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Nanoscale resistive switching memory devices: a reviewSlesazeck, Stefan, Mikolajick, Thomas 10 November 2022 (has links)
In this review the different concepts of nanoscale resistive switching memory devices are described and classified according to their I–V behaviour and the underlying physical switching mechanisms. By means of the most important representative devices, the current state of electrical performance characteristics is illuminated in-depth. Moreover, the ability of resistive switching devices to be integrated into state-of-the-art CMOS circuits under the additional consideration with a suitable selector device for memory array operation is assessed. From this analysis, and by factoring in the maturity of the different concepts, a ranking methodology for application of the nanoscale resistive switching memory devices in the memory landscape is derived. Finally, the suitability of the different device concepts for beyond pure memory applications, such as brain inspired and neuromorphic computational or logic in memory applications that strive to overcome the vanNeumann bottleneck, is discussed.
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Intégration 3D de dispositifs mémoires résistives complémentaires dans le back end of line du CMOS / 3D integration of complementary resistive switching devices in CMOS back end of lineLabalette, Marina 09 May 2018 (has links)
La gestion, la manipulation et le stockage de données sont aujourd’hui de réels challenges. Pour supporter cette réalité, le besoin de technologies mémoires plus efficaces, moins énergivores, moins coûteuses à fabriquer et plus denses que les technologies actuelles s’intensifie. Parmi les technologies mémoires émergentes se trouve la technologie mémoire résistive, dans laquelle l’information est stockée sous forme de résistance électrique au sein d’une couche d’oxyde entre deux électrodes conductrices. Le plus gros frein à l’émergence de tels dispositifs mémoires résistives en matrices passives à deux terminaux est l’existence d’importants courants de fuites (ou sneak paths) venant perturber l’adressage individuel de chaque point de la matrice. Les dispositifs complementary resistive switching (CRS), consistant en deux dispositifs OxRRAM agencés dos à dos, constituent une solution performante à ces courants de fuites et sont facilement intégrables dans le back-end-of-line (BEOL) de la technologie CMOS. Cette thèse a permis d’apporter la preuve de concept de la fabrication et de l’intégration de dispositifs CRS de façon 3D monolithique dans le BEOL du CMOS. / In our digital era, management, manipulation and data storage are real challenges. To support this reality the need for more efficient, less energy and money consuming memory technologies is drastically increasing. Among those emerging memory technologies we find the oxide resistive memory technology (OxRRAM), where the information is stored as the electrical resistance of a switching oxide in sandwich between two metallic electrodes. Resistive memories are really interested if used inside passive memory matrix. However the main drawback of this architecture remains related to sneak path currents occurring when addressing any point in the passive matrix. To face this problem complementary resistive switching devices (CRS), consisting in two OxRRAM back to back, have been proposed as efficient and costless BEOL CMOS compatible solution. This thesis brought the proof of concept of fabrication and 3D monolithic integration of CRS devices in CMOS BEOL.
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