- About
-
The Global ETD Search service is a free service for researchers
to find electronic theses and dissertations. This service is
provided by the
Networked Digital Library of Theses and Dissertations.
Our metadata is collected from universities around the world. If you manage a university/consortium/country archive and want to be added, details can be found on the NDLTD website.
Search results
Showing 611 to 620 of 1901 (0.049 seconds)Spelling suggestions: "subject:"packaging"" "subject:"ackaging""
| 611 |
Copper to copper bonding by nano interfaces for fine pitch interconnections and thermal applicationsJha, Gopal Chandra. January 2008 (has links)
Thesis (M. S.)--Materials Science and Engineering, Georgia Institute of Technology, 2008. / Committee Chair: Rao R. Tummala; Committee Member: C. P. Wong; Committee Member: P. M. Raj.
|
| 612 |
Ultra thin ultrafine-pitch chip-package interconnections for embedded chip last approachMehrotra, Gaurav. January 2008 (has links)
Thesis (M. S.)--Materials Science and Engineering, Georgia Institute of Technology, 2008. / Committee Chair: Prof. Rao R Tummala; Committee Member: Dr. Jack Moon; Committee Member: Dr. P M Raj.
|
| 613 |
A method of characterisation of the nonlinear vibration transmissibility of cushioning materialsParker, Anthony James. January 2007 (has links)
Thesis (Ph. D.)--Victoria University (Melbourne, Vic.), 2007. / Includes bibliographical references.
|
| 614 |
Correlation of analyses of odor profiles of HDPE films coated with different adhesives using electronic nose, sensory evaluation, and GC-MSXiong, Li. January 2006 (has links)
Thesis (Ph. D.)--Michigan State University. Dept. of Packaging, 2006. / Title from PDF t.p. (viewed on Nov. 20, 2008) Includes bibliographical references (p. 275-287). Also issued in print.
|
| 615 |
Prognostics health management and damage relationships of lead-free components in thermal cycling harsh environmentsMadhura Hande, Handattu, Lall, Pradeep, January 2008 (has links)
Thesis--Auburn University, 2008. / Abstract. Vita. Includes bibliographical references (leaves 159-167).
|
| 616 |
Non-linear thermal modeling using neural networks /Das, Aditi. January 1900 (has links)
Thesis (M.App.Sc.) - Carleton University, 2006. / Includes bibliographical references (p. 167-170). Also available in electronic format on the Internet.
|
| 617 |
Finite element analysis of multilayer transmission lines and circuit components /Mao, Kaiyu, January 2007 (has links)
Thesis (Ph.D.)--University of Illinois at Urbana-Champaign, 2007. / Source: Dissertation Abstracts International, Volume: 69-02, Section: B, page: 1214. Adviser: Jian-Ming Jun. Includes bibliographical references (leaves 122-128) Available on microfilm from Pro Quest Information and Learning.
|
| 618 |
Evaluation and improvement of the robustness of a PCB pad in a lead-free environmentLi, Jing. January 2007 (has links)
Thesis (M.S.)--State University of New York at Binghamton, Thomas J. Watson School of Engineering and Applied Science, Department of Systems Science and Industrial Engineering, 2007. / Includes bibliographical references.
|
| 619 |
Investigations on damage mechanics and life prediction of fine-pitch electronics in harsh environmentsIslam, Mohd Nokibul, LAll, Pradeep. January 2005 (has links) (PDF)
Dissertation (Ph.D.)--Auburn University, 2005. / Abstract. Vita. Includes bibliographic references.
|
| 620 |
Die stress characterization and interface delamination study in flip chip on laminate assembliesRahim, Md. Sayed Kaysar, Jaeger, Richard C. Suhling, J. C. January 2005 (has links) (PDF)
Dissertation (Ph.D.)--Auburn University, 2005. / Abstract. Vita. Includes bibliographic references.
|
Page generated in 0.0542 seconds