This dissertation is concerned with loss and abandonment, and together with the practical component, titled Restitution, forms part of a Master of Fine Art degree submission. Both loss and abandonment can take many forms, from the straightforward deterioration, departure or removal of objects to the more complex deterioration of memory, responsibility and dignity. It seems though, that the question, “What has been lost?” is one that is always asked once it is too late. The loss becomes irretrievable and one is left only with fragments and traces. In Chapter 1 issues of liminality and the precariousness of being between states is addressed. Dignity of the ‘other’, in this case the deceased pauper, is interrogated especially with reference to complicity, forensic investigation and the forensic aesthetic. Chapter 2 outlines photographic representation, with attention given to posthumous portraiture, the punctum and memory in the service of permanence and authenticity. Chapter 3 considers the ambition and purpose of the artist through a critique centred on contemporary photographic artist, Sally Mann. Throughout the thesis and exhibition, I am concerned with loss as it relates physically to objects. Metaphorically, I investigate loss and abandonment in relation to dignity and responsibility. In so doing I view death as being the ultimate form of loss, as there is physical loss of the body, as one part of the whole that makes up ‘the person’, as well as the psychological and emotional loss that attends the passing of life. The delayed burial of the deceased therefore is seen to be evidence of abandonment at its extreme. I end by positioning my conclusion around a stop animation series in which I dug a grave and buried a pauper at Mayfield cemetery.

Fundamental research to implement the printed autonomous wireless sensor platform is studied in three aspects: fabrication method, material selection, and novel applications for autonomous sensing/communication. Additive fabrication processes, such as inkjet printing technology and electroless electroplating, are discussed and the additively created metal layers are characterized. Fundamentals for material characterization utilizing resonators are presented and electrical properties of flexible low-cost substrates like synthetic Teslin paper and Poly(methyl methacrylate) (PMMA) are characterized. Widely used flexible substrates for printing, such as Liquid Crystal Polymer (LCP) and Kapton (polyimide), are summarized and tabulated as well. Novel antenna-based applications for efficient and autonomous operation of wireless sensor system, such as an antenna on Artificial Magnetic Conductor (AMC) for wearable applications, an active beacon oscillator for Wireless Power Transfer (WPT), and a multiband RF energy harvester, are designed and their performances are experimentally verified. The printed RFID-enabled sensor topologies with/without RFID chip are discussed as a new sensor platform for autonomous wireless operation. Fully inkjet-printed via topology for system miniaturization and integration is proposed for the first time. Challenges, circuit modeling and experimental data are presented. Future and remaining work to implement the novel low-cost autonomous wireless sensor platform are also discussed.

Thesis (M.S.)--State University of New York at Binghamton, Thomas J. Watson School of Engineering and Applied Science, Department of Systems Science and Industrial Engineering, 2009. / Includes bibliographical references.

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The ultrasonic welding of Cu110, electrolytic tough pitch copper sheet to electroless plated laminate circuit board was experimentally investigated within the range of 20 kHz. The effects of machine parameters; energy, amplitude and pressure as well as material characteristics such as surface roughness, gauge, temper, and silver and gold plating schemes were compared through pull tests and analysis of microstructure. Evidence was discovered which attributes plastic deformation, mechanical interlocking, and acoustic softening to the mechanism of weld formation. It was further determined that ultrasonic welding of Cu110 sheet to silver immersion laminate circuit boards as means of electrical termination is a robust process. Therefore it was the goal of this thesis to understand the mechanism of ultrasonic welding and determine if ultrasonic welding to laminate circuit boards is an alternative to soldering electrical terminations.

As the drive continues to reduce the size of Printed Wiring Assemblies (PWAs), improve performance of electronic assemblies, and reduce costs of these products, reliable secondary (bottom) side reflow operations must be developed. Attaching Surface Mount Technology (SMT) components to the secondary side of a Printed Circuit Board (PCB) is accomplished by placing components on the PCB's secondary side and processing it through the reflow oven at this point. This board is then flipped over so that more components can be placed on the side that is facing up (primary side). The PCB must again be processed through the reflow oven. Large Integrated Circuit (IC) packages that are soldered to the secondary side fall off of the PCB during reflow of the primary side. Intuition may lead one to believe this is caused solely by weight, size, etc., but experienced personnel are not able to consistently predict which components will fail. The purpose of this work is to convey the necessary knowledge to explain and predict the behavior of components during Secondary Side Reflow (SSR). This thesis will ultimately present a method by which guidelines for SSR can be created. Currently, SSR is limited to small passive devices and small Integrated Circuit (IC) packages. It is anticipated that future PWA designs will require large ICs such as Quad Flat Packs (QFP) and Ball Grid Arrays (BGA) on the secondary side. A large variety of SMT components are available, but the focus of this research was directed towards large IC packages. Current manufacturing guidelines for such products do not exist and development of these are imperative if a costly trial and error approach is to be avoided. In an environment where product technology advancement and cost reduction are key to survival, industry must develop and understand this manufacturing process. Cost savings from SSR will be most directly realized with compressed product development cycles, reduced use of PCBs, components, and raw materials, and more efficient use of manufacturing capital and employees. These cost savings would be realized nearly immediately after a set of manufacturing guidelines is developed. / Graduation date: 2000