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  • About
  • The Global ETD Search service is a free service for researchers to find electronic theses and dissertations. This service is provided by the Networked Digital Library of Theses and Dissertations.
    Our metadata is collected from universities around the world. If you manage a university/consortium/country archive and want to be added, details can be found on the NDLTD website.
111

Interfacial adhesion and subcritical debonding of low-k dielectrics in flip-chip-packaged copper/low-k interconnect structures /

Miller, Mikel Rolf, January 2000 (has links)
Thesis (Ph. D.)--University of Texas at Austin, 2000. / Vita. Includes bibliographical references (leaves 165-169). Available also in a digital version from Dissertation Abstracts.
112

Steam driven delamination in electronics packages /

Chong, Iok Tong. January 2002 (has links)
Thesis (M. Phil.)--Hong Kong University of Science and Technology, 2002. / Includes bibliographical references. Also available in electronic version. Access restricted to campus users.
113

Comparison of thermal fatigue reliability between SAC and SnPb solders under various stress range conditions /

Yang, Chaoran. January 2009 (has links)
Includes bibliographical references (p. 80-84).
114

A multi-scale method for the prediction of delamination in electronic packages /

Fan, Haibo. January 2005 (has links)
Thesis (Ph.D.)--Hong Kong University of Science and Technology, 2005. / Includes bibliographical references. Also available in electronic version.
115

Understanding adhesion issues at underfill - passivation interfaces /

McAdams, Brian J., January 2005 (has links)
Thesis (Ph. D.)--Lehigh University, 2005. / Includes vita. Includes bibliographical references (leaves 170-187).
116

Surface modification of paper and cellulose using plasma enhanced chemical vapor deposition employing fluorocarbon precursors

Vaswani, Sudeep. January 2005 (has links)
Thesis (Ph. D.)--Chemical Engineering, Georgia Institute of Technology, 2005. / Bidstrup Allen, Sue Ann, Committee Member ; Ludovice, Peter, Committee Member ; Hess, Dennis, Committee Chair ; Henderson, Clifford, Committee Member ; Patterson, Timothy, Committee Member.
117

Extreme service packaging for silicon carbide electronic devices

Guinel, Maxime Jean-Franc̜ois. January 2006 (has links) (PDF)
Thesis (Ph. D.)--Washington State University, May 2006. / Includes bibliographical references.
118

Thermal deformation of electronic packages and packaging effect on reliability for copper/low-k interconnect structures

Wang, Guotao, Ho, P. S. January 2004 (has links) (PDF)
Thesis (Ph. D.)--University of Texas at Austin, 2004. / Supervisor: Paul S. Ho. Vita. Includes bibliographical references.
119

Eliminating package resonances in printed circuit boards over wide frequency band

Bapu, Vijay Madhukar. January 2004 (has links)
Thesis (M.S.)--State University of New York at Binghamton, Department of Electrical and Computer Engineering, 2004. / Includes bibliographical references.
120

Use of thermoplastic starch in poly(lactic acid)/poly(butylene adipate-co-terephthalate) based nanocomposites for bio-based food packaging

Manepalli, Pavan Harshit January 1900 (has links)
Doctor of Philosophy / Department of Grain Science and Industry / Sajid Alavi / Poly(lactic acid) (PLA) is the most common bio-based & compostable polymer available commercially that is cost competitive and combines a range of desirable properties like melt processability, high strength and modulus. The films made from this aliphatic polyester tend to be brittle which can be overcome by blending PLA with another bio-based polymer with high flexibility poly(butylene adipate-co-terephthalate) (PBAT), but the resultant blend is only biodegradable in composting conditions. The primary focus of this study was incorporation of thermoplastic starch (TPS) in PLA/PBAT blends to increase the rate of biodegradability and decrease the cost. In the first part of this study, as a preliminary step only PLA/PBAT blends were investigated along with nanofiller nanocrystalline cellulose (NCC) as a nanofiller for enhancing mechanical and barrier properties. Melt extrusion was used for preparation of nanocomposites and 200 microns thick films were formed by melt pressing. PBAT enhanced elongation but NCC did not have any positive impact on the mechanical and barrier properties of the nanocomposites as NCC was aggregated in the polymer matrix due to the difference in polarity based on the hydrophilic nature of the nanofiller and hydrophobic nature of the polymer matrix. In the second part of study, up to 40%TPS was blended along with the PLA/PBAT/NCC nanocomposites. Joncryl (0.5%) was used as a compatibilizer. TPS addition decreased the mechanical and barrier properties (Tensile strength (TS) = 15- 30 MPa, Elongation at break (EB) = 6-12%, Water vapor permeability (WVP) = 1.6-8.3 g.mm/kPa.h.m2), although addition of NCC helped in increasing the TS and decreasing the WVP. Dispersion of NCC improved with the addition of hydrophilic TPS. Analytical techniques including transmission electron microscopy, fourier-transform infrared spectroscopy, differential scanning calorimetry were used to study the polymer-polymer and polymer-nanofiller interactions. Optimization study of PLA/PBAT/TPS/NCC nanocomposites was done using mixture response surface methods. Quadratic models with good predicted R2 (between 84.3% and 97.59%) were developed for all the responses. Optimization study was done that could yield films with optimum properties comparable to commercial plastics and maximizing the level of TPS. Films with optimum properties (TS = 29.5 MPa, EB = 12%, WVP = 1.99 g.mm/kPa.h.m2) were predicted at levels of 64.3% PLA, 14.5% PBAT, 18% TPS and 2.6% NCC along with 0.5% Joncryl. The improved mechanical and barrier performance suggested that PLA/PBAT/TPS/NCC nanocomposites have potential use in food packaging applications. In the final phase of study, mathematical modeling was used to understand the influence of nanofiller (NCC) on the mechanical and barrier properties of the nanocomposites. The modified Halpin-Tsai equation was used to model the elastic modulus of the nanocomposites, while the modified Nielsen equation was used to model the WVP as a function of nanofiller content, geometry, strength and interactions with polymer matrix. The experimental results in both cases were close to the theoretical predictions by the models. The models predicted an increase in mechanical and barrier properties with increase in aspect ratio and surface interactions of nanofiller with polymer matrix.

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