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The Global ETD Search service is a free service for researchers
to find electronic theses and dissertations. This service is
provided by the
Networked Digital Library of Theses and Dissertations.
Our metadata is collected from universities around the world. If you manage a university/consortium/country archive and want to be added, details can be found on the NDLTD website.
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Showing 141 to 150 of 1894 (0.018 seconds)| 141 |
Development of a polymer-metal nanocomposite dielectric by in situ reduction for embedded capacitor applicationPothukuchi, Suresh V. 01 December 2003 (has links)
No description available.
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| 142 |
Materials, design and processing of air encapsulated MEMS packagingFritz, Nathan Tyler 16 December 2011 (has links)
Air-gap structures are of particular interest for packaging of microelectromechanical systems (MEMS). In this work, an overcoat material is used to cover a sacrificial polymer, which protects the MEMS device during packaging. Once the overcoat is in place, the sacrificial polymer is thermally decomposed freeing the MEMS structure while the overcoat dielectric provides mechanical protection from the environment. An epoxy POSS dielectric was used as a high-selectivity etch mask for the PPC and a rigid overcoat for the structure leading to the process improvements.
The packaging structures can be designed for a range of MEMS device sizes and operating environments. However, the air-cavity structures need additional rigidity to withstand chip-level packaging conditions. Metalized air cavity packages were molded under traditional lead frame molding pressures and tested for mechanical integrity. The experimental molding tests and mechanical models were used to establish processing conditions and physical designs for the cavities as a function of cavity size. A semi-hermetic package was created using an in-situ sacrificial decomposition/epoxy cure molding step for creating large cavity chip packages.
Through the optimization of the air cavity, new materials and processes were tested for general microfabrication. The epoxy POSS dielectric provides a resilient, strong inorganic/organic hybrid dielectric for use in microfabrication and packaging applications. Polycarbonates can be used for low cost temporary adhesives in wafer-wafer bonding. An improved electroless deposition process for silver and copper was developed. The Sn/Pd activation was replaced by a cost efficient Sn/Ag catalyst. The process was shown to be able to deposit adherent copper on smooth POSS and silicon dioxide surfaces. Electroless copper was demonstrated on untreated silicon oxide wafers for TSV sidewall deposition.
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| 143 |
Principal component regression models for thermo-mechanical reliability of plastic ball grid arrays on CU-core and no CU-core PCB assemblies in harsh environmentsShirgaokar, Aniket, Lall, Pradeep. January 2009 (has links)
Thesis--Auburn University, 2009. / Abstract. Vita. Includes bibliographic references (p.80-97).
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| 144 |
Modeling of package and board power distribution networks using transmission matrix and macro-modeling methodsKim, Joong-Ho 12 1900 (has links)
No description available.
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| 145 |
Thermo-mechanical reliability of the VSPA package solder jointsMurphy, R. Sean 12 1900 (has links)
No description available.
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| 146 |
Enhance thermomechanical reliability of microsystems packaging through new base substrate and dielectric materialsHegde, Shashikant 05 1900 (has links)
No description available.
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| 147 |
Flip chip on flex for low cost electronics assemblyVenton, Jennifer Lynne 12 1900 (has links)
No description available.
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| 148 |
High throughput flip chip assembly process and reliability analysis using no-flow underfill materialsThorpe, Ryan 05 1900 (has links)
No description available.
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| 149 |
Design and integration of a large area warpage measurement systemPetriccione, Gregory James 05 1900 (has links)
No description available.
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| 150 |
In-process stress analysis of flip chip assemblies during underfill cure and environmental stress testingPalaniappan, Prema 08 1900 (has links)
No description available.
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