Le recuit photonique est une technologie émergente basée sur la conversion instantanée del’énergie lumineuse absorbée par les nanoparticules (NPs) en chaleur. Dans ces travaux, il estdéployé sur des pistes d’interconnexions imprimées sur support souple par jet de matière, àpartir d’une encre de NPs d’argent (Ø=25nm).Une étude des paramètres du procédé a permis d’établir le lien entre ces derniers (énergie,fréquence) et la résistance carrée (120m!/ ) induite. Celui-ci a été confirmé grâce à unemodélisation thermique multicouches et au développement d’une instrumentation inéditemesurant, toutes les 4μs, les variations de la résistance pendant le recuit photonique (quelquesms). La stabilisation de la résistance corrélée avec les propriétés optiques du film est optimalepour une exposition de 2-3J/cm² induisant un échauffement à environ 200°C.L’analyse de la microstructure des films par diffraction des rayons X met en évidence le lienentre la croissance des cristallites et la résorption des défauts. La minimisation de la résistanceélectrique est corrélée à la croissance du collet entre les nanoparticules par diffusion atomiquede surface. De plus, une meilleure cohésion des NPs améliore la dureté par rapport au recuit àl’étuve.La résistance électrique de contact (200m!) entre les plots d’interconnexion d’une puce ensilicium et les pistes imprimées a été mesurée grâce à un montage dédié de mesure électriqueau nano-indendeur. Les forces à appliquer (300mN par bump) / Photonic sintering is an emerging technology based on the instantaneous conversion ofabsorbed light energy by nanoparticles (NPs) into heat. In this work, it is used oninterconnections printed on flexible substrates by inkjet printing of a metal silver nanoinkwith particle mean diameter of Ø=25nm.A process parameters study has allowed us to link them (energy, frequency) with theinduced sheet resistance (120m!/ ). This has been confirmed through thermal modeling ofthe multilayer system, and also by monitoring the resistance variations in-situ duringphotonic sintering (a few ms) using an innovative characterization tool, allowingmeasurements every 4 μs. The electrical resistance stabilization correlated with the opticalproperties of the film was found to be optimal for an exposition of 2-3J/cm², whichcorresponds to heating up to approximately 200°C.Films microstructure analysis with X-ray diffraction enlightens the link between crystallitescoarsening and defaults density reduction. The minimization of electrical resistivity iscorrelated with neck growth between nanoparticles trigged by surface atomic diffusion.Moreover, a stronger cohesion between NPs improves the mechanical hardness compared toclassical oven curing.The electrical contact resistance (200m!) between a silicon chip interconnection bumpand printed tracks is measured thanks to an in-house setting for electrical measurement withthe nanoindenter. The level of forces to apply (300mN per bump) is optimized and transferredto a thermocompression by industrial equipment. A set of prototypes are fabricated andconfirm the compatibility of these technologies with a future industrial integration.

<p>  </p> <p>Printed electronics (PE) is one of the fastest growing technologies in the 21^st century. Recent reports have shown that PE market will reach 4.9 billion by 2032. PE refers to additive deposition of materials to fabricate electrical circuits, interconnects, and devices. </p> <p>The quest for developing nondestructive processes that enables additive manufacturing of low-cost PEs on heat-sensitive substrates with novel functionalities has resulted in several recent developments in the field which includes investigation of selective and optical sintering processes such as photonic sintering and laser sintering, to name a few. Broadly, this dissertation is an effort to study these sintering technologies for additive manufacturing of bimodal (metal/metal, metal/inorganic, and metal/organic) printed material compositions.  </p> <p>In the first section, nondestructive sintering technologies is combined with chemical sintering to develop bimodal metallic conductive pastes for the fabrication of biodegradable and non-biodegradable printed devices for applications in food packaging and wireless smart drug delivery.</p> <p>Next, a process is developed via near-infrared (NIR) technology to enable soldering and mounting electrical components onto printed materials using low-temperature bimodal metal/organic solder pastes. The developed optimized process is used to fabricate a flexible printed hybrid device for remote assessment of the wound exudate absorption in dressings.</p> <p>Lastly, laser processing is used to fabricate an antibacterial bimodal silver containing glass ceramics coating directly on temperature-sensitive polymeric surgical meshes. The integrated bioceramic coating on the mesh exhibits long-lasting antibacterial properties against Gram-positive and Gram-negative strains of bacteria. </p> <p>The results of this dissertation will open a new route of research to fabricate low-cost devices with bimodal materials with applications in medical device, healthcare, and packaging industries. </p> <p><br></p>