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The Global ETD Search service is a free service for researchers
to find electronic theses and dissertations. This service is
provided by the
Networked Digital Library of Theses and Dissertations.
Our metadata is collected from universities around the world. If you manage a university/consortium/country archive and want to be added, details can be found on the NDLTD website.
Search results
Showing 341 to 350 of 1901 (0.039 seconds)Spelling suggestions: "subject:"packaging"" "subject:"ackaging""
| 341 |
Characterization of die stresses in large area array flip chip packagesRoberts, Jordan Christopher, Jaeger, Richard C., Suhling, J. C. January 2008 (has links) (PDF)
Thesis (M.S.)--Auburn University, 2008. / Abstract. Vita. Includes bibliographical references (p. 134-144).
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| 342 |
Experimental and numerical study of solder ball joints' reliability at package level & board level /Xu, Zhengjian. January 2009 (has links)
Thesis (M.Phil.)--Hong Kong University of Science and Technology, 2009. / Includes bibliographical references (leaves 99-110).
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| 343 |
Design of electrically and thermally conductive polymer composites for electronic packaging /Kim, Woo-Jin, January 1998 (has links)
Thesis (Ph. D.)--University of Washington, 1998. / Vita. Includes bibliographical references (leaves [148]-161 ).
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| 344 |
Production of functional packaging materials by use of biopreservatives/Mecitoğlu Güçbilmez, Çiğdem. Yemenicioğlu, Ahmet January 2005 (has links) (PDF)
Thesis (Master)--İzmir Institute of Technology, İzmir, 2005. / Keywords: Biopreservatives, antimicrobial enzymes, antioxidant proteins, edible films, functional packaging materials. Includes bibliographical references (leaves.88-101).
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| 345 |
Producer Responsibility Scheme : management of post-consumer beverage containers in Hong Kong /Choi, Fuk-sing. January 2007 (has links)
Thesis (M. Sc.)--University of Hong Kong, 2007.
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| 346 |
Overmolded substrate on aluminum metal backing for harsh environment applicationsRidenour, Joshua David, Evans, John L., January 2008 (has links) (PDF)
Thesis (M.S.)--Auburn University, 2008. / Abstract. Vita. Includes bibliographical references (p. 107-109).
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| 347 |
Computational and experimental investigations of laser drilling and welding for microelectronic packagingHan, Wei. January 2004 (has links)
Thesis (Ph. D.)--Worcester Polytechnic Institute. / Keywords: Optoelectronic holography; Microwelding; Microelectronic packaging; Microdrilling; Laser micromachining; Computational modeling. Includes bibliographical references (p. 204-212).
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| 348 |
Adaptive run-to-run control of overlay in semiconductor manufacturingMartinez, Victor Manuel. January 2002 (has links) (PDF)
Thesis (Ph. D.)--University of Texas at Austin, 2002. / Vita. Includes bibliographical references. Available also from UMI Company.
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| 349 |
Finite element analysis of three-dimensional corner stress singularities and its application in microelectronics packaging /Xu, Anqing, January 2002 (has links)
Thesis (Ph. D.)--Lehigh University, 2002. / Includes bibliographica references and vita.
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| 350 |
Improvement of interfacial adhesion in plastic packages--dimples, metallic coatings and black oxide /Moosa Naina, Mohamed Lebbai. January 2002 (has links)
Thesis (Ph. D.)--Hong Kong University of Science and Technology, 2002. / Includes bibliographical references. Also available in electronic version. Access restricted to campus users.
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