence angle for the component and the assembly site. Secondly, an experimental SA system was designed, and implemented to create individual SA interactions while controlling process parameters independently. SA experiments measured the outcome of SA interactions, while studying the independent effects of each parameter. As a first step towards a complete scaling model, experiments were performed to evaluate the effects of part geometry and part travel direction under low kinetic energy conditions. Experimental results show minimal dependence of assembly yield on the incidence angle of the parts, and significant effects induced by changes in part geometry. The results from this work indicate that SA could be modeled as an energy-based process due to the small path dependence effects. Assembly probability is linearly related to the orientation probability. The proportionality constant is based on the area fraction of the sites with an amplification factor. This amplification factor accounts for the ability of capillary forces to align parts with only very small areas of contact when they have a low kinetic energy. Results provide unprecedented insight about SA interactions. The present study is a key step towards completing a basic model of a general SA process. Moreover, the outcome from this work can complement existing SA process models, in order to create a complete design tool for microscale SA systems. In addition to SA experiments, Monte Carlo simulations of experimental part-site interactions were conducted. This study confirmed that a major contributor to experimental variation is the stochastic nature of experimental SA interactions and the limited sample size of the experiments. Furthermore, the simulations serve as a tool for defining an optimum sampling strategy to minimize the uncertainty in future SA experiments.

No description available.

The scalability and cost of microelectromechanical systems (MEMS) optical switches are now the important factors driving the development of MEMS optical switches technology. The employment of MEMS in the design and fabrication of optical switches through the use of micromachining fabricated micromirrors expands the capability and integrity of optical backbone networks. The focus of this dissertation is on the design, fabrication, and implementation of a new type of MEMS optical switch that combines the advantages of both 2-D and 3-D MEMS switch architectures. This research presents a new digital MEMS switch architecture for 1×N and N×N optical switches. The architecture is based on a new microassembled smart 3-D rotating inclined micromirror (3DRIM). The 3DRIM is the key device in the new switch architectures. The 3DRIM was constructed through a microassembly process using a passive microgripper, key, and inter-lock (PMKIL) assembly system. An electrostatic micromotor was chosen as the actuator for the 3DRIM since it offers continuous rotation as well as small, precise step motions with excellent repeatability that can achieve repeatable alignment with minimum optical insertion loss between the input and output ports of the switch. In the first 3DRIM prototype, a 200×280 microns micromirror was assembled on the top of the electrostatic micromotor and was supported through two vertical support posts. The assembly technique was then modified so that the second prototype can support micromirrors with dimensions up to 400×400 microns. Both prototypes of the 3DRIM are rigid and stable during operation. Also, rotor pole shaping (RPS) design technique was introduced to optimally reshape the physical dimensions of the rotor pole in order to maximize the generated motive torque of the micromotor and minimize the required driving voltage signal. The targeted performance of the 3DRIM was achieved after several PolyMUMPs fabrication runs. The new switch architecture is neither 2-D nor 3-D. Since it is composed of two layers, it can be considered 2.5-D. The new switch overcomes many of the limitations of current traditional 2-D MEMS switches, such as limited scalability and large variations in the insertion loss across output ports. The 1×N MEMS switch fabric has the advantage of being digitally operated. It uses only one 3DRIM to switch the light signal from the input port to any output port. The symmetry employed in the switch design gives it the ability to incorporate a large number of output ports with uniform insertion losses over all output channels, which is not possible with any available 2-D or 3-D MEMS switch architectures. The second switch that employs the 3DRIM is an N×N optical cross-connect (OXC) switch. The design of an N×N OXC uses only 2N of the 3DRIM, which is significantly smaller than the N×N switching micromirrors used in 2-D MEMS architecture. The new N×N architecture is useful for a medium-sized OXC and is simpler than 3-D architecture. A natural extension of the 3DRIM will be to extend its application into more complex optical signal processing, i.e., wavelength-selective switch. A grating structures have been selected to explore the selectivity of the switch. For this reason, we proposed that the surface of the micromirror being replaced by a suitable gratings instead of the flat reflective surface. Thus, this research has developed a rigorous formulation of the electromagnetic scattered near-field from a general-shaped finite gratings in a perfect conducting plane. The formulation utilizes a Fourier-transform representation of the scattered field for the rapid convergence in the upper half-space and the staircase approximation to represent the field in the general-shaped groove. This method provides a solution for the scattered near-field from the groove and hence is considered an essential design tool for near-field manipulation in optical devices. Furthermore, it is applicable for multiple grooves with different profiles and different spacings. Each groove can be filled with an arbitrary material and can take any cross-sectional profile, yet the solution is rigorous because of the rigorous formulations of the fields in the upper-half space and the groove reigns. The efficient formulation of the coefficient matrix results in a banded-matrix form for an efficient and time-saving solution.

The scalability and cost of microelectromechanical systems (MEMS) optical switches are now the important factors driving the development of MEMS optical switches technology. The employment of MEMS in the design and fabrication of optical switches through the use of micromachining fabricated micromirrors expands the capability and integrity of optical backbone networks. The focus of this dissertation is on the design, fabrication, and implementation of a new type of MEMS optical switch that combines the advantages of both 2-D and 3-D MEMS switch architectures. This research presents a new digital MEMS switch architecture for 1×N and N×N optical switches. The architecture is based on a new microassembled smart 3-D rotating inclined micromirror (3DRIM). The 3DRIM is the key device in the new switch architectures. The 3DRIM was constructed through a microassembly process using a passive microgripper, key, and inter-lock (PMKIL) assembly system. An electrostatic micromotor was chosen as the actuator for the 3DRIM since it offers continuous rotation as well as small, precise step motions with excellent repeatability that can achieve repeatable alignment with minimum optical insertion loss between the input and output ports of the switch. In the first 3DRIM prototype, a 200×280 microns micromirror was assembled on the top of the electrostatic micromotor and was supported through two vertical support posts. The assembly technique was then modified so that the second prototype can support micromirrors with dimensions up to 400×400 microns. Both prototypes of the 3DRIM are rigid and stable during operation. Also, rotor pole shaping (RPS) design technique was introduced to optimally reshape the physical dimensions of the rotor pole in order to maximize the generated motive torque of the micromotor and minimize the required driving voltage signal. The targeted performance of the 3DRIM was achieved after several PolyMUMPs fabrication runs. The new switch architecture is neither 2-D nor 3-D. Since it is composed of two layers, it can be considered 2.5-D. The new switch overcomes many of the limitations of current traditional 2-D MEMS switches, such as limited scalability and large variations in the insertion loss across output ports. The 1×N MEMS switch fabric has the advantage of being digitally operated. It uses only one 3DRIM to switch the light signal from the input port to any output port. The symmetry employed in the switch design gives it the ability to incorporate a large number of output ports with uniform insertion losses over all output channels, which is not possible with any available 2-D or 3-D MEMS switch architectures. The second switch that employs the 3DRIM is an N×N optical cross-connect (OXC) switch. The design of an N×N OXC uses only 2N of the 3DRIM, which is significantly smaller than the N×N switching micromirrors used in 2-D MEMS architecture. The new N×N architecture is useful for a medium-sized OXC and is simpler than 3-D architecture. A natural extension of the 3DRIM will be to extend its application into more complex optical signal processing, i.e., wavelength-selective switch. A grating structures have been selected to explore the selectivity of the switch. For this reason, we proposed that the surface of the micromirror being replaced by a suitable gratings instead of the flat reflective surface. Thus, this research has developed a rigorous formulation of the electromagnetic scattered near-field from a general-shaped finite gratings in a perfect conducting plane. The formulation utilizes a Fourier-transform representation of the scattered field for the rapid convergence in the upper half-space and the staircase approximation to represent the field in the general-shaped groove. This method provides a solution for the scattered near-field from the groove and hence is considered an essential design tool for near-field manipulation in optical devices. Furthermore, it is applicable for multiple grooves with different profiles and different spacings. Each groove can be filled with an arbitrary material and can take any cross-sectional profile, yet the solution is rigorous because of the rigorous formulations of the fields in the upper-half space and the groove reigns. The efficient formulation of the coefficient matrix results in a banded-matrix form for an efficient and time-saving solution.

Στις τελευταίες δεκαετίες η σμίκρυνση (miniaturization) έχει αποτελέσει ένα σημαντικό παράγοντα στην ανάπτυξη της τεχνολογίας. Ένας από τους κύριους στόχους της μέσω της μικρομηχανικής (micro-engineering) είναι η παραγωγή ολοκληρωμένων Μικρο-Ηλεκτρο-Μηχανικών Συστημάτων (MEMS), τα οποία χρηςιμοποιούνται σήμερα ως υποσυστήματα σε πάρα πολλές εφαρμογές. Αντικείμενο της παρούσας διατριβής είναι ο παράλληλος χειρισμός καθώς και η ανοιχτού βρόχου/άνευ αισθητήρων συναρμολόγηση μικροαντικειμένων χωρίς τη χρήση μικροβραχιόνων. Για το σκοπό αυτό η έρευνα επικεντρώθηκε σε τέσσερις διαφορετικές διαδικασίες/προσεγγίσεις: α) το μικροχειρισμό με τρισδιάστατα πεδία δυνάμεων, β) το μικροχειρισμό με προγραμματιζόμενα πεδία δυνάμεων στο επίπεδο, γ) το χειρισμό μικροαντικειμένων έγκλειστων σε σταγόνες υγρού και δ) την αυτοσυναρμολόγηση μικροαντικειμένων με ηλεκτροστατικές δυνάμεις. / In the last decades, miniaturization has become an important factor in the development of technology. One of its main objectives through the discipline of micro-engineering is the production of integrated Micro-Electro-Mechanical Systems (MEMS), which are currently used as sub-systems in many applications. The target of this thesis is the parallel manipulation and the open-loop/sensorless assembly of microparts without the use of microrobots. For this purpose, the research was focused on four different procedures: a) micromanipulation with 3D force fields, b) micromanipulation with programmable force fields on a plane, c) manipulation of microparts enclosed in a droplet of liquid and d)self-assembly of microparts with electrostatic forces.

Micro-assembly is of crucial importance in industry nowadays. Nevertheless, currently applied processes require improvements. Indeed, when dealing with the assembly of submillimetric components, usually neglected surface forces disturb the manipulation task. They are responsible for the component sticking to the gripper, because of downscaling laws. A promising strategy to tackle adhesion consists in working without contact. The present dissertation is focused on contactless handling with acoustic levitation.<p>The advantages of contactless handling, the physical principles suitable for levitation and their applications are detailed. The opportunity for new handling strategies are shown. Acoustic levitation appears as the most fitted principle for micro-assembly. The elements to model acoustic forces are analysed and performances of existing modellings are assessed. A general numerical model of acoustic forces is implemented and theoretically validated with literature benchmarks. A fully automated modular levitator prototype is designed and used to experimentally validate the implemented numerical model. Specific instrumentations and protocols are developed for the acoustic force measurements.<p>The numerical model is finally applied to the real levitator. Modelling results are used to support experimental observations: the optimisation of the levitator resonance, the influence of the reflector shape, the dynamical study of the component oscillations, the stability with lateral centring forces and rotation torques, the component insertion and extraction from the levitator, the effect of pressure harmonics on the acoustic forces, and the manipulation of non spherical components. Acoustic forces are experimentally measured and a very good agreement with the modellings is obtained. Consequently, the implemented simulation tool can successfully be applied to a complex manipulation task with a component of any shape in a real levitator. / Doctorat en Sciences de l'ingénieur / info:eu-repo/semantics/nonPublished

La tendance à la miniaturisation des produits n'est pas sans influence sur l'évolution de leurs moyens de production et d'assemblage. En effet, dû à la réduction d'échelle, l'assemblage de petits composants (appelé microassemblage) est perturbé par les forces de surface comme les forces de capillarité. Ces forces, exercées par le pont liquide reliant manipulateur et composant, sont habituellement négligeables (et négligées) dans l'assemblage conventionnel dominé par les forces de gravité. L'approche originale suivie dans ce travail consiste à tirer parti de ces effets et à les utiliser pour la manipulation de microcomposants, c'est-à-dire de composants dont la taille va de quelques dizaines de microns à quelques millimètres. Ce travail tente donc d'apporter quelques réponses aux problèmes de conception posés par un tel choix: quels sont les avantages d'une telle approche? Comment ces forces `fonctionnent-elles'? Sont-elles suffisamment grandes pour manipuler des microcomposants? Comment, dans ce cas, relâcher le composant? Quel rôle la tension de surface joue-t-elle? En quoi le choix des matériaux est-il important? Comment optimiser la conception du manipulateur? Tout au long de ce travail, le lecteur trouvera un inventaire des principes de manipulation existants, les éléments nécessaires à la modélisation des forces de capillarité, ainsi que la description de la simulation et du banc d'essai développés par l'auteur dans le but d'étudier ces paramètres de conception. Les résultats présentés dans cette thèse recouvrent essentiellement deux thèmes: quelles sont les règles de conception à suivre pour maximiser les forces de capillarité (problème de la préhension) et comment choisir une stratégie de relâche adéquate (problème de la relâche)? / Doctorat en sciences appliquées / info:eu-repo/semantics/nonPublished

La thèse propose l’utilisation d’une pince active instrumentée en force pour automatiser l’assemblage des MOEMS 3D hybrides. Chacun des doigts de la pince instrumentée est composé d’un actionneur piézo-électrique et d’un capteur de force piézorésistif intégré. Le capteur de force intégré présente des performances innovantes par rapport aux capteurs existants dans l’ état de l’art. Cette pince offre la possibilité de mesurer les forces de serrage appliquées par la pince pour saisir un micro composant et d’estimer les forces de contact entre le micro composant et le substrat de micro-assemblage.Un modèle dynamique et non linéaire est développé pour la pince instrumentée. Une commande hybride force/position est utilisée pour automatiser le micro-assemblage. Dans cette commande, certains axes sont commandés en position et les autres sont commandés en force. Pour les axes commandés en force, une nouvelle commande fondée sur une commande en impédance avec suivi de référence est proposée selon un principe de commande non linéaire par mode glissant avec estimation des paramétres en lignes. En utilisant le schéma de commande hybride force/position proposé, une automatisation de toutes les tâches de micro-assemblage est réalisée avec succès, notamment sur un composant flexible à guider dans un rail. / This work proposes the use of an active microgripper with sensorized end-effectors for the automationof the microassembly of 3D hybrid MOEMS. Each of the two fingers of the microgripper is composedof a piezoelectric actuator with an integrated piezoresistive force sensor. The integrated force sensorpresents innovative performances compared to the existing force sensors in literature. The forcesensors provide the ability to measure the gripping forces applied by the microgripper to grasp a microcomponentand estimated the contact forces between the microcomponent and the substrate ofmicroassembly. A dynamic nonlinear model of the microgripper is developed. A hybrid force/positioncontrol is used for the automation of the microassembly. In the hybrid force/position control formulation,some axes are controlled in position and others are controlled in force. For the force controlledaxes, a new nonlinear force control scheme based on force tracking sliding mode impedance controlis proposed with parameter estimation. Using the proposed hybrid force/position control scheme, fullautomation of the microassembly is performed, notably for the guiding of a flexible component in arail.