Thesis--Auburn University, 2008. / Abstract. Vita. Includes bibliographical references (leaves 159-167).

Thesis (M.S.)--State University of New York at Binghamton, Program of Materials Science and Engineering, 2007. / Includes bibliographical references.

Thesis (M.S.)--California Polytechnic State University, 2008. / Major professor: Albert Liddicoat, Ph.D. "Presented to the faculty of California Polytechnic State University, San Luis Obispo." "In partial fulfillment of the requirements for the degree [of] Master of Science in Electrical Engineering." "June 2008." Includes bibliographical references (leaves 70-73). Also available online. Also available on microfiche (2 sheets).

Thesis (M.S.)--University of Michigan, 1981.

Thesis (M.S.)--University of Michigan, 1981.

Thesis (Ph. D.)--University of Texas at Austin, 1999. / Vita. Includes bibliographical references (leaves 110-112). Available also in a digital version from Dissertation Abstracts.

Thesis (M.Sc.)--City University of Hong Kong, 2005. / At head of title: City University of Hong Kong, Department of Physics and Materials Science, Master of Science in materials engineering & nanotechnology dissertation. Title from title screen (viewed on Sept. 4, 2006) Includes bibliographical references.

Thesis (Ph. D.)--State University of New York at Binghamton, Thomas J. Watson School of Engineering and Applied Science, Department of Systems Science and Industrial Engineering, 2007. / Includes bibliographical references.

Embedded active and passive devices has been increasingly used by in order to integrate more functions inside the same or smaller size device and to meet the need for better electrical performance of the component assemblies. Solder joints have been used in the electronic industry as both structural and electrical interconnections between electronic packages and printed circuit boards (PCB). When solder joints are under thermal cyclic loading, mismatch in coefficients of thermal expansion (CTE) between the printed circuit boards and the solder balls creates thermal strains and stresses on the joints, which may finally result in cracking. Consequently, the mechanical interconnection is lost, leading to electrical failures which in turn causes malfunction of the circuit or whole system. When a die is embedded into a substrate, Young's modulus of the die is larger than one of the core of the substrate and the CTEs of the die is smaller than those of the substrate. As a result, mismatch in coefficients of thermal expansions (CTE) between the substrate with the embedded device and the solder balls may increase. In the present study, finite element method (FEM) is employed to find out the stress and strain distribution of ball grid array(BGA) solders under thermal cycling. The ANAND model for viscoplasticity is employed for this purpose.

Solder joints serve as both mechanical and electrical connections between elements in a package. They are subjected to shear strains generated as a result of the different behaviors of the elements in the package (tension and compression) due to the differences in coefficients of thermal expansion during service conditions. Some of the causes of solder joint failures are due to the following: Vibration: small rapid displacements of parts of the assembly. This is not necessarily an issue with electronic components but larger parts like automobiles. Humidity: the package being exposed to water or ionic species can undergo corrosion if an electrical bias exists resulting in electrical opens or electrical shorts if the corrosion products are electrically conductive. Thermal Aging: this occurs during the lifetime of the solder interconnects, the package can be exposed to high ambient temperature or high dissipated heat during use. The micro-structure of the solder joint becomes more coarse and brittle. Mechanical Shock: the package undergoes shock during a short term exposure to high loads. Thermo-mechanical fatigue: this type of failure arises as a result of the solder joints going through cyclic strains, due to different coefficients of thermal expansion of individual components in the package during service. The most prevalent long-term reliability issues that can cause interconnect failure are thermal aging and thermo-mechanical fatigue. This study aims to evaluate the reliability of solder joints using finite element method, considering solder joint failure due to thermo-mechanical fatigue. Three variations of the BGA (Ball Grid Array) package are evaluated using the finite element analysis. The SAC305 series lead (pb) free alloy of 96.5% tin, 3% silver, and 0.5% copper is employed for this study.