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The Global ETD Search service is a free service for researchers
to find electronic theses and dissertations. This service is
provided by the
Networked Digital Library of Theses and Dissertations.
Our metadata is collected from universities around the world. If you manage a university/consortium/country archive and want to be added, details can be found on the NDLTD website.
Search results
Showing 631 to 640 of 1904 (0.028 seconds)Spelling suggestions: "subject:"packaging"" "subject:"ackaging""
| 631 |
Design-for-manufacturability (DFM) for system-in-package (SiP) applicationsDoppalapudi, Ranjeeth. January 2008 (has links)
Thesis (M. S.)--Electrical and Computer Engineering, Georgia Institute of Technology, 2009. / Committee Chair: Dr. Swaminathan, Madhavan; Committee Member: Dr. Chatterjee, Abhijit; Committee Member: Dr. Lim, Sungkyu. Part of the SMARTech Electronic Thesis and Dissertation Collection.
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| 632 |
Viscoelastic stress analysis and fatigue life prediction of a flip-chip-on-board electronic package /Koeneman, Paul Bryant, January 1999 (has links)
Thesis (Ph. D.)--University of Texas at Austin, 1999. / Vita. Includes bibliographical references (leaves 110-112). Available also in a digital version from Dissertation Abstracts.
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| 633 |
Process for the development of a repulpable barrier laminate /Bigler, Brian C. January 1993 (has links)
Thesis (M.S.)--Rochester Institute of Technology, 1993. / Typescript. Bibliography: leaves 72-75.
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| 634 |
Design and optimization of VCSEL-based optical interconnects on packageTerranova, Brandon. January 2009 (has links)
Thesis (M.S.)--State University of New York at Binghamton, Department of Physics, Applied Physics and Astronomy, 2009. / Includes bibliographical references.
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| 635 |
Thermo-mechanical reliability models for life prediction of ball grid arrays on Cu-core PCBs in extreme environmentsDrake, Jonathan Luke, Lall, Pradeep. January 2007 (has links)
Thesis--Auburn University, 2007. / Abstract. Vita. Includes bibliographic references (p.181-188).
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| 636 |
Low temperature metal-based micro fabrication and packaging technology /Ma, Wei. January 2005 (has links)
Thesis (Ph.D.)--Hong Kong University of Science and Technology, 2005. / Includes bibliographical references. Also available in electronic version.
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| 637 |
Shock and vibration design considerations for packaging and handling equipment engineersKing, David Ahrens, January 1967 (has links)
Thesis (M.S.)--University of Wisconsin--Madison, 1967. / eContent provider-neutral record in process. Description based on print version record. Includes bibliographical references.
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| 638 |
Computational stress analysis for ball grid array reliability and passive component reliability in board level assemblies /Lau, Chung Yin. January 2005 (has links)
Thesis (M.Phil.)--Hong Kong University of Science and Technology, 2005. / Includes bibliographical references (leaves 85-90). Also available in electronic version.
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| 639 |
Solderability & microstructure of lead-free solder in leadframe packagingWoo, Belemy Hok Chung. January 2005 (has links) (PDF)
Thesis (M.Sc.)--City University of Hong Kong, 2005. / At head of title: City University of Hong Kong, Department of Physics and Materials Science, Master of Science in materials engineering & nanotechnology dissertation. Title from title screen (viewed on Sept. 4, 2006) Includes bibliographical references.
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| 640 |
Scheduling batch processing machines in a flow shopManjeshwar, Praveen Kumar. January 2005 (has links)
Thesis (Ph. D.)--State University of New York at Binghamton, Department of Systems Science and Industrial Engineering, 2005. / Includes bibliographical references.
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