NDLTD Global ETD Search
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  • About
  • The Global ETD Search service is a free service for researchers to find electronic theses and dissertations. This service is provided by the Networked Digital Library of Theses and Dissertations.
    Our metadata is collected from universities around the world. If you manage a university/consortium/country archive and want to be added, details can be found on the NDLTD website.

Search results

Showing 301 to 310 of 1900 (0.048 seconds)

Spelling suggestions: "subject:"packaging"" "subject:"ackaging""

301

Design and implementation of high-Q passive devices for wireless applications using System-On-Package (SOP) based organic technologies

Dalmia, Sidharth 12 1900 (has links)
No description available.
Microelectronic packaging Materials
Wireless communication systems
302

System implementation, modeling and defects pattern recognition for flip chip solder joint inspection using laser techniques

Liu, Sheng 05 1900 (has links)
No description available.
Electronic packaging
Solder and soldering
Lasers in engineering
303

Thermomechanical stress analysis of flip chip packages

Le Gall, Carole A. 08 1900 (has links)
No description available.
Microelectronic packaging
Strains and stresses
Variational principles
304

High throughput flip chip assembly process application and assessment using no-flow underfill materials

Milner, David William 05 1900 (has links)
No description available.
Integrated circuits
305

A product data-driven methodology for automating variable topology multi-body finite element analysis

Koo, Donald 05 1900 (has links)
No description available.
Computer aided design
Engineering
Numerical analysis
Packaging
306

Fundamentals of solder interconnect wetting

Kang, Suk Chae 05 1900 (has links)
No description available.
Solder and soldering
Wettings
307

The effect of moisture on the interfacial fracture toughness of packaging interfaces

Ferguson, Timothy Patrick 12 1900 (has links)
No description available.
Microelectronic packaging Reliability
Fracture mechanics
Moisture
308

High yield flip chip processing and failure mode analysis for surface mount applications

Tsai, Wen-Kai Mike 08 1900 (has links)
No description available.
Surface mount technology
Microelectronics Testing
Packaging
309

An automated system for measuring PWB/PWBA warpage during simulation of the infrared reflow and wave soldering processes, and during operational thermal cycling

Stiteler, Michael Ross 05 1900 (has links)
No description available.
Printed circuits
Electronic circuits
Electronic packaging
310

Observation and modeling of heterogeneous microstructural evolution in Sn-Pb solder

Woodmansee, Michael W. 08 1900 (has links)
No description available.
Solder and soldering

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