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  • About
  • The Global ETD Search service is a free service for researchers to find electronic theses and dissertations. This service is provided by the Networked Digital Library of Theses and Dissertations.
    Our metadata is collected from universities around the world. If you manage a university/consortium/country archive and want to be added, details can be found on the NDLTD website.

Search results

Showing 51 to 60 of 118 (0.084 seconds)

Spelling suggestions: "subject:"folder anda solder"" "subject:"folder ando solder""

51

Implementation and qualification of a prototype tester for reflow soldering process compatability evaluation of surface mount technology components

Wong, Anthony Yin-bong 23 June 2011 (has links)
Not available / text
Surface mount technology
Solder and soldering
52

Fundamentals of area array solder interconnect yield

Kim, Chunho 12 1900 (has links)
No description available.
Solder and soldering
Electronic packaging Materials
53

Thermo-mechanical reliability of the VSPA package solder joints

Murphy, R. Sean 12 1900 (has links)
No description available.
Solder and soldering Testing
Electronic packaging Reliability
Electronic packaging Testing
54

Thermal cycling and rate-dependent stress relaxation behavior of solders

Woodmansee, Michael W. 08 1900 (has links)
No description available.
Deformations (Mechanics)
Solder and soldering Testing
Materials Mechanical properties
55

Analysis of lead free tin-silver-copper and tin-lead solder wetting reactions

Anson, Scott J. January 2007 (has links)
Thesis (Ph. D.)--State University of New York at Binghamton, Dept. of Systems Science and Industrial Engineering, 2007. / Includes bibliographical references.
56

Mechanical properties and microstructure invesitigation of SN-AG-CU lead free solder for electronic package applications

Wang, Qing, Johnson, R. Wayne, Gale, W. F. January 2005 (has links) (PDF)
Dissertation (Ph.D.)--Auburn University, 2005. / Abstract. Vita. Includes bibliographic references.
57

PBGA reliability of lead free solder balls assembled with tin lead solder paste for harsh environment electronics

Mitchell, Charles Clayton, January 2006 (has links) (PDF)
Thesis(M.S.)--Auburn University, 2006. / Abstract. Vita. Includes bibliographic references.
58

Monitoring and control system for hot air solder leveling process /

Schuh, Amy Jeanne, January 1991 (has links)
Report (M.S.)--Virginia Polytechnic Institute and State University. M.S. 1991. / Vita. Abstract. Includes bibliographical references (leaf 105). Also available via the Internet.
59

Development of convective reflow-projection moire warpage measurement system and prediction of solder bump reliability on board assemblies affected by warpage

Tan, Wei. January 2008 (has links)
Thesis (Ph. D.)--Mechanical Engineering, Georgia Institute of Technology, 2008. / Committee Chair: Dr. Ume, I. Charles; Committee Member: Dr. Book, Wayne; Committee Member: Dr. Kim, Yeong; Committee Member: Dr. Pan, Jiahui; Committee Member: Dr. Sitaraman, Suresh; Committee Member: Dr. Wu, C. F. Jeff.
60

Soldering in magnesium high pressure die casting and its preservation by surface engineering

Tang, Caixian. January 2007 (has links)
Thesis (PhD) - Swinburne University of Technology, Industrial Research Institute Swinburne - 2007. / [A thesis submitted] for the degree of Doctor of Philosophy, Industrial Research Institute, Swinburne University of Technology - 2007. Typescript. Includes bibliographical references (p. 154-167).

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