- About
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The Global ETD Search service is a free service for researchers
to find electronic theses and dissertations. This service is
provided by the
Networked Digital Library of Theses and Dissertations.
Our metadata is collected from universities around the world. If you manage a university/consortium/country archive and want to be added, details can be found on the NDLTD website.
Search results
Showing 331 to 340 of 1900 (0.032 seconds)Spelling suggestions: "subject:"packaging"" "subject:"ackaging""
| 331 |
Thermal management of small scale electronic systemsDesai, Anand Hasmukh. January 2006 (has links)
Thesis (Ph. D.)--State University of New York at Binghamton, Department of Mechanical Engineering, 2006. / Includes bibliographical references (leaves 163-164).
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| 332 |
Comparative stability of aspirin in CSP Technologies Activ-VialTm and Owens- Illinois L-8 prescription vialsTata, Atresh, Kochak, Gregory Michael, January 2007 (has links) (PDF)
Thesis(M.S.)--Auburn University, 2007. / Abstract. Vita. Includes bibliographic references.
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| 333 |
Biodegradable packaging for corrosion inhibition via supercriticial fluidLeavitt, Leah A., January 2007 (has links)
Thesis (Ph. D.)--University of Missouri-Columbia, 2007. / The entire dissertation/thesis text is included in the research.pdf file; the official abstract appears in the short.pdf file (which also appears in the research.pdf); a non-technical general description, or public abstract, appears in the public.pdf file. Title from title screen of research.pdf file (viewed on December 28, 2007) Includes bibliographical references.
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| 334 |
Experimental characterization of the temperature dependence of the piezoresistive coefficients of siliconCho, Chun Hyung, Jaeger, Richard C. Suhling, J. C. January 2007 (has links) (PDF)
Dissertation (Ph.D.)--Auburn University, 2007. / Abstract. Vita. Includes bibliographic references (p.222-231).
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| 335 |
Effect of bonding pressure on reliability of anisotropic conductive adhesives [sic] joints in a silicon-to-flex-substrate interconnctionPuthenparambil, Abhilash. January 2006 (has links)
Thesis (M.S.E.E.)--State University of New York at Binghamton, Watson School of Engineering and Applied Science, 2006. / Includes bibliographical references.
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| 336 |
Development of a knowledge model for the computer-aided design for reliability of electronic packaging systemsKim, Injoong. January 2007 (has links)
Thesis (Ph. D.)--Mechanical Engineering, Georgia Institute of Technology, 2008. / Committee Co-Chair: Peak, Russell; Committee Co-Chair: Sitaraman, Suresh; Committee Member: Paredis, Christiaan; Committee Member: Pucha, Raghuram; Committee Member: Wong, C.
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| 337 |
Numerical prediction and experimental validation of flip chip solder joint geometry for MEMS applications /Lo, Chi Chuen. January 2008 (has links)
Thesis (Ph.D.)--Hong Kong University of Science and Technology, 2008. / Includes bibliographical references (leaves 149-158). Also available in electronic version.
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| 338 |
Carbon nanotube thermal interface material and its application in high brightness LED packages /Zhang, Kai. January 2008 (has links)
Thesis (Ph.D.)--Hong Kong University of Science and Technology, 2008. / Includes bibliographical references. Also available in electronic version.
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| 339 |
Oxygen permeation of virgin HDPE films versus recycled HDPE films /Al-Ati, Tareq. January 1994 (has links)
Thesis (M.S.)--Rochester Institute of Technology, 1994. / Typescript. Includes bibliographical references (leaves 147-153).
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| 340 |
Capacity requirements planning of multichip modules through simulationDasalla, Kathryn Anne. January 2007 (has links)
Thesis (M.S.)--State University of New York at Binghamton, Thomas J. Watson School of Engineering and Applied Science, Department of Systems Science and Industrial Engineering, 2007. / Includes bibliographical references.
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