Abstract This thesis is mainly aimed to the study the basic physical properties of different flux, and the combination with semiconductor packaging of 0.6mm Sn96.5/Ag3.0/Cu0.5 (SAC305) big solder ball, and 0.3mm Sn98.5/Ag1.0/Cu0.5 (SAC105) small solder ball. Big solder ball was proceeded with shear stress test, pull ball test, and tray drop test. However small solder ball was proceeded with shear stress test, pull ball test, zone shear solder balls test and board level drop test. After experiments, samples of different flux, the effect of solder strength and mechanical properties were received and discussed. And failure modes were observed by high-power microscope, SEM and OM. The experimental result shows that the flux doesn¡¦t have direct relationship with the point of welding strong and weak, the point of welding strong and weak is determined by the metal¡¦s characteristics. However, the less of residual flux is, the higher the solder balls shearing force as well as pulling force are. As for the more of residual more of flux, after aged processing, some solder balls have the phenomenon of missing from the IMC layer. And the difference of the residual flux will affect the various failure modes of zone shear solder balls. From board level drop test, the majority of failure modes is pad peeling at the corner of test board side for all test flux, and the remaining failure modes exhibit solder fractured and IMC layer broken. Therefore, the judgement of the residual flux is a very important key factor for the semiconductor packaging. It doesn¡¦t have the direct correlation with the reliability of final products. Keywords: Lead Free, Solder Ball, Flux, Semiconductor Packaging, Tests.

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With ever-increasing demands for high-speed data transmission and device capacity to handle various telecommunication data links, the high reliability of these transmission devices is expected for uninterrupted service. A typical optical communication system consists of transmitters in which laser diodes convert electrical signals into light signals, optical fibers with a few pumps transmitting and maintaining these light signals over long distances, and receivers in which photodiodes convert the light signals back into an electronic form. The efficiency of optoelectronic devices in a communication system, which include transmitters and receivers, plays the most important role in determining the quality and the bandwidth of a communication system. For transmitters, the efficiency is defined as the ratio of the light entering the optical fiber to the light generated by the laser diode. Therefore, the optical fiber should be aligned as precisely as possible with the laser diode to ensure the high efficiency. For high performance optoelectronic devices, box-type packages including the dual-in-line package (DIP) and butterfly package with fiber-solder-ferrule (FSF) are widely used. An optical fiber with a metallized end is soldered inside a ferrule tube to form the FSF. The FSF is joined on a u-channel mount in front of laser diode by laser welding. No matter where the fiber locates in the ferrule tube, the place for maximum coupling power can be dynamically measured and then the FSF is fixed. But, researches have shown that the redistribution of residual stress and the stress relaxation of creep phenomenon within the solder will push the fiber shift to the geometrical center of the ferrule and the shift reduces the coupling efficiency of laser module after temperature cycle testing. The efficiency is worse when the initial fiber eccentric offset increased. An optimum approach for reduction of the fiber alignment shift in laser module is to solder the fiber near to the center of the ferrule. A method for automating the FSF packaging process has been developed to fix the fiber within less than 20um of the center of the ferrule. This method makes use of CCD cameras as position sensors to locate the fiber, and compensates all the major sources of inaccuracy resulting from a typical CCD-based packaging system. The accuracy of the fiber position is highly improved from 80um by traditional packaging process to 20um shown in the experiments. Further work is underway to better the accuracy by compensating the minor sources of inaccuracy.

<p>The thesis is conducted to investigate how packaging is taken into consideration within the new product development process and in which stages of the new product development process packaging actually is taken into consideration. Further we want to investigate if packaging has increased in importance within the activities of the new product development process, and how organizations deal with standardization of packaging for international markets in the new product development process.</p><p>The purpose of this thesis is to investigate how packaging of convenience goods is an integrated part of the international new product development process.</p><p>We have chosen a qualitative approach. The study was conducted through in-depth interviews, face-to-face and by phone. The interviewees were selected through judgemental sampling. The sample included eight organi-zations producing convenience goods that are active on several markets.</p><p>It was found that packaging always has been of importance; however, it was found that packaging has increased in importance within concept development implying that packaging indirectly has increased in importance within the new product development process. Further, packaging is included in all stages in the process, but has its ma-jor significance in the concept development phase. International organizations need to consider the level of standardization throughout the process.</p>

No description available.

Thesis (M.S.)--Worcester Polytechnic Institute. / Keywords: packaging; micro electro mechanical systems; MEMS; electronics; die warpage; die bow; encapsulant; encapsulate; electrochemical migration; corrosion; wirebonds. Includes bibliographical references (p. 94-99).

Thesis (Ph. D.)--Hong Kong University of Science and Technology, 2003. / Includes bibliographical references. Also available in electronic version. Access restricted to campus users.

Thesis (M.S.M.E.)--University of South Florida, 2003. / Title from PDF of title page. Document formatted into pages; contains 87 pages. Includes bibliographical references.

The electromigration (EM) and chip-package interaction (CPI) reliability of flip chip packages with Cu pillar structures was investigated. First the EM-related characteristics of Cu pillars with solder tips were studied and compared with standard controlled collapse chip connection (C4) Pb-free solder joints. The simulation results revealed a significant reduction in the current crowding effect when C4 solder joints was replaced by Cu pillar structures. As a result, the current-induced Joule heating and local temperature gradients were reduced in the Cu pillar structure. This was followed by a study of the impact of the Cu pillar bumps on the mechanical reliability of low-k dielectrics. The CPI-induced crack driving force for delamination in the low-k interconnect structure was evaluated using a 3D sub-modeling technique. The energy release rate was found to increase significantly for packages with Cu pillar bumps compared with those with C4 Pb-free solder joints only. Structural optimization of Cu pillar bumps to improve the mechanical stability of packages with low-k chips was discussed. / text

Capital projects use work packaging to divide their projects' scope into manageable portions of work for planning and execution, all to achieve improved productivity and increased predictability. However, currently, no common industry standard for work packaging is widely and uniformly implemented within the North American capital projects industry. As documented by CII RT 272 Phase I (2009-2011), companies have been implementing a number of varied work packaging practices at different stages of the project lifecycle with emphasis on the construction phase. Due to the varied implementation, there is currently little evidence of the benefits of extending work packaging to the Front End Engineering Design (FEED) and the Detailed Engineering (DE) phases. To provide the best current evidence, this thesis describes new findings on Advanced Work Packaging (AWP) as an execution practice, with special emphasis on design activities. This research combines data collection methods such as interviews, observations and document review, as well as surveys. The reader will understand the current industry status on Advanced Work Packaging in terms of levels of implementation as well as evidence of benefits and implementation challenges across the project lifecycle. Documented benefits include productivity improvements on the order of 25% in the field, with corresponding reductions of 10% of total installed cost. Other significant benefits include improved safety, improved productivity, less rework, significant reduction in RFIs and increased stakeholder alignment. Documented AWP implementation challenges include lack of process formulization, persons’ resistance to change and lack of buy-in, stakeholders’ conflict of interest and working culture, incompatibility with some contractual scenarios as well as traditional change management practices. / text