NDLTD Global ETD Search
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  • About
  • The Global ETD Search service is a free service for researchers to find electronic theses and dissertations. This service is provided by the Networked Digital Library of Theses and Dissertations.
    Our metadata is collected from universities around the world. If you manage a university/consortium/country archive and want to be added, details can be found on the NDLTD website.

Search results

Showing 571 to 580 of 1901 (0.053 seconds)

Spelling suggestions: "subject:"packaging"" "subject:"ackaging""

571

Compliant Wafer Level Package (CWLP)

Patel, Chirag Suryakant 05 1900 (has links)
No description available.
Electronic packaging
Semiconductor wafers
572

Modeling and simulation of planes in electronic packages

Na, Nanju 05 1900 (has links)
No description available.
Electronic packaging
Switching circuits
Electronic circuits
Electronic noise
573

Thermomechanical characterization of materials formicrominiaturized system board requirements

Bansal, Shubhra 08 1900 (has links)
No description available.
Printed circuits Materials
Materials Thermomechanical properties
Microelectronic packaging
574

Accurate, high speed predictive modeling of passive devices

Poddar, Ravi 05 1900 (has links)
No description available.
Electronic circuits
Electronic packaging
575

Predictive statistical analysis of embedded meander resistors via measurement of canonical building blocks

Carastro, Lawrence A. 05 1900 (has links)
No description available.
Electronic packaging
Integrated circuits Passivation
Analog-to-digital converters
576

Design and development of stress-engineered compliant interconnect in microelectronic packaging

Ma, Lunyu 08 1900 (has links)
No description available.
Mircoelectronic packaging
577

Fundamentals of area array solder interconnect yield

Kim, Chunho 12 1900 (has links)
No description available.
Solder and soldering
Electronic packaging Materials
578

Fixturing analysis and synthesis for flexible circuit board assembly

Chen, Ruijun 05 1900 (has links)
No description available.
Evaporation
579

Advanced encapsulation processing for low cost electronics assembly

Pascarella, Nathan William 12 1900 (has links)
No description available.
Electronic packaging
Multichip modules (Microelectronics)
Surface mounting (Electronics)
580

Mechanical behavior characterization of some new materials for high density interconnect substrates

Rao, Yang 12 1900 (has links)
No description available.
Electronic packaging
Electric connectors
Electronic contacts
Electronics Materials

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