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Large Area Maskless Photopolymerization (LAMP) is a disruptive additive manufacturing technology developed in the Direct Digital Manufacturing Laboratory at Georgia Tech. Due to polymerization shrinkage during the layer-by-layer curing process, stresses are accumulated that can give rise to cracks and delaminations along the interfaces between adjacent layers. The objective of this doctoral dissertation is to investigate the mechanisms of stress evolution and cracking/delamination during the LAMP manufacturing process through theoretical modeling and experimental characterization methods. The evolving conversion degree in a layer was characterized through Fourier Transform Infrared Spectroscopy and this leads to a so-called print-through curve. The polymerization shrinkage strain in each exposed layer was calculated on the basis of the theoretical relationship between the volumetric shrinkage and the degree of conversion. Furthermore, the material’s elastic modulus, which also evolves with the degree of conversion, was characterized by three-point bending tests. With the degree of conversion, cure-dependent modulus and shrinkage strain as the three primary inputs, finite element modeling was conducted to dynamically simulate the layer-by-layer manufacturing process and to predict the process-induced stresses. To investigate the fracture process, Mode I and Mode II interlaminar fracture toughness of the LAMP-built laminates was characterized, using the double cantilever beam (DCB) test and the end notched flexure (ENF) test, respectively. In order to predict the crack initiation and propagation occurring in a LAMP-built part, a mixed-mode cohesive element model was developed. The Mode I and Mode II cohesive parameters, which are used to describe the bilinear constitutive behavior of the cohesive elements, were determined by matching the numerical load-deflection curves to the experimental ones obtained from the DCB tests and the ENF tests, respectively. Using this model, the fracture of a hollow-cylinder part was analyzed and the simulation results were compared with experiments. Finally, several possible strategies for mitigating the shrinkage related defects were investigated. Reducing the overall polymerization shrinkage, optimizing the print-through curve and delaying the gel point of resin composite were demonstrated to be effective in reducing stresses and cracks.

The manufacturing process of a photovoltaic Si wafer comprises of first a high temperature heating process to produce a Si ingot from polycrystalline Silicon, which is then cut into bricks and subsequently sawn into wafers using a wire saw. These processes create residual stresses both from the thermal gradient induced by solidification and from either the rolling-indenting or scratching-indenting processes caused by the type of wire saw used. The objective of this research is to study silicon wafer residual stress as a result of the typical industry manufacturing processes and by doing so, better understand the mechanical properties that lead to increased fracture. This thesis aims to quantify the amount of residual stress generated by the solidification/thermal gradient produced during the casting of Si ingots separately from the residual stress generated by the wire sawing process. Samples from industry are used to compare the effects of the manufacturing processes on residual stress in multi-crystalline silicon (mc-Si) wafers including the effects of fixed abrasive diamond wire sawing (DWS) vs. loose abrasive (LAWS) slurry wire sawing used in the wafering process. Near-infrared birefringence polariscopy and polarized micro-Raman spectroscopy are used to study wafer residual stresses within grains and at grain boundaries in mc-Si as a function of etch-depth. While near-infrared birefringence polariscopy allows for the measurement of full-field maximum shear stress, micro-Raman spectroscopy provides decomposition of the stress tensor into both principal and shear in-plane stress components. Consequently, regions of high tensile stress, which are detrimental to the mechanical integrity of the wafer, can be easily identified. In addition to the mechanical characterization, the residual stress produced by the thermal gradient/solidification process for multi-crystalline Si wafers was also correlated to electrical performance of mc-Si wafers using photoluminescence.

Fusion welding processes cause residual stress due to the uneven heat distribution produced by the moving welding torch. These residual stresses are characterised by a large tensile component in the welding direction. Due to the self-equilibrated nature of the residual stress, compressive ones are present in the far field next to the weld seam, which can cause different kind of distortion such as bending or buckling. Welding residual stress can be responsible of premature failure of the components, such as stress crack corrosion, buckling, and reduction of fatigue life. Localised rolling is a stress engineering technique that can be used to reduce the residual stress and distortion caused by welding. It induces plastic strain in the rolling direction, counteracting the plastic strain produced during welding. In this thesis three techniques were investigated, pre-weld rolling, post-weld rolling, and in situ rolling. These techniques have been seldom studied in the past, particularly pre-weld rolling; consequently the mechanisms are poorly understood. Finite element models allow stress and strain development during both welding and rolling processes to be better understood, providing an improved understanding of the mechanisms involved and aiding process development. A literature survey was done to find the state of the art of the computational welding mechanics simulations, stress management, and the residual stress measurement techniques, as well as the knowledge gaps such as, the thermal losses through the backing-bar in the thermal simulation, the frictional interaction in the rolling process, and the material properties of the steel used in the models. In the literature not many models that investigate the management of welding residual stress were found. After this, the general considerations and assumptions for the welding thermal mechanical models presented in this thesis were discussed. The effect of different backing-bar conditions, as well as different material properties where investigated. Both influenced the residual stress profile to varying degrees. In particular, temperature dependent heat loss to the backing-bar was necessary to capture the improved heat loss near the weld. The distortion predicted by the model was investigated to determine whether it was due to bending or buckling phenomena. Lastly, the temperature distribution and residual stress predictions were validated against thermocouple and neutron diffraction measurements conducted by Coules et al. [1–3]. Pre-weld rolling was the first of the three rolling methods considered, in which rolling is applied to the plates before performing GMA butt-welds. The principle behind this technique consisted in inducing tensile residual stress in the weld region before welding; therefore, it is similar to mechanically tensioning the weld, which can significantly reduce the residual stress and distortion. However, there was no significant change in the tensile residual stresses. On the other hand, it was possible to achieve a small reduction in the distortion, when the plates were rolled on the opposite surface to the weld; rolling in this way induced distortion in the opposite direction to the distortion induced by welding, reducing the magnitude of the latter. These results were compared with experiments conducted by Coules et al. [1,4]. A subsequent investigation combined pre-weld rolling with post-weld heating. With this additional process the residual stress and distortion were significantly reduced, and flatter residual stress profile was achieved. The post-weld rolling and in situ rolling techniques were discussed afterwards. In the post-weld rolling models, rolling was applied after the weldment was cooled to room temperature. In in situ rolling the roller was applied on top of the weld bead at some distance behind the torch, while it was still hot. The principle behind these techniques consisted in applying positive plastic strain to the weld bead region by a roller, counteracting the negative plastic strains produced in the welding process. Two roller profiles were investigated, namely, grooved, and double flat rollers. The post-weld rolling on top of the weld bead models, which used the grooved roller, showed good agreement against experimental results, producing a large reduction of the residual stress and distortion. Some discrepancies were present when the weld toes were rolled with the dual flat roller. The former roller was more efficient for reducing residual stress and distortion. The influence of different friction coefficients (between the roller and weldment, and between the backing-bar and the weldment), were investigated. It showed significant dependency on the residual stress distribution when high rolling loads were used. The frictional interaction constrained the contact area inducing more compressive stress in the core of the weld bead; therefore it produced more tensile residual stress in the surface of the weldment. Additionally, the influence of rolling parameters on the through-thickness residual stress variation was investigated. Low loads only influence the residual stress near the surface, while high loads affected the material through the entire thickness. When the dual flat roller was used to roll next to the weld bead, significant compressive residual stress was induce in the weld bead; however, the residual stress reduction was very sensitive to the contact of the roller to the weld toes; therefore, when rolling a weld bead that varies in shape along the weld, the residual stress reduction is not uniform and varies along the length. On the other hand, the in situ rolling did not produced significant residual stress or distortion reduction in all the cases analysed. The rolling occurred when the material was still hot and the residual stress was subsequently formed as the material cooled to room temperature. Numerical modelling was a very useful tool for understanding the development of stress and plastic strain during the welding and rolling processes.

The aim of this project was to, based on a given idea, develop and evaluate a method for measuring residual stress in thin PVD coatings. AlCrN was deposited, by PVD, on thin circular samples of stainless steel foil and the radius of the emerged curvature was measured using an optical profilometer. From the radius data the residual stress in the coating of each sample was calculated. The foil samples examined were of two different thicknesses, 0.3 mm and 0.5 mm. With the parameters of the project the foils of 0.3 mm were found most suitable. Furthermore, the method was compared to an already established method where depositions are made on thicker substrates, which are then ground to an appropriate thickness. A correlation factor between the two methods was calculated and found to be 0.91 ± 0.28. Finally, the possibility of adapting the method in running production was investigated. Cost and time analyses were conducted and both supported the applicability of the method. / Projektets syfte var att utveckla och utvärdera en metod för att mäta restspänningar i tunna PVD-beläggningar utifrån en redan befintlig idé. Tunna cirkulära prover av rostfritt stål belades med AlCrN genom PVD och radien på den utböjning som uppstod mättes med en optisk profilometer. Restspänningen bestämdes sedan utifrån den uppmätta radien. Folier av två olika tjocklekar, 0,3 mm och 0,5 mm, utvärderades. Med de processparametrar som användes i projektet visades att folien med tjocklek 0,3 mm var den bäst lämpade. Metoden jämfördes även med en etablerad metod där tjocka substrat beläggs och sedan slipas ned till lämplig tjocklek. En korrelationsfaktor som relaterar de två metoderna bestämdes till 0,91 ± 0,28. Slutligen undersöktes möjligheterna att använda metoden i löpande produktion. Kostnads- och tidsanalyser utfördes och resultaten stödjer metodens användbarhet.

Biological tissue differs from other materials in many ways. Perhaps the most crucial difference is its ability to grow. Growth processes may give rise to stresses that exist in a body in the absence of applied loads and these are known as residual stresses. Residual stress is present in many biological systems and can have important consequences on the mechanical response of a body. Mathematical models of biological structures must therefore be able to capture accurately the effects of differential growth and residual stress, since greater understanding of the roles of these phenomena may have applications in many fields. In addition to residual stresses, biological structures often have a complex morphology. The theory of 3-D elasticity is analytically tractable in modelling mechanical properties in simple geometries such as a cylinder. On the other hand, rod theory is well-suited for geometrically-complex deformations, but is unable to account for residual stress. In this thesis, we aim to develop a map between the two frameworks. Firstly, we use 3-D elasticity to determine effective mechanical properties of a growing cylinder and map them into an effective rod. Secondly, we consider a growing filament embedded in an elastic foundation. Here, we estimate the degree of transverse reinforcement the foundation confers on the filament in terms of its material properties. Finally, to gain a greater understanding of the role of residual stress in biological structures, we consider a case study: the chameleon's tongue. In particular we consider the role of residual stress and anisotropy in aiding the rapid projection of the tongue during prey capture. We construct a mechanical model of the tongue and use it to investigate a proposed mechanism of projection by means of an energy balance argument.

Sn-based solder alloys are extensively used in electronic devices to form interconnects between different components to provide mechanical support and electrical path. The formation of a reliable solder interconnects fundamentally relies on the metallurgic reaction between the molten solder and solid pad metallization in reflowing. The resultant IMC layer at the solder/pad metallization interface can grow continuously during service or aging at an elevated temperature, uplifting the proportion of IMCs in the entire solder joint. However, the essential mechanical properties of interfacial IMC (i.e. Cu6Sn5, Cu3Sn) layers, such as Young s modulus and hardness, are drastically different in comparison with Sn-based solder and substrate. Therefore, the increasing fraction of interfacial IMCs in the solder joint can lead to significant deformation incompatibility under exterior load, which becomes an important reliability concern in the uses of solder joints for electronic interconnects. In the past decades, extensive research works were implemented and reported regarding the growth of interfacial IMC layers and its effect on the mechanical integrity of solder joints. But, the following fundamental issues in terms of mechanical and microstructural evolution in the uses of solder joints still remain unclear, demanding further research to elaborate: (1) The protrusion of IMCs: Though the growth of interfacial IMC layers along the diffusion direction in solder joints were studied extensively, the growth of IMCs perpendicular to the diffusion direction were reported in only a few papers without any further detailed investigation. This phenomena can crucially govern the long-term reliability of solder interconnects, in particular, in the applications that require a robust microstructural integrity from a solder joint. (2) Fracture behaviour of interfacial IMC layers: The fracture behaviour of interfacial IMC layers is a vital factor in determining the failure mechanism of solder joints, but this was scarcely investigated due to numerous challenges to enable a potential in-situ micro-scale tests. It is therefore highly imperative to carry out such study in order to reveal the fracture behaviour of interfacial IMC layers which can eventually provide better understanding of the influence of interfacial IMC layers on the mechanical integrity of solder joints. (3) Volume shrinkage: The volume shrinkage (or solder joint collapse) induced by the growth of interfacial IMC layers was frequently ascribed as one of the main causes of the degradation of mechanical reliability during aging due to the potentially resulted voids and residual stress at the solder/substrate interface. However, very few experimental works on the characterisation of such type of volume shrinkage can be found in literatures, primarily due to the difficulties of observing the small dimensional changes that can be encountered in the course of IMCs growth. (4) Residual stress: The residual stress within solder joints is another key factor that contributes to the failure of solder joints under external loads. However, the stress evolution in solder joints as aging progresses and the potential correlation between the residual stress and the growth of interfacial IMC layers is yet to be fully understood, as stress/strain status can fundamentally alter the course of total failure of a solder joint. (5) Crack initiation and propagation in solder joints: Modelling on the mechanical behaviour of solder joints is often undertaken primarily on the stress distribution within solder joints, for instance, under a given external loading. But there is lack of utilising numerical analysis to simulate the crack initiation and propagation within solder joints, thus the effect of interfacial IMC layers on the fracture behaviour of the solder joints can be elaborated in further details. In this thesis, the growth of interfacial IMCs in parallel and perpendicular to the interdiffusion direction in the Sn99Cu1/Cu solder joints after aging was investigated and followed by observation with SEM, with an intention of correlating the growth of IMCs along these two directions with aging durations based on the measured thickness of IMC layer and height of perpendicular IMCs. The mechanism of the protrusion of IMCs and the mutual effect between the growth of IMCs along these two directions was also discussed. The tensile fracture behaviour of interfacial Cu6Sn5 and Cu3Sn layers at the Sn99Cu1/Cu interface was characterised by implementing cantilever bending tests on micro Cu6Sn5 and Cu3Sn pillars prepared by focused ion beam (FIB). The fracture stress and strain were evaluated by finite element modelling using Abaqus. The tensile fracture mechanism of both Cu6Sn5 and Cu3Sn can then be proposed and discussed based on the observed fracture surface of the micro IMC pillars. The volume shrinkage of solder joints induced by the growth of interfacial IMC layers in parallel to the interdiffusion direction in solder joint was also studied by specifically designed specimens, to enable the collapse of the solder joint to be estimated by surface profiling with Zygo Newview after increased durations of aging. Finite element modelling was also carried out to understand the residual stress potentially induced due to the volume shrinkage. The volume shrinkage in solder joints is likely to be subjected to the constraint from both the attached solder and substrate, which can lead to the build-up of residual stress at the solder/Cu interface. Depth-controlled nanoindentation tests were therefore carried out in the Sn99Cu1 solder, interfacial Cu6Sn5 layer, Cu3Sn layer and Cu with Vickers indenter after aging. The residual stress was then evaluated in the correlation with aging durations, different interlayers and the locations in the solder joint. Finally, finite element models incorporated with factors that may contribute to the failure of solder joints, including microstructure of solder joints, residual stress and the fracture of interfacial IMC, were built using Abaqus to reveal the effect of these factors on the fracture behaviour of solder joints under applied load. The effect of growth of IMC layer during aging on the fracture behaviour was then discussed to provide a better understanding of the degradation of mechanical integrity of solder joints due to aging. The results from this thesis can facilitate the understanding of the influence of interfacial IMC layers on the mechanical behaviour of solder joints due to long-term exposure to high temperatures.

The objectives of this research are to measure residual stress in both unblasted and sandblasted mild steel specimens by using three different techniques: X-ray diffraction (XRD), strain-gage hole drilling (SGHD), and electronic speckle pattern interferometry (ESPI) hole drilling, and to validate the new ESPI hole drilling method by comparing its measurement results to those produced by the SGHD method. Both the XRD and SGHD methods were selected because they are accurate and well-verified approaches for residual stress measurements. The ESPI hole drilling technique is a new technology developed based on the SGHD technique, without the use of strain gage. This technique is incorporated into a new product referred to as the PRISM system, manufactured by Hytec, Incorporated, in Los Alamos, New Mexico. Each method samples a different volume of material at different depths into the surface. XRD method is especially different compared to the other two methods, since XRD only measures stresses at a depth very close to the surface (virtually zero depth). For this reason, no direct comparisons can be made between XRD and SGHD, as well as between XRD and ESPI hole drilling. Therefore, direct comparisons can only be made between SGHD and ESPI hole drilling methods.