Content of this work is oriented on mechanical testing of PWB. Deals with standards related to mechanical testing and quality evaluation of PWB. This works is engaged into industry standards, for example IPC or JEDEC. Studies principle and methods of chosen vibration tests. Further aim of this work is vibration fundamentals of PWB assembly. This work describes some research studies, which were conducted in past years and dealt with vibration stress issues. Shows individual factors, which has effect on vibration response of DPS and its destruction, like component position, acceleration difference between component and substrate, around temperature or material constants. In practical part was chosen method of vibration test and experiment in Labview programming interface was performed to verify these findings from vibration theory.

The objective of this research is to determine and develop a model that is capable of accurately measuring customer satisfaction for different industries and in particularly for the Printed Wiring Boards (PWB) Manufacturers. The new model will incorporate data not being collected or utilized by the survey method of determining customer satisfaction. The method used is a weighted average of satisfaction among several researched categories with percentages that accurately represent the relative importance of multiple facets of the PWB manufacturers customer satisfaction. A very common term in quality assurance is that "What is not measured accurately can not be evaluated or managed correctly," thus customer satisfaction is a very important aspect of any business, industry, or government. A satisfied customer will do more business and recommend it to other potential customers. Thus the business will grow and more revenues result. On the other hand, an unsatisfied customer will abandon the business and encourage more customers not to get involved with the same business so the business may decline and lose its market share and profitability. The categories that contribute to PWB customer satisfaction will be determined by conducting surveys among the leaders and best in the business of the PWB industry in addition to discovery of related articles that define the categories of the customer satisfaction for the PWB manufacturers. Once the categories are determined, the research concentrates on the weighting of the categories that most contribute to the PWB customer's satisfaction and a measure of satisfaction is derived. The model is easily applied to any other kind of PWB business or service industry. The model is based on empirical methods that will give an accurate measurement for the PWB customer's satisfaction. This in turn allows organizations the opportunity for improving customer satisfaction and increasing market share. The algorithm is based on characteristics deemed important by customers. Thus the customer satisfaction index can be computed and monitored on a regular basis without costly surveys. The major difference between this new model and the standard methods of determining customer satisfaction using the surveys is that this model will utilize data available with the proposals, sales, shipping, receiving, quality, engineering, manufacturing, and purchasing departments. The developed method to measure customer satisfaction utilizing internal data can be more cost effective, more accurate, can provide individual customer satisfaction scores, can measure whether or not these individual scores are statistically lower than the majority, and can provide satisfaction measures in real time none of which can be supplied by the survey method.

<p>The aim of the research work presented here, is to contribute to the adaptation of electronic packaging towards the needs of high frequency applications. As the field of electronic packaging stretches over several very different professional areas, it takes an interdisciplinary approach to optimize the technology of electronic packaging. Besides this, an extensive knowledge of industrial engineering should be an essential part of this undertaking to improve electronic packaging. Customary advances in technology are driven by new findings and a continuous development of processes in clearly defined fields. However, in the field of the higher levels of the interconnection hierarchy, that is external to the chip level interconnections and chip packaging, it is supposed that a wide combination of disciplines and technical creativity, instead of advanced technology in a special area should produce most added value.</p><p>The thesis is divided into five areas, interlinked by the overall aim of there advantages to the common goal. These areas are the Printed Wiring Board (PWB) technology, PWB connections using flexible printed circuit boards, multiconductor cable connections, shielded enclosures and the related EMC issues, and finally the cooling of electronics. A central issue was to improve the shielded enclosures to be effective also at very high frequencies; it will be shown that shielded enclosures without apertures can cope with frequencies up to and above 15 GHz. Due to this enclosure without apertures, it was necessary to develop a novel cooling structure. This cooling structure consists of a heat sink where the PCB’s are inserted in close contact to the cooling fins on one side, whereas the other side of the heat sink is cooled by forced ventilation. The heat transfer between these parts is completely inside the same body. Tests carried out on a prototype have shown that the performance of the cooling structure is satisfactory for electronic cooling.</p><p>Another problem area that is addressed are the interconnect problems in high frequency applications. Interconnections between parts of a local electronic system, or as within the telecom and datacom field between subscribers, are commonly accomplished by cable connections. In this research work multiconductor cables are examined and a patented novel cable-connector for high frequency use is presented. Further, an experimental complex soldering method between flexible printed circuits boards and rigid printed circuits boards, as part of connections between PCBs, is shown. Finally, different sectors of the PCB technology for high frequency applications are scrutinized and measurements on microstrip structures are presented.</p>

The aim of the research work presented here, is to contribute to the adaptation of electronic packaging towards the needs of high frequency applications. As the field of electronic packaging stretches over several very different professional areas, it takes an interdisciplinary approach to optimize the technology of electronic packaging. Besides this, an extensive knowledge of industrial engineering should be an essential part of this undertaking to improve electronic packaging. Customary advances in technology are driven by new findings and a continuous development of processes in clearly defined fields. However, in the field of the higher levels of the interconnection hierarchy, that is external to the chip level interconnections and chip packaging, it is supposed that a wide combination of disciplines and technical creativity, instead of advanced technology in a special area should produce most added value. The thesis is divided into five areas, interlinked by the overall aim of there advantages to the common goal. These areas are the Printed Wiring Board (PWB) technology, PWB connections using flexible printed circuit boards, multiconductor cable connections, shielded enclosures and the related EMC issues, and finally the cooling of electronics. A central issue was to improve the shielded enclosures to be effective also at very high frequencies; it will be shown that shielded enclosures without apertures can cope with frequencies up to and above 15 GHz. Due to this enclosure without apertures, it was necessary to develop a novel cooling structure. This cooling structure consists of a heat sink where the PCB’s are inserted in close contact to the cooling fins on one side, whereas the other side of the heat sink is cooled by forced ventilation. The heat transfer between these parts is completely inside the same body. Tests carried out on a prototype have shown that the performance of the cooling structure is satisfactory for electronic cooling. Another problem area that is addressed are the interconnect problems in high frequency applications. Interconnections between parts of a local electronic system, or as within the telecom and datacom field between subscribers, are commonly accomplished by cable connections. In this research work multiconductor cables are examined and a patented novel cable-connector for high frequency use is presented. Further, an experimental complex soldering method between flexible printed circuits boards and rigid printed circuits boards, as part of connections between PCBs, is shown. Finally, different sectors of the PCB technology for high frequency applications are scrutinized and measurements on microstrip structures are presented. / QC 20101006

Trend towards downsizing the product size and at the same time to bring more functionality in electronic products, demands electrically interconnecting several miniaturized electronic components with high counts of I\Os (Input/Out put) on smaller and smaller size printed wiring boards [PWB]. These miniature components occupy lower foot print area but require higher routing interconnection densities. However, the conventional multilayer board technologies exhibit limitations when there is need to connect very high I\O components such as ball grid arrays, which require blind and buried interconnections within the multilayer mono-block. This limitation has given raise to newer methods of multi layer construction. Build–up multilayer PWB is now the technology of choice for enhanced routing capability including blind and buried interlayer connections. Build up methods are based on making very small vias within dielectric layers followed by metalisation. Typically blind and buried vias are very small, and hence called “micro vias” connecting the layers selectively within the multilayer mono-block. Buried vias make the interconnection between the consecutive layers, and blind vias connect the surface layers to any one of the interior layers in the build up multilayer board. If the blind vias are filled with a dielectric, the entire top and bottom surface area becomes available for high -density component mounting. The crux in build up board technologies is the method of creating micro-holes; a micro hole is a hole, which is less than 150 micro meter in diameter. Efforts are made to replace existing metalising techniques with “paste filling” methodologies, which would result in “SOLID CONDUCTING VIAS” CALLED AS “MICRO -INTERCONNECTS” The work reported in this thesis aims at demonstrating one such innovative ‘solid conducting via’ formation without using any of the known micro-hole formation techniques. Based on the results obtained some useful conclusions have been drawn which will perhaps go a long way in the name of “PRINTED PILLAR TECHNOLOGY” a novel methodology for building multilayer suitable for very high I\O components such as “ball grid arrays.”

International Telemetering Conference Proceedings / October 28-31, 1996 / Town and Country Hotel and Convention Center, San Diego, California / Eutectic (63% tin-37% lead) or near-eutectic (40% tin-60% lead) tin-lead solder is widely used for creating electrical interconnections between the printed wiring board (PWB) and the components mounted on the board surface. For components mounted directly on the PWB mounting pads, that is, surface mounted components, the tin-lead solder also constitutes the mechanical interconnection. Eutectic solder has a melting point of 183°C (361°F). It is important to realize that its homologous temperature, defined as the temperature in degrees Kelvin over its melting point temperature (T(m)), also in degrees Kelvin, is defined as T/T(m). At room temperature (25°C = 298K), eutectic solder's homologous temperature is 0.65. It is widely acknowledged that materials having a homologous temperature ≥ 0.5 are readily subject to creep, and the solder joints of printed wiring assemblies are routinely exposed to temperatures above room temperature. Hence, solder joints tend to be subject to both thermal fatigue and creep. This can lead to premature failures during service conditions. The geometry, that is, the lead configuration, of the joints can also affect failure. Various geometries are better suited to withstand failure than others. The purpose of this paper is to explore solder joint failures of dual in-line (DIP) integrated circuit components, leadless ceramic chip carriers (LCCCs), and gull wing and J-lead surface mount components mounted on PWBs.