Global ETD Search

11	HDL slicing for verification and test Vedula, Vivekananda Murthy 28 August 2008 (has links) Not available / text Semiconductors--Design and construction Semiconductors--Testing Semiconductors--Computer-aided design
12	Device design and fabrication of InGaP/GaAsSb/GaAs DHBTs Cheung, Chi-chuen, Cecil., 張志泉. January 2003 (has links) published_or_final_version / abstract / toc / Electrical and Electronic Engineering / Master / Master of Philosophy
13	Design, synthesis, and characterization of monomeric group 2 element Bis(alkoxide) compounds ; Part II, Synthesis and characterization of some group 2 element imidophosphonate compounds Moreno, Debra Ann 08 1900 (has links) No description available. Alkoxides Organometallic compounds Synthesis
14	Development and characterization of advanced electron beam resists Agrawal, Ankur 05 1900 (has links) No description available. Lithography, Electron beam Masks (Electronics) Semiconductors Design and construction
15	Heterogeneous integration and the exploitation of strain in MBE growth : engineered substrates Shen, Jeng-Jung 05 1900 (has links) No description available. Semiconductors Design and construction Inhomogeneous materials Molecular beam epitaxy
16	Scheduling setup changes on bottleneck facilities in semiconductor manufacturing Duwayri, Zaid 01 April 2001 (has links) No description available. Production scheduling Engineering Industrial Engineering
17	A cost benefit analysis of cycle time reduction in semiconductor manufacturing Nazzal, Dima 01 April 2001 (has links) No description available. Cost effectiveness Engineering Industrial Engineering
18	Ion implant tool throughput optimization for semiconductor manufacturing Lo, Raymond W. 01 January 2003 (has links) No description available. Electrical and Computer Engineering Engineering
19	RAPID SOLIDIFICATION PROCESSING OF INDIUM GALLIUM ANTIMONIDE ALLOYS Kumta, Prashant Nagesh, 1960- January 1987 (has links) Solidification from the melt is an essential step in nearly all conventional processes to produce bulk materials for industrial applications. Rapid quenching from the liquid state at cooling rates of 102 to 106K/s or higher has developed into a new technology for processing novel materials. InxGa1 - xSb a ternary III-V compound semiconductor was synthesized by using the rapid spinning cup (RSC) technique. Several compositions of these alloys were batched and cast into ingots in evacuated sealed quartz tubes. These ingots were then melted and ejected onto a rapidly rotating copper disk. This resulted in the generation of flakes or powders depending on the rpm of the disk. Microstructural characterization of the flakes and powders was performed using XRD, SEM and TEM. Efforts were also made to measure the bulk resistivity of the annealed flakes to see the effect of annealing on ordering of the phases.
20	Investigation of Ultratrace Metallic and Organic Contaminants in Semiconductor Processing Environments Xu, Fei, 1971- 05 1900 (has links) Detection of ultratrace levels of metallic ion impurities in hydrofluoric acid solutions and alkaline hydrogen peroxide solution was demonstrated using a silicon-based sensing electrode. The sensor's operation principle is based on direct measurements of the silicon open-circuit potential shift generated by the interaction between metallic ions and the silicon-based sensing surface. The new sensor can have practical applications in the on-line monitoring of microelectronic chemical processing. The detection of Ag+ content in KODAK waste water was carried out successfully by this novel sensor. Trace levels of organic impurities in the hydrofluoric acid solutions and in the cleanroom air were characterized by multiple internal reflection infrared spectroscopy (MIRIS) using an organics probe prepared directly from a regular silicon wafer. Contamination (Technology) metallic ion impurities silicon-based sensing electrode

Search results