This thesis reports the development of high-performance symmetric and decoupled micromachined gyroscopes for tactical-grade inertial measurement applications. The symmetric structure allows easy matching of the resonance frequencies of the drive and sense modes of the gyroscopes for achieving high angular rate sensitivity / while the decoupled drive and sense modes minimizes mechanical cross-coupling for low-noise and stable operation. Three different and new symmetric and decoupled gyroscope structures with unique features are presented. These structures are fabricated in four different micromachining processes: nickel electroforming (NE), dissolved-wafer silicon micromachining (DWSM), silicon-on-insulator (SOI) micromachining, and silicon-on-glass (SOG) micromachining. The fabricated gyroscopes have capacitive gaps from 1.5&micro / m to 5.5&micro / m and structural layer thicknesses from 12&micro / m to 100&micro / m, yielding aspect ratios up to 20 depending on the fabrication process. The size of fabricated gyroscope chips varies from 1x1mm2 up to 4.2x4.6mm2. Fabricated gyroscopes are hybrid-connected to a designed capacitive interface circuit, fabricated in a standard 0.6&micro / m CMOS process. They have resonance frequencies as small as 2kHz and as large as 40kHz / sense-mode resonance frequencies can be electrostatically tuned to the drive-mode frequency by DC voltages less than 16V. The quality factors reach to 500 at atmospheric pressure and exceed 10,000 for the silicon gyroscopes at vacuum. The parasitic capacitance of the gyroscopes on glass substrates is measured to be as small as 120fF. The gyroscope and interface assemblies are then combined with electronic control and feedback circuits constructed with off-the-shelf IC components to perform angular rate measurements. Measured angular rate sensitivities are in the range from 12&micro / V/(deg/sec) to 180&micro / V/(deg/sec), at atmospheric pressure. The SOI gyroscope demonstrates the best performance at atmospheric pressure, with noise equivalent rate (NER) of 0.025(deg/sec)/Hz1/2, whereas the remaining gyroscopes has an NER better than 0.1(deg/sec)/Hz1/2, limited by either the small sensor size or by small quality factors. Gyroscopes have scale-factor nonlinearities better than 1.1% with the best value of 0.06%, and their bias drifts are dominated by the phase errors in the demodulation electronics and are over 1deg/sec. The characterization of the SOI and SOG gyroscopes at below 50mTorr vacuum ambient yield angular rate sensitivities as high as 1.6mV/(deg/sec) and 0.9mV/(deg/sec), respectively. The NER values of these gyroscopes at vacuum are smaller than 50(deg/hr)/Hz1/2 and 36(deg/hr)/Hz1/2, respectively, being close to the tactical-grade application limits. Gyroscope structures are expected to provide a performance better than 10 deg/hr in a practical measurement bandwidth such as 50Hz, provided that capacitive gaps are minimized while preserving the aspect ratio, and the demodulation electronics are improved.

Thermal, electrical, and mechanical characteristics of heated cantilevers were experimentally studied in various conditions. Experiments investigated thermal, mechanical, and coupled behaviors of the heated cantilevers under DC, AC, and transient electrical heating. Raman spectroscopy measured local temperature and qualitative intrinsic stress with high spatial resolution. Based on the thorough understanding from device characterization, cantilever type micro hotplates and small array of heated cantilevers with integrated piezoresistive sensors were fabricated and characterized. Well characterized cantilever sensors were applied to heat transfer study and microfludic research. Heated microcantilevers were suggested to study sub-continuum heat transfer from a micro heater to ambient gas environment in a wide range of pressure. Microcantilever sensors were employed to study the free microjets emanated from microfabricated nozzles. Piezoresistive cantilevers measured jet thrust, velocity, and break-up distance of the liquid microjets and heated cantilevers investigated heat transfer characteristics and phase change phenomena during the microjet impingement.

This thesis discusses the design, fabrication, integration and characterization of millimeter wave passive components using polymer-core-conductor surface micromachining technologies. Several antennas, including a W-band broadband micromachined monopole antenna on a lossy glass substrate, and a Ka-band elevated patch antenna, and a V-band micromachined horn antenna, are presented. All antennas have advantages such as a broad operation band and high efficiency. A low-loss broadband coupler and a high-Q cavity for millimeter-wave applications, using surface micromachining technologies is reported using the same technology. Several low-loss all-pole band-pass filters and transmission-zero filters are developed, respectively. Superior simulation and measurement results show that polymer-core-conductor surface micromachining is a powerful technology for the integration of high-performance cavity, coupler and filters. Integration of high performance millimeter-wave transceiver front-end is also presented for the first time. By elevating a cavity-filter-based duplexer and a horn antenna on top of the substrate and using air as the filler, the dielectric loss can be eliminated. A full-duplex transceiver front-end integrated with amplifiers are designed, fabricated, and comprehensively characterized to demonstrate advantages brought by this surface micromachining technology. It is a low loss and substrate-independent solution for millimeter-wave transceiver integration.

The need for miniaturized frequency-selective components in electronic systems is clear. The questions are whether and how micro-electro-mechanical systems (MEMS) can satisfy the need. This dissertation aims to address these questions from a scientific perspective. Silicon is the focus of this work, as it can benefit from scaling of the semiconductor industry. Silicon also offers many technical advantages. The characteristics of silicon resonators from 32 kHz to 1 GHz are described. The temperature stability and phase noise of a 6-MHz temperature-compensated oscillator and a 100-MHz temperature-controlled oscillator are reported. Silicon resonator design and characterization, with a focus on quality factor, linearity, and the electrical equivalent circuit, are included. Electrical tuning, electromechanical coupling, finite element modeling, and unexpected findings of these resonators are also described. A manufacturability technique employing batch process compensation is demonstrated. Results indicate that silicon is an excellent material for micromechanical resonators. The aim of this research is to explore the fundamental limitations, provide a foundation for future work, and also paint a clearer picture on how micromechanical resonators can complement alternative technologies.

In this thesis, the development of a novel electro-thermally actuated bi-stable out-of-plane two way actuated buckled micro-bridge for a potential application in optical switching is presented. The actuator consists of a bridge supported by 'legs' and springs at its four corners. The springs and the bridge are made of a tri-layer structure comprising of 2.5??m thick low-stress PECVD oxide, 1??m thick high-stress PECVD oxide and 2??m thick heavily phosphorus doped silicon. The legs, on the other hand, are 2??m thick single layer heavily phosphorus doped silicon. Both legs and springs provide elastically constrained boundary conditions at the supporting ends, without of which important features of the micro-bridge actuator could not have been achieved. This microbridge actuator is designed, simulated using ANSYS, fabricated and tested. The results from the testing have shown a good agreement with analytical prediction and ANSYS simulation. The actuator demonstrated bi-stability, two-way actuation and 31??m out-of-plane movement between the two-states using low voltage drive. Buckled shape model, design method for bi-stability and thermo-mechanical model are developed and employed in the design of the micro-bridge. These models are compared with Finite Element (FE) based ANSYS simulation and measurements from the fabricated micro-bridge and have shown a good agreement. In order to demonstrate the potential application of this actuator to optical switching, ANSYS simulation studies have been performed on a micro-mirror integrated with the micro-bridge actuator. From these studies, the optimum micro-mirror size that is appropriate for the integration has been obtained. This optimal mirror size ensures the important features of the actuator. Mirror fabrication experiments in (110) wafer have been carried out to find out the appropriate compensation mask size for a given etch depth and the suitable wafer thickness that can be used to fabricate the integrated system.

Thesis (Ph. D.)--Ohio State University, 2007. / Title from first page of PDF file. Includes bibliographical references (p. 206-216).

Thesis (Ph.D.)--Electrical and Computer Engineering, Georgia Institute of Technology, 2008. / Committee Chair: John Papapolymerou; Committee Chair: Manos Tentzeris; Committee Member: Gordon Stuber; Committee Member: John Cressler; Committee Member: John Z. Zhang; Committee Member: Joy Laskar

Thesis (M. S.)--Mechanical Engineering, Georgia Institute of Technology, 2008. / Committee Chair: King, William; Committee Member: Graham, Samuel; Committee Member: Hesketh, Peter

Thesis (M. S.)--Mechanical Engineering, Georgia Institute of Technology, 2008. / Committee Chair: Dr. Seyed M. Ghiaasiaan; Committee Member: Dr. Marc K. Smith; Committee Member: Dr. Sheldon M. Jeter

Thesis (M.S.)--University of Texas at El Paso, 2009. / Title from title screen. Vita. CD-ROM. Includes bibliographical references. Also available online.