The latest generation of fighter aircraft utilizes a 270Vdc power system [1]. Such high voltage DC power systems are difficult to protect with conventional circuit breakers because the current does not automatically go to zero twice per cycle during a fault like it does in an AC power system and thus arcing of the contacts is a problem. Solid state power controllers (SSPCs) are the solid state equivalent of a circuit breaker that do not arc and which can respond more rapidly to a fault than a mechanical breaker [2]. Present SSPCs are limited to lower voltages and currents by the available power semiconductors [8,9]. This dissertation presents design and experimental results for a SSPC that utilizes SiC power JFETs for the SSPC power switch to extend SSPC capability to higher voltages and currents in a space that is smaller than what is practically achievable with a Si power switch. The research started with the thermal analysis of the SSPCs power switch, which will guide the development of a SiC JFET multi-chip power module to be fabricated by Solid State Devices Inc. (SSDI) using JFETs from SiCED and/or Semisouth LLC. Multiple multi-chip power modules will be paralleled to make the SSPC switch. Fabricated devices were evaluated thermally both statically and dynamically and electrically both statically and dynamically. In addition to the SiC module research a detailed design of the high voltage SSPC control circuit capable of operating at 200andamp;ordm;C was completed including detailed analysis, modeling and simulations, detailed schematic diagrams and detailed drawings. Finally breadboards of selected control circuits were fabricated and tested to verify simulation results. Methods for testing SiC JFET devices under transient thermal conditions unique to the SSPC application was also developed.

Parmi les nitrures III-V, le matériau InGaN a été intensément étudié depuis les années 2000 pour des applications photovoltaïques, en particulier pour des cellules multi-jonctions, grâce à son large gap modulable pouvant couvrir quasiment tout le spectre solaire. On pourrait alors atteindre de hauts rendements tout en assurant de bas coûts. Cependant, l’un des problèmes de l’InGaN est l’absence de substrat accordé en maille provoquant une grande densité de défauts et limitant ainsi les performances des composants. Nous avons donc étudié la faisabilité de cellules solaires simples jonctions à base d’InGaN sur des substrats alternatifs comme le silicium et le verre afin de baisser les coûts et d’avoir de larges applications. Afin d’adapter l’InGaN sur ces substrats alternatifs, nous avons utilisé une couche tampon en ZnO. Ce travail a été réalisé dans le cadre du projet ANR NewPVonGlass. Plus particulièrement, dans ce projet, mon travail avait pour objectifs de réaliser des caractérisations électriques et optiques des matériaux et des composants. Les deux premières parties de cette thèse introduisent le matériau InGaN et l’effet photovoltaïque. Les techniques de caractérisation utilisées sont expliquées dans le troisième chapitre. Ensuite, les résultats obtenus lors de la caractérisation cristalline du matériau InGaN sont présentés en fonction du substrat, de la concentration d’indium et de l’épaisseur de la couche. Puis, la cinquième partie développe les caractérisations des premières cellules à base d’InGaN sur saphir. Enfin, dans le dernier chapitre, des simulations de cellules solaires à base d’InGaN ont été réalisées. Le modèle développé nous a permis d’optimiser la structure et le dopage du composant et de déterminer les paramètres critiques. Nous montrons donc, dans ce travail, le développement d’une cellule solaire à base d’InGaN : des caractérisations des matériaux de base à celles des cellules solaires, en passant par la modélisation. / Among III-V nitrides, the InGaN material has intensively been studied since the year 2000 for photovoltaic applications, in particular for multi-junction solar cells, thanks to its large tunable band gap covering almost the entire solar spectrum. Then, it will be possible to reach high efficiency and low cost. However, one of the problems of InGaN material is the absence of lattice-matched substrate leading to high defect density which limits device performances. We have thus studied the feasibility of single junction InGaN based solar cells on alternative substrate such as silicon and glass in order to lower the price and to benefit from their wide application fields. To adapt InGaN material on these new substrates, we have utilized ZnO buffer layer. This work has been carried out within the framework of the ANR project NewPVonGlass. More particularly, in this project, I was in charge of the electrical and optical characterizations of the materials and devices. In the two first parts of this manuscript, the InGaN material and the photovoltaic effect are introduced. Then, the characterization techniques are explained in the third chapter. In the fourth part, the results obtained during crystalline characterization of the InGaN materials are presented depending on the substrate, the indium percentage and the InGaN layer thickness. Then, the fifth chapter presents the first InGaN-based solar cell characteristics on sapphire substrate. Finally, in the last part, simulations of InGaN-based solar cell have been performed. The developed model was able to optimize the structure and to determine the critical parameters. Thus, we have shown in this work the development of an InGaN-based solar cell from the base material characterizations to the device tests, through modeling.

Interest in wide bandgap semiconductors such as silicon carbide (SiC), gallium nitride (GaN), gallium oxide (Ga 2 O 3 ) and diamond has increased due to their ability to deliver high power, high switching frequency and low loss electronic devices for power conversion applications. To meet these requirements, semiconductor material defects, introduced during growth and fabrication, must be minimized. Otherwise, theoretical limits of operation cannot be achieved. In this dissertation, the non-ideal current- voltage (IV) behavior of GaN-based Schottky diodes is discussed first. Here, a new model is developed to explain better the temperature dependent performance typically associated with a multi-Gaussian distribution of barrier heights at the metal-semiconductor interface [Section 3.1]. Application of this model gives researches a means of understanding not only the effective barrier distribution at the MS interface but also its voltage dependence. With this information, the consequence that material growth and device fabrication methods have on the electrical characteristics can be better understood. To show its applicability, the new model is applied to Ru/GaN Schottky diodes annealed at increasing temperature under normal laboratory air, revealing that the origin of excess reverse leakage current is attributed to the low-side inhomogeneous barrier distribution tail [Section 3.2]. Secondly, challenges encountered during MOCVD growth of low-doped GaN drift layers for high-voltage operation are discussed with focus given to ongoing research characterizing deep-level defect incorporation by deep level transient spectroscopy (DLTS) and deep level optical spectroscopy (DLOS) [Section 3.3 and 3.4]. It is shown that simply increasing TMGa so that high growth rates (>4 µm/hr) can be achieved will cause the free carrier concentration and the electron mobilities in grown drift layers to decrease. Upon examination of the deep-level defect concentrations, it is found that this is likely caused by an increase in 4 deep level defects states located at E C - 2.30, 2.70, 2.90 and 3.20 eV. Finally, samples where the ammonia molar flow rate is increased while ensuring growth rate is kept at 2 µm/hr, the concentrations of the deep levels located at 0.62, 2.60, and 2.82 eV below the conduction band can be effectively lowered. This accomplishment marks an exciting new means by which the intrinsic impurity concentration in MOCVD-grown GaN films can be reduced so that >20 kV capable devices could be achieved. / Doctor of Philosophy / We constantly rely on electronics to help assist us in our everyday lives. However, to ensure functionality we require that they minimize the amount of energy lost through heat during operation. One contribution to this inefficiency is incurred during electrical power conversion. Examples of power conversion include converting from the 120 V wall outlet to the 5 V charging voltage used by cellphones or converting the fluctuating voltage from a solar panel (due to varying sun exposure) to the 120 V AC power found in a typical household. Electrical circuits can be simply designed to accomplish these conversions; however, consideration to every component must be given to ensure high efficiency. A popular example of an electrical power conversion circuit is one that switches the input voltage on and off at high rates and smooths the output with an inductor/capacitor network. A good analogy of this process is trying to create a small stream of water from a fire hydrant which can either be off or on at full power. Here we can use a small cup but turning the fire hydrant on and trying to fill the cup will destroy it. However, if the fire hydrant is pulsed on and off at very short intervals (1 µs), its possible to fill the cup without damaging it or having it overflow. Now, under ideal circumstances if a small hole is poked in the bottom of the cup and the interval of the fire hydrant is timed correctly, a small low power stream of water is created without overflowing the cup and wasting water. In this analogy, a devices capable of switching the stream of water on and off very fast would need to be implemented. In electrical power conversion circuits this device is typically a transistor and diode network created from a semiconducting material. Here, similar to the fire hydrant analogy, a switch would need to be capable of holding off the immense power when in the off position and not impeding the powerful flow when in the on position. The theoretical limit of these two characteristics is dependent on the material properties of the switch where typically used semiconductors include silicon (Si), silicon carbide (SiC), or gallium nitride (GaN). Currently, GaN is considered to be a superior option over Si or SiC to make the power semiconductor switching device, however research is still required to remove non-ideal behavior that ultimately effects power conversion efficiency. In this work, we first examine the spurious behavior in GaN-based Schottky diodes and effectively create a new model to describe the observed behavior. Next, we fabricated Ru/GaN Schottky diodes annealed at different temperatures and applied the model to explain the room-temperature electrical characteristics. Finally, we grew GaN under different conditions (varying TMGa and ammonia) so that quantum characteristics, which have been shown to affect the overall ability of the device, could be measured.

Parmi les nitrures III-V, le matériau InGaN a été intensément étudié depuis les années 2000 pour des applications photovoltaïques, en particulier pour des cellules multi-jonctions, grâce à son large gap modulable pouvant couvrir quasiment tout le spectre solaire. On pourrait alors atteindre de hauts rendements tout en assurant de bas coûts. Cependant, l'un des problèmes de l'InGaN est l'absence de substrat accordé en maille provoquant une grande densité de défauts et limitant ainsi les performances des composants. Nous avons donc étudié la faisabilité de cellules solaires simples jonctions à base d'InGaN sur des substrats alternatifs comme le silicium et le verre afin de baisser les coûts et d'avoir de larges applications. Afin d'adapter l'InGaN sur ces substrats alternatifs, nous avons utilisé une couche tampon en ZnO. Ce travail a été réalisé dans le cadre du projet ANR NewPVonGlass. Plus particulièrement, dans ce projet, mon travail avait pour objectifs de réaliser des caractérisations électriques et optiques des matériaux et des composants. Les deux premières parties de cette thèse introduisent le matériau InGaN et l'effet photovoltaïque. Les techniques de caractérisation utilisées sont expliquées dans le troisième chapitre. Ensuite, les résultats obtenus lors de la caractérisation cristalline du matériau InGaN sont présentés en fonction du substrat, de la concentration d'indium et de l'épaisseur de la couche. Puis, la cinquième partie développe les caractérisations des premières cellules à base d'InGaN sur saphir. Enfin, dans le dernier chapitre, des simulations de cellules solaires à base d'InGaN ont été réalisées. Le modèle développé nous a permis d'optimiser la structure et le dopage du composant et de déterminer les paramètres critiques. Nous montrons donc, dans ce travail, le développement d'une cellule solaire à base d'InGaN : des caractérisations des matériaux de base à celles des cellules solaires, en passant par la modélisation.