- About
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The Global ETD Search service is a free service for researchers
to find electronic theses and dissertations. This service is
provided by the
Networked Digital Library of Theses and Dissertations.
Our metadata is collected from universities around the world. If you manage a university/consortium/country archive and want to be added, details can be found on the NDLTD website.
Search results
Showing 601 to 610 of 1901 (0.094 seconds)Spelling suggestions: "subject:"packaging"" "subject:"ackaging""
| 601 |
Development of LDPE-based antimicrobial films for food packagingMistry, Yogesh. January 2006 (has links)
Thesis (M. Sc.)--Victoria University (Melbourne, Vic.), 2006. / Includes bibliographical references.
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| 602 |
CMOS stress sensor circuitsChen, Yonggang, Suhling, J. C. Jaeger, Richard C. January 2006 (has links) (PDF)
Dissertation (Ph.D.)--Auburn University, 2006. / Abstract. Vita. Includes bibliographic references.
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| 603 |
Characterization of lead-free solders for electronic packagingMa, Hongtao, Johnson, R. Wayne, Suhling, J. C. January 2007 (has links) (PDF)
Dissertation (Ph.D.)--Auburn University, 2007. / Abstract. Vita. Includes bibliographic references.
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| 604 |
Mechanical properties and microstructure invesitigation of SN-AG-CU lead free solder for electronic package applicationsWang, Qing, Johnson, R. Wayne, Gale, W. F. January 2005 (has links) (PDF)
Dissertation (Ph.D.)--Auburn University, 2005. / Abstract. Vita. Includes bibliographic references.
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| 605 |
Spermine-nucleic acid interactions : roles of hydrophobicity, polynucleotide sequence-dependence and nature of polynucleotide /Patel, Mayank Mukesh. January 2006 (has links)
Thesis (Ph.D. in Pharmaceutical Sciences) -- University of Colorado at Denver and Health Sciences Center, 2006. / Typescript. Includes bibliographical references (leaves 130-149, 177-182). Free to UCDHSC affiliates. Online version available via ProQuest Digital Dissertations;
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| 606 |
Processing of photosensitive PDMS for biosensingMurali, Vinodh. January 2007 (has links)
Thesis (M.S.)--University of Missouri-Columbia, 2007. / The entire dissertation/thesis text is included in the research.pdf file; the official abstract appears in the short.pdf file (which also appears in the research.pdf); a non-technical general description, or public abstract, appears in the public.pdf file. Title from title screen of research.pdf file (viewed on April 14, 2008) Includes bibliographical references.
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| 607 |
Packaging of silicon carbide high temperature, high power devices processes and materials /Liu, Yi, Johnson, R. Wayne, January 2006 (has links) (PDF)
Dissertation (Ph.D.)--Auburn University, 2006. / Abstract. Vita. Includes bibliographic references (p.111-116).
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| 608 |
High temperature high power SiC devices packaging processes and materials developmentWang, Cai, Johnson, R. Wayne, January 2006 (has links) (PDF)
Dissertation (Ph.D.)--Auburn University, 2006. / Abstract. Vita. Includes bibliographic references (p.138-143).
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| 609 |
Design and simulation of a multichip module /Nazareth, Mathew B. January 1994 (has links)
Thesis (M.S.)--Rochester Institute of Technology, 1994. / Typescript. Includes bibliographical references (leaves 103-104).
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| 610 |
Development of convective reflow-projection moire warpage measurement system and prediction of solder bump reliability on board assemblies affected by warpageTan, Wei. January 2008 (has links)
Thesis (Ph. D.)--Mechanical Engineering, Georgia Institute of Technology, 2008. / Committee Chair: Dr. Ume, I. Charles; Committee Member: Dr. Book, Wayne; Committee Member: Dr. Kim, Yeong; Committee Member: Dr. Pan, Jiahui; Committee Member: Dr. Sitaraman, Suresh; Committee Member: Dr. Wu, C. F. Jeff.
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