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To allow electronic devices to operate within allowable temperatures, heat sinks and fans are employed to cool down computer chips. However, cooling performance is limited by air gaps between the computer chip and the heat sink, due to the fact that air is a poor heat conductor. To alleviate this problem, thermal interface material (TIM) is often applied between mating substrates to fill air gaps. Carbon nanotube (CNT) based TIM has been reported to have excellent thermal impedance; however, because it is non biodegradable, its potential impact on the environment is a concern. In this thesis research, two types of TIMs were designed, synthesized, and characterized. The first type, Designed TIM 1, consisted of anodic aluminum oxide (AAO) templates with nanochannels (pore size=80nm) embedded with copper nanowires by electrodeposition. This type of nanostructure was expected to have low thermal impedance because the forest-like structure of copper nanowires can bridge two mating surfaces and efficiently transport heat one dimensionally from one substrate to the other. The second type, Designed TIM 2, was fabricated by sandwiching Designed TIM 1 with commercially available thermal grease to further reduce thermal impedance. It was expected that the copper nanowire structures would secure the thermal grease in place, thus preventing grease pump-out under contact pressure, which is a common problem associated with the usage of thermal grease. The morphologies of the two designed TIMs were studied using scanning electron microscopy (SEM), and their thermal properties were determined using ASTM D5470-06, the standard method for testing thermal transmission properties of thermally conductive materials. Experiments were conducted to evaluate the proposed TIMs, as well as commercially available TIMs, under different temperature and pressure settings. Experimental results suggest that the thermal impedance of TIMs can be reduced by increasing contact pressure or reducing thickness. Designed TIM 2 yielded 0.255℃-cm2/W, which is lower than thermal grease and other available TIMs at the operating temperature of 50 to 60℃. Considering the application limitations and safety issues of thermal grease, phase change material, and CNT-based TIMs, our designed TIMs are safe and promising for future applications.

Optical communication dominates the wire-communication since the requirement of the high speed data transfer in the Internet. Fiber Solder Ferrule (FSF) plays an important role in transceiver modules of the optical communication. For the reason to keep the coupling efficiency between the laser diode and fiber after time using and a various temperature operation, fiber has to be carefully fixed in the metal ferrule. The fixing of the fiber now is finished to let the melting solder flow into a 400£gm diameter ferrule by the capillary action manually. The stability and accuracy of this method can not match the required performance. And the human operation makes this process more unstable to cut down the yield below 30% even by an experienced operator. So, this study analyzes the FSF process and proposes an active strategy to replace the original passive method by capillary action. An active soldering mechanism is implemented to precisely and stable filling the solder into the ferrule. The yield can be significantly raised from 25% to 75%.

ABSTRACT Following the soaring of worldwide semiconductor industry, the semiconductor industry in Taiwan has been developed a unique industrial characters and carried an evolution. As result, the traditional competitive strategy is no longer sufficient enough to meet the demanding of nowadays semiconductor industry. Same as the evolution of worldwide semiconductor, the development of Taiwan semiconductor industry is fluctuated by Silicon Cycle. The demand is booming in the peak season, which attracts lots of new entrants penetrate the market due to high profit attraction, on the contrary, the demand is declining in business recession with impact of over supply, the existing competitors will aim at the productivity efficiency, cost reduction program as well as enhance of the core competence in order to create the differentiation for the new application product and market mix, hence, the newly emerging market is certainly attracted more rival dealer penetration accordingly. The packaging industry in Taiwan semiconductor¡¦s sorts of specific fields is the most competitive one. The thesis research expects to find out how the new entrants in semiconductor packaging industry take the core competence in the severely competitive market. The study includes: (1) Key Success Factor (KSF) (2) Successful competitive strategies (3) Competitive strategies versus the relation of product and market mix (4) The fine tuning of competitive strategy in company growth. The development of competitive strategy includes (1) The analysis of external environment (2) The analysis of internal factors (3) Strategic alliance (4) The CEO¡¦s leadership and management ability (5) Product road map development (6) Market development. The feedback of performance in the execution of the positioned competitive strategies is continuous in favor to the further adjustment of the strategies. The research finally obtains the findings as the expectation of the thesis research through the methods of the analysis of the characters of semiconductor packaging industry, the developing of competitive strategy and case studies and come out suggestions for future entrant¡¦s reference. Keywords: Semiconductor, Packaging, New Entrant, Competitive Strategy

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Thesis (Ph. D.)--University of Texas at Austin, 2001. / Vita. Includes bibliographical references (leaves 164-176). Available also in a digital version from Dissertation Abstracts.

Thesis (Ph. D.)--School of Mechanical Engineering, Georgia Institute of Technology, 2004. Directed by Said I. Abdel-Khalik. / Includes bibliographical references (leaves 292-296).

Thesis (M.S.)--Mechanical Engineering, Georgia Institute of Technology, 2004. / Daniel Baldwin, Committee Chair; Suresh Sitaraman, Committee Member; Steven Danyluk, Committee Member. Includes bibliographical references (leaves 238-241).

Thesis (Ph. D.)--School of Textile and Fiber Engineering, Georgia Institute of Technology, 2004. Directed by C.P. Wong. / Vita. Includes bibliographical references (leaves 197-210).

Thesis (Ph. D.)--School of Materials Science and Engineering, Georgia Institute of Technology, 2004. Directed by C.P. Wong. / Includes bibliographical references (leaves 275-289).