NDLTD Global ETD Search
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  • About
  • The Global ETD Search service is a free service for researchers to find electronic theses and dissertations. This service is provided by the Networked Digital Library of Theses and Dissertations.
    Our metadata is collected from universities around the world. If you manage a university/consortium/country archive and want to be added, details can be found on the NDLTD website.

Search results

Showing 311 to 320 of 1900 (0.051 seconds)

Spelling suggestions: "subject:"packaging"" "subject:"ackaging""

311

Helix-type compliant off-chip interconnect for microelectronic packaging

Zhu, Qi 08 1900 (has links)
No description available.
Microelectronic packaging
312

A modular, direct chip attach, wafer level MEMS package : architecture and processing

Neysmith, Jordan M. 12 1900 (has links)
No description available.
Microelectronic packaging
313

Characterization of temperature variation during the wire bonding process

Suman, Shivesh K. 08 1900 (has links)
No description available.
314

Study of warpage of base substrates and materials for large-area MCM-D packaging

Dang, Anh Xuan-Hung 12 1900 (has links)
No description available.
Multichip modules (Microelectronics)
Microelectronic packaging Materials
315

Micromechanics-based interfacial stress analysis and fracture in electronic packaging assemblies with heterogeneous underfill

Park, Ji Eun 08 1900 (has links)
No description available.
Electronic packaging
Integrated circuits Fault tolerance
316

Physics-based modeling methodology for reliability of microvias

Ramakrishna, Gnyaneshwar 08 1900 (has links)
No description available.
Microelectronic packaging Materials
317

Analysis-enhanced electronic assembly

Scholand, Andrew Joseph 12 1900 (has links)
No description available.
Electronic packaging
Process control
Decision support systems
318

Local-and system-level thermal management of a single level integrated module (SLIM) using synthetic jet actuators

Russell, Griffith B. 08 1900 (has links)
No description available.
Heat Transmission
Electronic packaging Cooling
Air flow
319

Development and integration of thin film polymer ceramic nanocomposite capacitor dielectrics in SOP

Windlass, Hitesh 12 1900 (has links)
No description available.
Microelectronic packaging
Nanostructure materials
Nanotechnology
Composite materials
320

Establishment of an analytical and experimental test facility for the evaluation of thermal management in microelectric packages

Campbell, James Stephen, Jr. 05 1900 (has links)
No description available.
Microelectronic packaging Testing
Microelectronics
Thermal stresses

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