Printed lens antennas offer the possibility of realizing shaped beam patterns using no more complexity than is required for pencil beam patterns. Shaped beam patterns can be obtained by appropriately determining the complex transmission coefficient required for each cell (or element) of the printed lens, taking into account the varying feed field over the input surface of the lens. Certain ranges of transmission coefficient amplitude and phase are undesirable (eg. too low an amplitude implies a large reflection at the lens input surface). It would be preferable to constrain the range of values that the transmission coefficient can take as an integral part of the lens synthesis procedure, and thus the transmission coefficient itself needs to be the synthesis variable. In this thesis a synthesis technique for doing this is developed based on the method of generalized projections, modified to “operate” in the space of transmission coefficients. This makes it possible to immediately perceive what influence constraints on the actual transmission coefficients have on the possible radiation pattern performance. In addition, an approach that allows one to constrain the transmission coefficient to values that must be selected from an available database of transmission coefficients is incorporated into the synthesis technique.

In-vitro electronic devices are promising to dynamically monitor minute-changes in biological systems. Electronic devices based on conducting polymers such as poly(3,4- ethylenedioxythiophene) polystyrene sulfonate (PEDOT:PSS) provide suitable and attractive substrates for biointerfacing. The soft polymer surface acts as a cushion for the living systems to interface while electronically detecting their properties. However, to this date, most bioelectronics devices have been fabricated via multi-step lithography techniques, which do not allow for mass fabrication and hence high throughput biosensing. Inkjet printing presents an alternative to fabricate organic bioelectronic devices. Besides being low-cost, inkjet printing allows to fabricate several devices in a short time with flexible design patterns and minimal material waste. Here, using inkjet printing, we fabricated PEDOT:PSS based organic electrochemical transistors (OECTs) for biomembrane interfacing. We optimized the deposition of various inks (silver nanoparticles (AgNPs), PEDOT:PSS, and the dielectric SU-8) used during the fabrication of these devices. We characterized the electrical characteristics of all-printed OECTs with various geometries and identified the high-performing ones. Due to the flexibility of ink optimization and design patterns, these all inkjet-printed electronic devices provide an alternative for mass production of biointerfacing platforms.

Creating interactive prototypes can be a long and difficult process. It requires expertise in various fields. Prior work in developing interactive prototypes minimize time required to make a prototype, but generally sacrifice fidelity for fluidity. Advances in 3D printing create new opportunities to prototype with greater fidelity and fluidity. We investigate the use of several kinds of sensors, including IR photo interrupters, IR photo reflectors, push button switches, and potentiometers, to create interactive prototypes. We first design a library of 3D printable interaction components, buttons, sliders, and knobs using those sensors then we develop software to transform interaction events into events in computer programs. The combinations of interaction components and sensing devices are evaluated based on their durability and ability to be printed into prototypes and used as human-computer interface devices.

Yes / A type of telecommunication technology called an ultra-wideband (UWB) is used to provide a typical solution for short-range wireless communication due to large bandwidth and low power consumption in transmission and reception. Printed monopole antennas are considered as a preferred platform for implementing this technology because of its alluring characteristics such as light weight, low cost, ease of fabrication, integration capability with other systems, etc. Therefore, a compact-sized ultra-wideband (UWB) printed monopole antenna with improved gain and efficiency is presented in this article. Computer simulation technology microwave studio (CSTMWS) software is used to build and analyze the proposed antenna design technique. This broadband printed monopole antenna contains a jug-shaped radiator fed by a coplanar waveguide (CPW) technique. The designed UWB antenna is fabricated on a low-cost FR-4 substrate with relative permittivity of 4.3, loss tangent of 0.025, and a standard height of 1.6 mm, sized at 25 mm × 22 mm × 1.6 mm, suitable for wireless communication system. The designed UWB antenna works with maximum gain (peak gain of 4.1 dB) across the whole UWB spectrum of 3–11 GHz. The results are simulated, measured, and debated in detail. Different parametric studies based on numerical simulations are involved to arrive at the optimal design through monitoring the effects of adding cuts on the performance of the proposed antennas. Therefore, these parametric studies are optimized to achieve maximum antenna bandwidth with relatively best gain. The proposed patch antenna shape is like a jug with a handle that offers greater bandwidth, good gain, higher efficiency, and compact size.

The wastewater from the electroplating processes required for the production of printed circuit boards has a high heavy metal content. The regulatory agencies of both the Federal Government and the State of Florida set pretreatment limitations on the quantity of the hazardous heavy metal ions that may be discharged t o a receiving body of water or to a Publicly Owned Treatment Works. A number of treatment processes are available for the effective removal of these pollutants. The mechanism behind the more common processes are discussed in this paper. Many variables must be considered in the design of a wastewater pretreatment system. The more important variables are enumerated and the criteria to integrate these variables into the treatment selection process and ultimately into the design of the pretreatment system are covered in detail. Flow diagrams and equipment lists for the treatment processes selected are given as well as a breakdown of the total construction costs for this project.

Multifunctional composites have gained significant interest as they enable the integration of sensing and communication capabilities into structural, lightweight composites. Researchers have explored additive manufacturing processes for creating these structures through selective patterning of electrically conductive materials onto composites. Thus far, multifunctional composite performance has been limited by the conductivity of functional materials used, and the methods of integration have resulted in compromises to both structural and functional performance. Integration methods have also imposed limitations on part geometry due to an inability to adequately deposit conductive material over concave surfaces. Proposed methods of integrating functional devices within composites have been shown to negatively affect their mechanical performance. This work presents a novel method for integrating printed electronics onto the interior surfaces of closed, complex continuous fiber composite structures via the transfer of selectively printed conductive inks from additively manufactured sacrificial tooling to the composite surface. The process is demonstrated by creating multifunctional composites via embossing printed electronics onto structural composites without negatively affecting the mechanical performance of the structure. Additionally, this process expands the ability to pattern devices onto complex surfaces and demonstrates that the transferred functionality is well integrated (adhered) with the composite surface. The process is further validated through the successful completion of two separate case studies. The first is the integration of a functioning strain gauge onto an S-glass/epoxy composite, while a second process demonstration shows a composite surface featuring a band stop filter at the X-band, otherwise known as a frequency selective surface (FSS), to show the process' suitability for high performance, aerospace grade multifunctional composites. / Master of Science / Significant interest has been given in the past few decades to strong, lightweight materials for structural purposes. Among these materials, specific interest has been paid to fiber-reinforced composites, which are made of strong fibers and advanced resins. Recently, researchers have tried to use electrically conductive inks and 3D printing techniques to put antennas and other devices onto composites. These composites could possess additional functions beyond their structural purpose and are therefore called multifunctional composites. So far, the performance of multifunctional composites has been limited by the methods used to add additional functions. These methods often result in a weaker composite material and poor performance of the added devices. In this work, a new method for integrating devices onto complex-shaped composite structures is demonstrated. This is done by printing a mold for a composite, then putting a conductive ink onto the mold and transferring the ink to the composite surface. This process is demonstrated without weakening the composite. Additionally, this process allows researchers to put devices onto complex surfaces and demonstrates that the devices are secured to the composite surface. The process is used to make two separate devices and combine them with a composites surface. The first demonstration is the integration of a functioning strain gauge (used to measure a change in material dimension) onto a structural composite, while a second process demonstration shows a composite surface featuring an electromagnetic filter, otherwise known as a frequency selective surface (FSS), to show the process' suitability for high performance, aerospace grade multifunctional composites.

by Pang King Man. / Thesis (M.Phil.)--Chinese University of Hong Kong, 2003. / Includes bibliographical references (leaves 186-204). / Text in English; abstracts in English and Chinese. / by Pang King Man. / Acknowledgments --- p.i / Abstract --- p.ii / Content --- p.v / List of Figures --- p.xiii / List of Tables --- p.xvii / List of Plates --- p.xxii / Chapter 1. --- INTRODUCTION --- p.1 / Chapter 1.1 --- Printed circuit board manufacturing industry in Hong Kong --- p.1 / Chapter 1.1.1 --- Principal manufacturing processes of printed circuit board --- p.2 / Chapter 1.1.1.1 --- Cleaning and surface preparation --- p.3 / Chapter 1.1.1.2 --- Catalyst application and electroless plating --- p.3 / Chapter 1.1.1.3 --- Pattern printing and masking --- p.4 / Chapter 1.1.1.4 --- Electroplating --- p.4 / Chapter 1.1.1.5 --- Etching --- p.5 / Chapter 1.1.2 --- Characteristics of wastestreams from printed circuit board manufacturing --- p.5 / Chapter 1.1.2.1 --- Spent solvents --- p.6 / Chapter 1.1.2.2 --- Spent etchants --- p.8 / Chapter 1.1.2.3 --- Rinsewaters --- p.9 / Chapter 1.1.2.4 --- Air emission --- p.9 / Chapter 1.1.3 --- Environmental legislation relating to PCB manufacturing industry --- p.10 / Chapter 1.1.3.1 --- Water Pollution Control Ordinance (WPCO) --- p.10 / Chapter 1.1.3.2 --- Sewage Services (Sewage Charges) Regulation --- p.10 / Chapter 1.1.3.3 --- Waste Disposal (Chemical Waste) Regulation --- p.11 / Chapter 1.1.3.4 --- Air Pollution Control Ordinance (APCO) --- p.11 / Chapter 1.2 --- Chemical-specific approach against toxicity-based approach --- p.11 / Chapter 1.3 --- Toxicity identification evaluation --- p.13 / Chapter 1.3.1 --- Phase I: Toxicity characterization --- p.15 / Chapter 1.3.2 --- Phase II: Toxicity identification --- p.16 / Chapter 1.3.3 --- Phase III: Toxicity confirmation --- p.18 / Chapter 1.3.4 --- Toxicity identification evaluation on industrial effluents --- p.20 / Chapter 1.4 --- Toxicity tests --- p.21 / Chapter 1.4.1 --- Selection of organisms for bioassays --- p.22 / Chapter 1.4.2 --- Organisms used in TIE --- p.23 / Chapter 1.4.3 --- Organisms used in this study --- p.23 / Chapter 1.5 --- Ecotoxicological study of effluent from PCB manufacturing industry --- p.27 / Chapter 2. --- OBJECTIVES --- p.29 / Chapter 3. --- MATERIALS AND METHODS --- p.30 / Chapter 3.1 --- Source of samples --- p.30 / Chapter 3.2 --- Phase I - Toxicity characterization: Baseline toxicity test --- p.32 / Chapter 3.2.1 --- Microtox® test --- p.32 / Chapter 3.2.1.1 --- Sample preparation --- p.33 / Chapter 3.2.1.2 --- Procedures --- p.33 / Chapter 3.2.2 --- Survival test of a marine amphipod Hylae crassicornis --- p.35 / Chapter 3.2.2.1 --- Sample preparation --- p.38 / Chapter 3.2.2.2 --- Procedures --- p.38 / Chapter 3.3 --- Phase I - Toxicity characterization: Manipulations --- p.39 / Chapter 3.3.1 --- pH adjustment filtration test --- p.42 / Chapter 3.3.1.1 --- Sample preparation --- p.43 / Chapter 3.3.1.2 --- Procedures --- p.43 / Chapter 3.3.2 --- pH adjustment test --- p.44 / Chapter 3.3.2.1 --- Procedures --- p.44 / Chapter 3.3.3 --- pH adjustment aeration test --- p.44 / Chapter 3.3.3.1 --- Sample preparation --- p.45 / Chapter 3.3.3.2 --- Procedures --- p.45 / Chapter 3.3.4 --- pH adjustment C18 solid phase extraction (SPE) test --- p.46 / Chapter 3.3.4.1 --- Sample preparation --- p.46 / Chapter 3.3.4.2 --- Procedures --- p.47 / Chapter 3.3.5 --- Cation exchange test --- p.48 / Chapter 3.3.5.1 --- Sample preparation --- p.48 / Chapter 3.3.5.2 --- Procedures --- p.48 / Chapter 3.3.6 --- Anion exchange test --- p.49 / Chapter 3.3.6.1 --- Sample preparation --- p.49 / Chapter 3.3.6.2 --- Procedures --- p.50 / Chapter 3.4 --- Phase II - Toxicity identification --- p.50 / Chapter 3.4.1 --- Determination of total organic carbon (TOC)-TOC analyzer --- p.51 / Chapter 3.4.1.1 --- Principle --- p.51 / Chapter 3.4.1.2 --- Sample preparation --- p.52 / Chapter 3.4.2 --- Determination of metal ions-Inductively coupled plasma emission spectroscopy (ICP-ES) --- p.54 / Chapter 3.4.2.1 --- Principle --- p.54 / Chapter 3.4.2.2 --- Sample preparation --- p.56 / Chapter 3.4.3 --- Determination of metal ions-Atomic absorption spectroscopy (AAS) --- p.56 / Chapter 3.4.3.1 --- Principle --- p.56 / Chapter 3.4.3.2 --- Sample preparation --- p.58 / Chapter 3.4.4 --- Determination of anions - Ion chromatography (IC) --- p.58 / Chapter 3.4.4.1 --- Principle --- p.58 / Chapter 3.4.4.2 --- Sample preparation --- p.60 / Chapter 3.5 --- Phase III - Toxicity confirmation --- p.60 / Chapter 3.5.1 --- Chemicals preparation --- p.60 / Chapter 3.5.2 --- Mass balance test --- p.61 / Chapter 3.5.2.1 --- Procedures --- p.61 / Chapter 3.5.3 --- Spiking test --- p.61 / Chapter 3.5.3.1 --- Procedures --- p.62 / Chapter 4. --- RESULTS --- p.63 / Chapter 4.1 --- Chemical characteristics of the whole effluent samples --- p.63 / Chapter 4.2 --- Phase I - Toxicity characterization: Baseline toxicity test --- p.63 / Chapter 4.2.1 --- Baseline toxicity of whole effluent samples on the Microtox® test --- p.63 / Chapter 4.2.2 --- Baseline toxicity of whole effluent samples on the survival test of a marine amphipod Hyale crassicornis --- p.63 / Chapter 4.3 --- Phase I - Toxicity characterization --- p.67 / Chapter 4.3.1 --- Toxicity characterization of effluent samples using the Microtox® test --- p.67 / Chapter 4.3.1.1 --- Effect of manipulations on Sample El --- p.67 / Chapter 4.3.1.2 --- Effect of manipulations on Sample E2 --- p.72 / Chapter 4.3.1.3 --- Effect of manipulations on Sample E3 --- p.77 / Chapter 4.3.1.4 --- Effect of manipulations on Sample E4 --- p.80 / Chapter 4.3.1.5 --- Effect of manipulations on Sample E5 --- p.83 / Chapter 4.3.1.6 --- Effect of manipulations on Sample E6 --- p.86 / Chapter 4.3.2 --- Toxicity characterization of effluent samples using the survival test of amphipod Hyale crassicornis --- p.89 / Chapter 4.3.2.1 --- Effect of manipulations on Sample El --- p.89 / Chapter 4.3.2.2 --- Effect of manipulations on Sample E2 --- p.94 / Chapter 4.3.2.3 --- Effect of manipulations on Sample E3 --- p.99 / Chapter 4.3.2.4 --- Effect of manipulations on Sample E4 --- p.102 / Chapter 4.3.2.5 --- Effect of manipulations on Sample E5 --- p.102 / Chapter 4.3.2.6 --- Effect of manipulations on Sample E6 --- p.107 / Chapter 4.4 --- Phase II - Toxicity identification --- p.110 / Chapter 4.4.1 --- Chemical reduction on Sample El --- p.113 / Chapter 4.4.2 --- Chemical reduction on Sample E2 --- p.117 / Chapter 4.4.3 --- Chemical reduction on Sample E3 --- p.117 / Chapter 4.4.4 --- Chemical reduction on Sample E4 --- p.122 / Chapter 4.4.5 --- Chemical reduction on Sample E5 --- p.122 / Chapter 4.4.6 --- Chemical reduction on Sample E6 --- p.125 / Chapter 4.5 --- Phase III - Toxicity confirmation --- p.130 / Chapter 4.5.1 --- Mass balance and spiking tests on the Microtox® test --- p.130 / Chapter 4.5.1.1 --- Mass balance and spiking tests of Sample El on the Microtox® test --- p.131 / Chapter 4.5.1.2 --- Mass balance and spiking tests of Sample E2 on the Microtox® test --- p.131 / Chapter 4.5.1.3 --- Mass balance and spiking tests of Sample E3 on the Microtox® test --- p.133 / Chapter 4.5.1.4 --- Mass balance and spiking tests of Sample E4 on the Microtox® test --- p.135 / Chapter 4.5.1.5 --- Mass balance and spiking tests of Sample E5 on the Microtox® test --- p.138 / Chapter 4.5.1.6 --- Mass balance and spiking tests of Sample E6 on the Microtox® test --- p.140 / Chapter 4.5.2 --- Mass balance and spiking tests on the survival test of amphipod Hyale --- p.140 / Chapter 4.5.2.1 --- Mass balance and spiking tests of Sample El on the amphipod survival test --- p.142 / Chapter 4.5.2.2 --- Mass balance and spiking tests of Sample E2 on the amphipod survival test --- p.142 / Chapter 4.5.2.3 --- Mass balance and spiking tests of Sample E3 on the amphipod survival test --- p.144 / Chapter 4.5.2.4 --- Mass balance and spiking tests of Sample E4 on the amphipod survival test --- p.146 / Chapter 4.5.2.5 --- Mass balance and spiking tests of Sample E5 on the amphipod survival test --- p.149 / Chapter 4.5.2.6 --- Mass balance and spiking tests of Sample E6 on the amphipod survival test --- p.149 / Chapter 5. --- DISCUSSION --- p.153 / Chapter 5.1 --- Phase I - Toxicity characterization: Baseline toxicity test --- p.153 / Chapter 5.1.1 --- Baseline toxicity of whole effluent samples on the Microtox® test --- p.154 / Chapter 5.1.2 --- Baseline toxicity of whole effluent samples on the survival test of amphipod Hyale crassicornis --- p.155 / Chapter 5.2 --- Phase I - Toxicity characterization: Manipulations --- p.155 / Chapter 5.2.1 --- Effect of manipulations on the Microtox® test --- p.156 / Chapter 5.2.1.1 --- pH adjustment filtration test --- p.156 / Chapter 5.2.1.2 --- pH adjustment test --- p.158 / Chapter 5.2.1.3 --- pH adjustment aeration test --- p.159 / Chapter 5.2.1.4 --- pH adjustment C18 solid phase extraction (SPE) test --- p.159 / Chapter 5.2.1.5 --- Cation exchange test --- p.160 / Chapter 5.2.1.6 --- Anion exchange test --- p.160 / Chapter 5.2.1.7 --- Conclusion of the Phase I manipulations on the Microtox® test --- p.161 / Chapter 5.2.2 --- Effect of manipulations on the survival test of a marine amphipod Hyale crassicornis --- p.162 / Chapter 5.2.2.1 --- pH adjustment filtration test --- p.162 / Chapter 5.2.2.2 --- pH adjustment test --- p.162 / Chapter 5.2.2.3 --- pH adjustment aeration test --- p.163 / Chapter 5.2.2.4 --- pH adjustment C18 solid phase extraction (SPE) test --- p.163 / Chapter 5.2.2.5 --- Cation exchange test --- p.163 / Chapter 5.2.2.6 --- Anion exchange test --- p.164 / Chapter 5.2.2.7 --- Conclusion of the Phase I manipulations on the survival test of a marine amphipod Hyale crassicornis --- p.164 / Chapter 5.3 --- Phase II - Toxicity identification --- p.164 / Chapter 5.3.1 --- Chemical reduction on anions --- p.165 / Chapter 5.3.2 --- Chemical reduction on metal ions --- p.166 / Chapter 5.3.3 --- Conclusion of the Phase II toxicity identification --- p.166 / Chapter 5.4 --- Phase III - Toxicity confirmation --- p.167 / Chapter 5.4.1 --- Mass balance and spiking tests on the Microtox® test --- p.167 / Chapter 5.4.2 --- Mass balance and spiking tests on the survival test of amphipod Hyale crassicornis --- p.169 / Chapter 5.4.3 --- Conclusion of the Phase III toxicity confirmation --- p.170 / Chapter 5.4.4 --- Comparison between the results of the Microtox® test and survival test of amphipod Hyale crassicornis --- p.170 / Chapter 5.5 --- Comparison between the concentrations of the identified toxicant(s) in the PCB effluents with the technical memorandum on standards for effluent discharged --- p.172 / Chapter 5.6 --- Toxicity of the identified toxicant(s) in the PCB effluents --- p.175 / Chapter 5.6.1 --- Copper --- p.175 / Chapter 5.6.2 --- Chloride and sulfate --- p.177 / Chapter 5.7 --- Treatment technologies --- p.179 / Chapter 5.8 --- Recommendations --- p.183 / Chapter 6. --- CONCLUSIONS --- p.184 / Chapter 7. --- REFERENCES --- p.186

Electromagnetic compatibility remains an important topic in the design and manufacturing of printed circuit boards (PCBs). Compatibility of these devices with their surroundings is becoming increasingly difficult as a modern PCB can have hundreds or thousands of parts, operating on many layers, and all at high speed. One such part is a via and its clearance, or via hole, commonly required in multilayer circuits where vertical connections between layers are used. The via hole may be exposed to large electromagnetic fields within the PCB. Although electrically small, the via hole provides a pathway for the fields to excite the exterior, either directly or through coupling to adjacent structures. To quantify this process, the near fields and radiation of an excited via hole are analysed, and are the focus of this thesis. The near fields of the via hole are first decoupled into electric and magnetic fields of the 'static' type. In both cases a series solution for two regions, one outside, and one inside the layers is constructed. The coefficients of the terms of the series are chosen to best satisfy the boundary behaviour of the fields on the conducting surfaces and across the hole. The criteria for assessing quality of the solution is based on the least squares method (LSM). Linear equation systems for both models are derived, and as no numerical integration or discretisation is required, an efficient and robust implementation to find the near fields is developed. Transformation into the far field is then achieved through surface integration of relevant field quantities close to the via hole. The far fields are best viewed as that due to two dipoles, of the magnetic and electric type, with strength and orientation depending on how the via hole is excited. It is shown that the two dipole model is sufficient to find the radiation from a 1mm diameter via hole at a frequency up to 8 GHz. Of further interest is how the choice of via hole dimensions affects the dipole moments and the near fields solved earlier are a key to this understanding.

Over the last two decades, the assembly of printed circuit boards (PCB) has generated a huge amount of industrial activity. One of the major developments in PCB assembly was introduction of surface mount technology (SMT). SMT has displaced through-hole technology as a primary means of assembling PCB over the last decade. It has also made it easy to automate PCB assembly process. The component placement machine is probably the most important piece of manufacturing equipment on a surface mount assembly line. It is used for placing components reliably and accurately enough to meet the throughput requirements in a cost-effective manner. Apart from the fact that it is the most expensive equipment on the PCB manufacturing line, it is also often the bottleneck. There are a quite a few areas for improvements on the machine, one of them being component placement sequencing. With the number of components being placed on a PCB ranging in hundreds, a placement sequence which requires near minimum motion of the placement head can help optimize the throughput rates. This research develops an application using genetic algorithm (GA) to solve the component placement sequencing problem for a single headed placement machine. Six different methods were employed. The effects of two parameters which are critical to the execution of a GA were explored at different levels. The results obtained show that the one of the methods performs significantly better than the others. Also, the application developed in this research can be modified in accordance to the problems or machines seen in the industry to optimize the throughput rates. / Graduation date: 2004

For some decades, the assembly of printed circuit boards (PCB), had been thought to be an ordinary example of mass production systems. However, technological factors and competitive pressures have currently forced PCB manufacturers to deal with a very high mix, low volume production environment. In such an environment, setup changes happen very often, accounting for a large part of the production time. PCB assembly machines have a fixed number of component feeders which supply the components to be mounted. They can usually hold all the components for a specific board type in their feeder carrier but not for all board types in the production sequence. Therefore, the differences between boards in the sequence determines the number of component feeders which have to be replaced when changing board types. Consequently, for each PCB assembly line, production control of this process deals with two dominant problems: the determination for each manufacturing line of a mix resulting in larger similarity of boards and of a board sequence resulting in setup reduction. This has long been a difficult problem since as the number of boards and lines increase, the number of potential solutions increases exponentially. This research develops an approach for applying Genetic Algorithms (GA) to this problem. A mathematical model and a solution algorithm were developed for effectively determining the near-best set of printed circuit boards to be assigned to surface mount lines. The problem was formulated as a Linear Integer Programming model attempting to setup reduction and increase of machine utilization while considering manufacturing constraints. Three GA based heuristics were developed in order to search for a near optimal solution for the model. The effects of several crucial factors of GA on the performance of each heuristic for the problem were explored. The algorithm was then tested on two different problem structures, one with a known optimal solution and one with a real problem encountered in the industry. The results obtained show that the algorithm could be used by the industry to reduce setups and increase machine utilization in PCB assembly lines. / Graduation date: 1998