We have demonstrated a flexible optical waveguide film with integrated VCSEL and PIN photodiode arrays for the fully embedded board level optical interconnection system. One of the most critical issues in the fully embedded board level optical interconnection system is the signal beam coupling between the guided-wave structure and the aperture of VCSEL (or PIN photodiode). The coupling efficiencies of spherical mirrors are calculated as a function of mirror radius. The optimum mirror radius ranges which are compatible with the fully embedded board level optical interconnection system are theoretically verified. The thermal characteristics of a thin film VCSEL are studied both theoretically and experimentally. The thermal resistances of VCSEL with variable thickness, ranging from 10 [mu]m to 200 [mu]m, have been determined by measuring the output wavelength shift as a function of the dissipated power. The thermal simulation results agree reasonably well with experimentally measured data. From the thermal management point of view, a thinned VCSEL has an exclusive advantage due to the reduction of the thermal resistance. The thermal resistance of 10 [mu]m thick VCSEL is 40 % lower than that of 200 [mu]m thick VCSEL. The theoretical analysis of thermal via effects is performed to determine optimized thickness ranges of thin film VCSEL for the fully embedded structure. Thermal resistance of the fully embedded thin film VCSEL with closed and open thermal via structures are also evaluated with the suitable VCSEL thickness reported. The high-performance computing system is demonstrated using a 16-channel optical backplane using thin film volume holographic gratings. The optical backplane contains TO-46-Can-packaged VCSELs and photodiodes as an optical transmitter and receiver, respectively. Optical packaging plates are fabricated for 4 X 8 array packaging for 16-VCSELs and 16-Photodiodes. Packaging issues including crosstalk and alignment tolerance are studied to design a low cost optical packaging scheme. Thin film volume hologram grating is fabricated on glass substrate to redirect light beams. An individual single channel performs at a 100 MHz data transfer rate. The high-performance computing system using 16-channel optical backplane is demonstrated at a 1.6 Gbps data transmission. / text

This thesis presents the modeling and fabrication of a new solid-state device meant to be used for digital logic circuits. Most current logic circuits are based on MOSFETs. The new logic device uses some of the same operating principles, but also relies on optical illumination to provide input power. In order to obtain the desired current-voltage behavior of the new device, the Silvaco (Atlas) device simulation was used to give some insight into the correct doping levels in the semiconductor and device geometries. Prototypes were fabricated on p-type silicon wafers using CMOS fabrication processes including oxide growth, photolithography, precise plasma or chemical wet etching, diffusion processes, and thin film evaporation. Electrical measurements were done by using an HP4156 parameter analyzer to measure several output voltage signals at one time while an illuminating the device with laser light. The current-voltage characteristics under different biasing conditions with an optical illumination condition were measured and showed characteristics similar to an nMOS transistor.

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