NDLTD Global ETD Search
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  • About
  • The Global ETD Search service is a free service for researchers to find electronic theses and dissertations. This service is provided by the Networked Digital Library of Theses and Dissertations.
    Our metadata is collected from universities around the world. If you manage a university/consortium/country archive and want to be added, details can be found on the NDLTD website.

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Showing 181 to 190 of 1892 (0.012 seconds)
181

Measuring Consumer Resistance to Innovation in Meat Packaging-Evidence from Choice Experiments

Chen, Qing Unknown Date
No description available.
Consumer behaviour
Meat packaging
Innovation
182

The influence of the packaging material on the mechanical properties of carrot tissue during storage.

Mohammed, Hakim January 1976 (has links)
No description available.
Vegetables -- Packaging
Vegetables -- Storage
Carrots
183

Study on adhesion of underfill materials for flip chip packaging

Luo, Shijian 05 1900 (has links)
No description available.
Integrated circuits Reliability
Electronic packaging
184

Mechanical and dielectric characterization of electronic grade polymers at subambient temperatures

Sinno, Bilal 05 1900 (has links)
No description available.
Microelectronics Materials
Polymers
Microelectronic packaging
185

Toward a comprehensive cost model for multichip module (MCM) manufacturing

Pierce, Daniel W. 12 1900 (has links)
No description available.
Multichip modules (Microelectronics)
Electronic packaging
186

Grammar- and optimization-based mechanical packaging

Lomangino, F. Paul 05 1900 (has links)
No description available.
Engineering Statistical methods
Packaging
Dyanmics
187

Packaging-compatible micromachined magnetic devices : integrated passive components and modules

Park, Jae Yeong 12 1900 (has links)
No description available.
Micromechanics
Magnetic devices
Electronic packaging
188

Process modeling and interfacial delamination in peripheral array packages

Harries, Richard 08 1900 (has links)
No description available.
Electronic packaging
Composite materials Delamination
189

Heat pipes for electronic cooling

Woods, Thomas F. 12 1900 (has links)
No description available.
Heat pipes
Elecrtonic packaging Cooling
190

Thermochemical modeling of composite materials for base substrate applications in microelectronic systems

Bassett, Julien 05 1900 (has links)
No description available.
Microelectronics
Electronic packaging
Fibrous composites

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